DE69318487T2 - Halbleiterlaservorrichtung, optische Vorrichtung und Herstellungsverfahren - Google Patents

Halbleiterlaservorrichtung, optische Vorrichtung und Herstellungsverfahren

Info

Publication number
DE69318487T2
DE69318487T2 DE69318487T DE69318487T DE69318487T2 DE 69318487 T2 DE69318487 T2 DE 69318487T2 DE 69318487 T DE69318487 T DE 69318487T DE 69318487 T DE69318487 T DE 69318487T DE 69318487 T2 DE69318487 T2 DE 69318487T2
Authority
DE
Germany
Prior art keywords
manufacturing
semiconductor laser
optical device
laser device
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69318487T
Other languages
English (en)
Other versions
DE69318487D1 (de
Inventor
Teruhiro Shiono
Hisahito Ogawa
Kazuhisa Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4211069A external-priority patent/JP2871320B2/ja
Priority claimed from JP4211070A external-priority patent/JP2768154B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69318487D1 publication Critical patent/DE69318487D1/de
Publication of DE69318487T2 publication Critical patent/DE69318487T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1861—Reflection gratings characterised by their structure, e.g. step profile, contours of substrate or grooves, pitch variations, materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1876—Diffractive Fresnel lenses; Zone plates; Kinoforms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1876—Diffractive Fresnel lenses; Zone plates; Kinoforms
    • G02B5/188—Plurality of such optical elements formed in or on a supporting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/14—External cavity lasers
    • H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/08—Construction or shape of optical resonators or components thereof
    • H01S3/081—Construction or shape of optical resonators or components thereof comprising three or more reflectors
    • H01S3/0811—Construction or shape of optical resonators or components thereof comprising three or more reflectors incorporating a dispersive element, e.g. a prism for wavelength selection
    • H01S3/0812—Construction or shape of optical resonators or components thereof comprising three or more reflectors incorporating a dispersive element, e.g. a prism for wavelength selection using a diffraction grating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/065—Mode locking; Mode suppression; Mode selection ; Self pulsating
    • H01S5/0651—Mode control
    • H01S5/0653—Mode suppression, e.g. specific multimode
    • H01S5/0654—Single longitudinal mode emission
DE69318487T 1992-08-07 1993-08-04 Halbleiterlaservorrichtung, optische Vorrichtung und Herstellungsverfahren Expired - Fee Related DE69318487T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4211069A JP2871320B2 (ja) 1992-08-07 1992-08-07 半導体レーザデバイス
JP4211070A JP2768154B2 (ja) 1992-08-07 1992-08-07 光学デバイスとその製造方法

Publications (2)

Publication Number Publication Date
DE69318487D1 DE69318487D1 (de) 1998-06-18
DE69318487T2 true DE69318487T2 (de) 1998-12-24

Family

ID=26518414

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69318487T Expired - Fee Related DE69318487T2 (de) 1992-08-07 1993-08-04 Halbleiterlaservorrichtung, optische Vorrichtung und Herstellungsverfahren

Country Status (3)

Country Link
US (1) US5373519A (de)
EP (1) EP0582958B1 (de)
DE (1) DE69318487T2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0709938B1 (de) * 1994-10-31 2002-01-16 Matsushita Electric Industrial Co., Ltd Vorrichtung zur Wellenleiterkopplung, Vorrichtung zur Strahlbündelung, und Gerät für optische Platten
IT1281360B1 (it) * 1995-09-26 1998-02-18 Fiat Ricerche Sistema di illuminazione a microtelescopio integrato in una lastra trasparente
DE69605265T2 (de) * 1995-09-26 2000-05-31 Fiat Ricerche Beleuchtungssystem mit integriertem Mikroteleskop in einer durchsichtigen Platte
US6324149B1 (en) * 1997-05-27 2001-11-27 Ricoh Company, Ltd. Optical-pick-up device achieving accurate positioning of objective lens and solid-immersion lens and method of forming same
JP3248526B2 (ja) * 1998-09-11 2002-01-21 キヤノン株式会社 回折光学素子及びそれを有した光学系
US6674709B1 (en) * 1999-04-23 2004-01-06 Matsushita Electric Industrial Co., Ltd. Optical head apparatus
US6483635B1 (en) * 2000-06-07 2002-11-19 Cirrex Corp. Apparatus for light amplification
US20020050519A1 (en) 2000-10-26 2002-05-02 Oliva Guido M. Laser module for reading optical codes
DE60021580T2 (de) * 2000-10-26 2006-05-24 Datalogic S.P.A., Lippo Di Calderara Di Reno Optische Vorrichtung zum Aussenden/Detektieren eines Lichtsignals und Schutz-/Isolationsgehäuse für eine Lichtquelle
KR100438701B1 (ko) * 2001-09-17 2004-07-05 삼성전자주식회사 호환형 광픽업 및 그 광축을 맞추기 위한 조정방법
US7061949B1 (en) * 2002-08-16 2006-06-13 Jds Uniphase Corporation Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth
JP2004288674A (ja) * 2003-03-19 2004-10-14 Fuji Xerox Co Ltd 面発光型半導体レーザおよびそれを用いた光通信システム
US20050190811A1 (en) * 2004-02-26 2005-09-01 Gruhlke Russell W. External cavity laser and method for selectively emitting light based on wavelength using aberration-corrected focusing diffractive optical element
US7901870B1 (en) 2004-05-12 2011-03-08 Cirrex Systems Llc Adjusting optical properties of optical thin films
EP1622205A3 (de) * 2004-07-29 2006-02-08 Schott AG Gehäuse für elektronische Bauteile, die kodierte optische Signale senden und/oder empfangen.
US7565084B1 (en) 2004-09-15 2009-07-21 Wach Michael L Robustly stabilizing laser systems
US7450623B2 (en) * 2005-04-12 2008-11-11 Eric G. Johnson Wavelength locked laser including integrated wavelength selecting total internal reflection (TIR) structure
HUE051418T2 (hu) * 2011-06-10 2021-03-01 Schott Ag Átvezetés
CN102570248B (zh) * 2011-09-28 2014-05-07 北京国科世纪激光技术有限公司 光路调节模块及激光器
CN103368069A (zh) * 2012-03-30 2013-10-23 福州高意通讯有限公司 一种降低高阶模的激光器结构
US9390926B2 (en) * 2013-03-11 2016-07-12 Applied Materials, Inc. Process sheet resistance uniformity improvement using multiple melt laser exposures
US10054720B2 (en) * 2015-02-02 2018-08-21 Apple Inc. Fresnel lens barrier rings
JP2019160859A (ja) * 2018-03-08 2019-09-19 豊田合成株式会社 発光装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861692A (ja) * 1981-10-07 1983-04-12 Kokusai Denshin Denwa Co Ltd <Kdd> 半導体レ−ザ装置
JPS60185922A (ja) * 1984-03-06 1985-09-21 Asahi Optical Co Ltd 半導体レ−ザ用光学系
US4763334A (en) * 1985-01-30 1988-08-09 Ricoh Company, Ltd. Laser beam emitting apparatus
CA1258906A (en) * 1985-04-22 1989-08-29 Hiroshi Oinoue Semiconductor laser apparatus for optical head
JPS6338272A (ja) * 1986-08-04 1988-02-18 Omron Tateisi Electronics Co 光半導体装置
US4873697A (en) * 1986-09-29 1989-10-10 Siemens Aktiengesellschaft Narrowband laser transmitter having an external resonator from which the output power can be taken
JPS63164033A (ja) * 1986-12-26 1988-07-07 Matsushita Electric Ind Co Ltd 光ピツクアツプ装置
JPH01157585A (ja) * 1987-12-15 1989-06-20 Omron Tateisi Electron Co 半導体レーザ装置
US4934784A (en) * 1989-03-20 1990-06-19 Kaptron, Inc. Hybrid active devices coupled to fiber via spherical reflectors
JPH03116992A (ja) * 1989-09-29 1991-05-17 Toshiba Corp 半導体レーザ装置
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Also Published As

Publication number Publication date
US5373519A (en) 1994-12-13
EP0582958A3 (en) 1994-07-27
DE69318487D1 (de) 1998-06-18
EP0582958A2 (de) 1994-02-16
EP0582958B1 (de) 1998-05-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee