DE69313911D1 - Verbindungswerkzeug mit Diamantkopf und dessen Herstellungsverfahren - Google Patents

Verbindungswerkzeug mit Diamantkopf und dessen Herstellungsverfahren

Info

Publication number
DE69313911D1
DE69313911D1 DE69313911T DE69313911T DE69313911D1 DE 69313911 D1 DE69313911 D1 DE 69313911D1 DE 69313911 T DE69313911 T DE 69313911T DE 69313911 T DE69313911 T DE 69313911T DE 69313911 D1 DE69313911 D1 DE 69313911D1
Authority
DE
Germany
Prior art keywords
manufacturing process
connection tool
diamond head
diamond
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69313911T
Other languages
English (en)
Other versions
DE69313911T2 (de
Inventor
Keiichiro Tanabe
Toshiya Takahashi
Akihiko Ikegaya
Naoji Fujimori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10481092A external-priority patent/JP3189372B2/ja
Priority claimed from JP4104809A external-priority patent/JPH05299477A/ja
Priority claimed from JP4104811A external-priority patent/JPH05299479A/ja
Priority claimed from JP04109955A external-priority patent/JP3077376B2/ja
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of DE69313911D1 publication Critical patent/DE69313911D1/de
Application granted granted Critical
Publication of DE69313911T2 publication Critical patent/DE69313911T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B23K20/025—Bonding tips therefor
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/5001—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with carbon or carbonisable materials
    • C04B41/5002—Diamond
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals
DE69313911T 1992-04-23 1993-04-22 Verbindungswerkzeug mit Diamantkopf und dessen Herstellungsverfahren Expired - Fee Related DE69313911T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP10481092A JP3189372B2 (ja) 1992-04-23 1992-04-23 ボンディングツールおよびその製造方法
JP4104809A JPH05299477A (ja) 1992-04-23 1992-04-23 ボンディングツール
JP4104811A JPH05299479A (ja) 1992-04-23 1992-04-23 ボンディングツールおよびその製造方法
JP04109955A JP3077376B2 (ja) 1992-04-28 1992-04-28 ボンディングツールおよびその製造方法

Publications (2)

Publication Number Publication Date
DE69313911D1 true DE69313911D1 (de) 1997-10-23
DE69313911T2 DE69313911T2 (de) 1998-04-30

Family

ID=27469258

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69313911T Expired - Fee Related DE69313911T2 (de) 1992-04-23 1993-04-22 Verbindungswerkzeug mit Diamantkopf und dessen Herstellungsverfahren

Country Status (4)

Country Link
US (2) US5370299A (de)
EP (1) EP0567124B1 (de)
KR (1) KR0133165B1 (de)
DE (1) DE69313911T2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3166919B2 (ja) * 1993-10-29 2001-05-14 ウンアクシス バルツェルス アクチェンゲゼルシャフト 被覆体とこの被覆体を製造する方法およびその使用
GB2287897B (en) * 1994-03-31 1996-10-09 Sumitomo Electric Industries A high strength bonding tool and a process for the production of the same
JP3675577B2 (ja) * 1995-07-05 2005-07-27 日本特殊陶業株式会社 ダイヤモンド被覆物品の製造方法
EP0771604A1 (de) * 1995-10-27 1997-05-07 Arnold Neracher Schweissverfahren
KR100445275B1 (ko) * 1996-05-27 2004-10-14 스미토모덴키고교가부시키가이샤 공구팁및그공구팁을구비한접합공구및그접합공구의제어방법
GB9616043D0 (en) * 1996-07-31 1996-09-11 De Beers Ind Diamond Diamond
US5931368A (en) * 1997-03-28 1999-08-03 Kulicke And Soffa Investments, Inc Long life bonding tool
US7389905B2 (en) * 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
US20060261132A1 (en) * 1999-02-25 2006-11-23 Reiber Steven F Low range bonding tool
US20070131661A1 (en) * 1999-02-25 2007-06-14 Reiber Steven F Solder ball placement system
US20080197172A1 (en) * 1999-02-25 2008-08-21 Reiber Steven F Bonding Tool
US20060071050A1 (en) * 1999-02-25 2006-04-06 Reiber Steven F Multi-head tab bonding tool
FR2800657B1 (fr) * 1999-11-09 2002-12-06 Services S A G Dispositif d'assemblage par thermocompression pour la connexion d'un fil sur un circuit integre
US6605352B1 (en) * 2000-01-06 2003-08-12 Saint-Gobain Ceramics & Plastics, Inc. Corrosion and erosion resistant thin film diamond coating and applications therefor
JP3509709B2 (ja) 2000-07-19 2004-03-22 株式会社村田製作所 圧電薄膜共振子及び圧電薄膜共振子の製造方法
US6840424B2 (en) * 2002-10-08 2005-01-11 Chien-Min Sung Compression bonding tools and associated bonding methods
US20060169744A1 (en) * 2005-02-01 2006-08-03 Pace, Incorporated Soldering tip with wear-and corrosion resistant coating
US20070085085A1 (en) * 2005-08-08 2007-04-19 Reiber Steven F Dissipative pick and place tools for light wire and LED displays
JP5704994B2 (ja) * 2011-03-31 2015-04-22 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 半導体接合装置
US9194189B2 (en) 2011-09-19 2015-11-24 Baker Hughes Incorporated Methods of forming a cutting element for an earth-boring tool, a related cutting element, and an earth-boring tool including such a cutting element
US8870051B2 (en) * 2012-05-03 2014-10-28 International Business Machines Corporation Flip chip assembly apparatus employing a warpage-suppressor assembly
WO2016018935A1 (en) * 2014-07-29 2016-02-04 Us Synthetic Corporation Porous composite particulate material and methods for making and using the same
TWI641440B (zh) * 2017-04-20 2018-11-21 中國砂輪企業股份有限公司 Line tool
DE102019134727A1 (de) * 2019-06-12 2020-12-17 Friedrich-Alexander-Universität Erlangen-Nürnberg Schweißelektrode und Verwendung der Schweißelektrode
WO2021061191A1 (en) * 2019-09-26 2021-04-01 Worldwide Machinery, Ltd Backing material for welding
KR102542224B1 (ko) * 2021-05-21 2023-06-12 스테코 주식회사 Pcd 일체형 본딩툴 및 그 제조방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0032437A1 (de) * 1980-01-16 1981-07-22 American Coldset Corporation Thermokompressionsverbindungswerkzeug
US4900628A (en) * 1986-07-23 1990-02-13 Sumitomo Electric Industries, Ltd. Gaseous phase synthesized diamond and method for synthesizing same
DE3706340A1 (de) * 1987-02-27 1988-09-08 Winter & Sohn Ernst Verfahren zum auftragen einer verschleissschutzschicht und danach hergestelltes erzeugnis
JPH0779958B2 (ja) * 1987-05-08 1995-08-30 住友電気工業株式会社 大型ダイヤモンドの合成方法
JPH0744203B2 (ja) * 1987-06-26 1995-05-15 松下電器産業株式会社 ボンデイングツ−ル
DE3868451D1 (de) * 1987-07-29 1992-03-26 Sumitomo Electric Industries Verfahren zur verbindung eines sinterkoerpers aus kubischem bornitrid.
JPH025541A (ja) * 1988-06-24 1990-01-10 Asahi Daiyamondo Kogyo Kk ボンディングツールの製造方法
JPH0766930B2 (ja) * 1989-02-27 1995-07-19 住友電気工業株式会社 ボンディングツール
DE69018220T2 (de) * 1989-12-20 1995-07-27 Sumitomo Electric Industries Verbindungswerkzeug.
JP2520971B2 (ja) * 1990-05-18 1996-07-31 住友電気工業株式会社 ボンディングツ―ル
US5126206A (en) * 1990-03-20 1992-06-30 Diamonex, Incorporated Diamond-on-a-substrate for electronic applications
EP0449571B1 (de) * 1990-03-30 1995-08-30 Sumitomo Electric Industries, Ltd. Polykristallines Diamantwerkzeug und Verfahren für seine Herstellung
US5264071A (en) * 1990-06-13 1993-11-23 General Electric Company Free standing diamond sheet and method and apparatus for making same
JP2938552B2 (ja) * 1990-10-17 1999-08-23 富士通株式会社 コーティング膜の製造方法およびコーティング膜の製造装置
DE69117140T2 (de) * 1990-11-22 1996-07-04 Sumitomo Electric Industries Polykristallines Dimantwerkzeug und Verfahren für seine Herstellung
US5213248A (en) * 1992-01-10 1993-05-25 Norton Company Bonding tool and its fabrication

Also Published As

Publication number Publication date
EP0567124A3 (de) 1993-12-08
US5370299A (en) 1994-12-06
EP0567124B1 (de) 1997-09-17
EP0567124A2 (de) 1993-10-27
US5516027A (en) 1996-05-14
KR940006224A (ko) 1994-03-23
KR0133165B1 (ko) 1998-04-16
DE69313911T2 (de) 1998-04-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: GROSSE, BOCKHORNI, SCHUMACHER, 81476 MUENCHEN

8328 Change in the person/name/address of the agent

Representative=s name: GROSSE, SCHUMACHER, KNAUER, VON HIRSCHHAUSEN, 8033

8339 Ceased/non-payment of the annual fee