DE69312814T2 - Fehlerkompensationsverfahren zum Glätten einer Fläche einer durchsichtigen Platte - Google Patents

Fehlerkompensationsverfahren zum Glätten einer Fläche einer durchsichtigen Platte

Info

Publication number
DE69312814T2
DE69312814T2 DE69312814T DE69312814T DE69312814T2 DE 69312814 T2 DE69312814 T2 DE 69312814T2 DE 69312814 T DE69312814 T DE 69312814T DE 69312814 T DE69312814 T DE 69312814T DE 69312814 T2 DE69312814 T2 DE 69312814T2
Authority
DE
Germany
Prior art keywords
transparent plate
laser beam
excimer laser
defect
arf excimer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69312814T
Other languages
German (de)
English (en)
Other versions
DE69312814D1 (de
Inventor
Osamu Miyazaki
Syunji Nakai
Kazuya Yoshimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4173339A external-priority patent/JP2786377B2/ja
Priority claimed from JP4233948A external-priority patent/JP2804203B2/ja
Priority claimed from JP5011191A external-priority patent/JPH06130341A/ja
Application filed by Sharp Corp filed Critical Sharp Corp
Application granted granted Critical
Publication of DE69312814D1 publication Critical patent/DE69312814D1/de
Publication of DE69312814T2 publication Critical patent/DE69312814T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
DE69312814T 1992-06-30 1993-05-20 Fehlerkompensationsverfahren zum Glätten einer Fläche einer durchsichtigen Platte Expired - Fee Related DE69312814T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP4173339A JP2786377B2 (ja) 1992-06-30 1992-06-30 透明板表面の欠陥修正方法
JP23395092 1992-09-01
JP4233948A JP2804203B2 (ja) 1992-09-01 1992-09-01 液晶表示装置の欠陥修正方法
JP5011191A JPH06130341A (ja) 1992-09-01 1993-01-26 表示装置の欠陥修正方法

Publications (2)

Publication Number Publication Date
DE69312814D1 DE69312814D1 (de) 1997-09-11
DE69312814T2 true DE69312814T2 (de) 1998-02-26

Family

ID=27455557

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69312814T Expired - Fee Related DE69312814T2 (de) 1992-06-30 1993-05-20 Fehlerkompensationsverfahren zum Glätten einer Fläche einer durchsichtigen Platte

Country Status (4)

Country Link
US (1) US5514850A (enExample)
EP (1) EP0577260B1 (enExample)
KR (1) KR970005523B1 (enExample)
DE (1) DE69312814T2 (enExample)

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* Cited by examiner, † Cited by third party
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EP0822881B1 (en) * 1995-04-26 2009-08-12 Minnesota Mining And Manufacturing Company Laser imaging ablation method
US5742026A (en) * 1995-06-26 1998-04-21 Corning Incorporated Processes for polishing glass and glass-ceramic surfaces using excimer laser radiation
US6197209B1 (en) 1995-10-27 2001-03-06 Lg. Philips Lcd Co., Ltd. Method of fabricating a substrate
JPH10166460A (ja) * 1996-12-06 1998-06-23 Toyota Motor Corp 積層造形方法及び積層造形装置
CA2227672A1 (en) * 1997-01-29 1998-07-29 Toyota Jidosha Kabushiki Kaisha Method for producing a laminated object and apparatus for producing the same
KR100265556B1 (ko) 1997-03-21 2000-11-01 구본준 식각장치
KR100234896B1 (ko) * 1997-07-29 1999-12-15 구본준 액정표시장치의 기판 평탄화 방법
US6327011B2 (en) 1997-10-20 2001-12-04 Lg Electronics, Inc. Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same
JP3019053B2 (ja) * 1997-12-25 2000-03-13 日本電気株式会社 液晶表示装置及びその製造方法
JP2000235351A (ja) * 1998-12-18 2000-08-29 Hitachi Ltd 画像表示装置及びその修正方法並びに修正装置
JP3736791B2 (ja) * 2000-08-31 2006-01-18 シャープ株式会社 レーザ加工方法
US20060029955A1 (en) 2001-03-24 2006-02-09 Antonio Guia High-density ion transport measurement biochip devices and methods
US20050196746A1 (en) * 2001-03-24 2005-09-08 Jia Xu High-density ion transport measurement biochip devices and methods
US7968305B2 (en) * 2001-03-24 2011-06-28 Aviva Biosciences Corporation Biochips including ion transport detecting structures and methods of use
US20040196763A1 (en) * 2001-08-10 2004-10-07 Toshifumi Tanaka Optical recording medium and manufacturing method thereof
DE10206082B4 (de) * 2002-02-13 2004-12-09 Ce-Sys Gmbh Ilmenau Glas mit gehärteter Oberflächenschicht und Verfahren zu seiner Herstellung
DE602006016759D1 (de) * 2005-04-15 2010-10-21 Asahi Glass Co Ltd Verfahren zur verringerung des durchmessers einer blase in einer glasplatte
KR101156443B1 (ko) * 2010-04-23 2012-06-18 삼성모바일디스플레이주식회사 액정 디스플레이 장치와, 이의 제조 방법
CN108569851A (zh) * 2017-03-14 2018-09-25 鸿富锦精密工业（深圳）有限公司 玻璃切割方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4338114A (en) * 1980-08-21 1982-07-06 Liberty Glass Company Laser treatment method for imparting increased mechanical strength to glass objects
US4444801A (en) * 1981-01-14 1984-04-24 Hitachi, Ltd. Method and apparatus for correcting transparent defects on a photomask
US4729372A (en) * 1983-11-17 1988-03-08 Lri L.P. Apparatus for performing ophthalmic laser surgery
US4478677A (en) * 1983-12-22 1984-10-23 International Business Machines Corporation Laser induced dry etching of vias in glass with non-contact masking
JPS60196942A (ja) * 1984-03-21 1985-10-05 Hitachi Ltd フオトマスク欠陥修正方法
AU606315B2 (en) * 1985-09-12 1991-02-07 Summit Technology, Inc. Surface erosion using lasers
JPS6384789A (ja) * 1986-09-26 1988-04-15 Semiconductor Energy Lab Co Ltd 光加工方法
US4911711A (en) * 1986-12-05 1990-03-27 Taunton Technologies, Inc. Sculpture apparatus for correcting curvature of the cornea
JPH02167164A (ja) * 1988-06-09 1990-06-27 Lri Lp 目の角膜の前表面の曲率生成手術のための彫刻装置
US5017755A (en) * 1988-10-26 1991-05-21 Kabushiki Kaisha Toshiba Method of repairing liquid crystal display and apparatus using the method
DE3850256T2 (de) * 1988-11-18 1994-10-13 Toyoda Machine Works Ltd Verfahren und Vorrichtung zur Behandlung einer bearbeiteten Fläche eines Werkstücks.
US4871415A (en) * 1988-12-30 1989-10-03 Zenith Electronics Corporation Apparatus and method for curing a defect in a grille formed on a panel of a color cathode ray tube
KR100190423B1 (ko) * 1989-06-06 1999-06-01 기타지마 요시도시 에멀젼마스크 등의결함 수정방법 및 장치
JPH0321928A (ja) * 1989-06-19 1991-01-30 Nec Corp アクティブ液晶パネルの製造方法
JP2789720B2 (ja) * 1989-10-12 1998-08-20 三菱電機株式会社 接合基板の分離方法及び液晶表示装置の分離方法
US5091626A (en) * 1990-02-02 1992-02-25 Hadassah Medical Organization Method for the ablative reshaping of material surfaces
JPH0421823A (ja) * 1990-05-16 1992-01-24 Hosiden Corp 液晶表示素子の点欠陥の黒欠陥化法及び液晶表示素子
US5280374A (en) * 1991-03-01 1994-01-18 Sharp Kabushiki Kaisha Liquid crystal display device and method of compensating for a defect
US5175504A (en) * 1991-06-17 1992-12-29 Photon Dynamics, Inc. Method and apparatus for automatically inspecting and repairing a simple matrix circuit panel
JP2592369B2 (ja) * 1991-08-22 1997-03-19 富士通株式会社 多層配線回路基板の製造方法及び誘電体ミラーマスクの製造方法
JPH06110069A (ja) * 1992-09-29 1994-04-22 Matsushita Electric Ind Co Ltd 電子部品の欠陥修復方法および欠陥修復装置

Also Published As

Publication number Publication date
EP0577260A3 (enExample) 1994-02-16
EP0577260B1 (en) 1997-08-06
US5514850A (en) 1996-05-07
KR940005943A (ko) 1994-03-22
DE69312814D1 (de) 1997-09-11
EP0577260A2 (en) 1994-01-05
KR970005523B1 (ko) 1997-04-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee