DE69308416D1 - Sicherung in Kartenbauart und Verfahren zu ihrer Herstellung - Google Patents

Sicherung in Kartenbauart und Verfahren zu ihrer Herstellung

Info

Publication number
DE69308416D1
DE69308416D1 DE69308416T DE69308416T DE69308416D1 DE 69308416 D1 DE69308416 D1 DE 69308416D1 DE 69308416 T DE69308416 T DE 69308416T DE 69308416 T DE69308416 T DE 69308416T DE 69308416 D1 DE69308416 D1 DE 69308416D1
Authority
DE
Germany
Prior art keywords
card
making
type security
security
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69308416T
Other languages
English (en)
Other versions
DE69308416T2 (de
Inventor
Yasuhiko Onishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of DE69308416D1 publication Critical patent/DE69308416D1/de
Application granted granted Critical
Publication of DE69308416T2 publication Critical patent/DE69308416T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H01H69/022—Manufacture of fuses of printed circuit fuses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49107—Fuse making
DE69308416T 1992-07-16 1993-06-09 Sicherung in Kartenbauart und Verfahren zu ihrer Herstellung Expired - Fee Related DE69308416T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4213387A JPH0636672A (ja) 1992-07-16 1992-07-16 カード型ヒューズおよびその製造方法

Publications (2)

Publication Number Publication Date
DE69308416D1 true DE69308416D1 (de) 1997-04-10
DE69308416T2 DE69308416T2 (de) 1997-06-19

Family

ID=16638364

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69308416T Expired - Fee Related DE69308416T2 (de) 1992-07-16 1993-06-09 Sicherung in Kartenbauart und Verfahren zu ihrer Herstellung

Country Status (4)

Country Link
US (1) US5309625A (de)
EP (1) EP0581428B1 (de)
JP (1) JPH0636672A (de)
DE (1) DE69308416T2 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2745190B2 (ja) * 1993-08-27 1998-04-28 矢崎総業株式会社 遅断ヒューズ
JPH07312468A (ja) * 1994-05-18 1995-11-28 Yamaichi Electron Co Ltd フレキシブル回路基板
US5974661A (en) * 1994-05-27 1999-11-02 Littelfuse, Inc. Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components
US5552757A (en) * 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device
US6191928B1 (en) 1994-05-27 2001-02-20 Littelfuse, Inc. Surface-mountable device for protection against electrostatic damage to electronic components
US5790008A (en) * 1994-05-27 1998-08-04 Littlefuse, Inc. Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces
US5929741A (en) * 1994-11-30 1999-07-27 Hitachi Chemical Company, Ltd. Current protector
US5644282A (en) * 1995-02-06 1997-07-01 Motorola, Inc. Fuse and Battery apparatus utilizing same
US5914648A (en) 1995-03-07 1999-06-22 Caddock Electronics, Inc. Fault current fusing resistor and method
ES2124634T3 (es) * 1995-06-07 1999-02-01 Littelfuse Inc Procedimiento mejorado y aparato para fabricar un dispositivo fusible de montaje en superficie.
US5699032A (en) * 1996-06-07 1997-12-16 Littelfuse, Inc. Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material
US5977860A (en) * 1996-06-07 1999-11-02 Littelfuse, Inc. Surface-mount fuse and the manufacture thereof
US6373371B1 (en) * 1997-08-29 2002-04-16 Microelectronic Modules Corp. Preformed thermal fuse
US6205030B1 (en) 1999-05-26 2001-03-20 3Com Corporation External fuse access for PC card
US6283773B1 (en) 1999-05-27 2001-09-04 3Com Corporation Media jack with external fuse access
US20030048620A1 (en) * 2000-03-14 2003-03-13 Kohshi Nishimura Printed-circuit board with fuse
US20060068179A1 (en) * 2000-05-02 2006-03-30 Weihs Timothy P Fuse applications of reactive composite structures
ES2393545T3 (es) * 2001-08-07 2012-12-26 Pacific Engineering Corporation Composición de resina de poliamida para elemento fusible y elemento fusible
US7570148B2 (en) * 2002-01-10 2009-08-04 Cooper Technologies Company Low resistance polymer matrix fuse apparatus and method
US7385475B2 (en) * 2002-01-10 2008-06-10 Cooper Technologies Company Low resistance polymer matrix fuse apparatus and method
US7436284B2 (en) * 2002-01-10 2008-10-14 Cooper Technologies Company Low resistance polymer matrix fuse apparatus and method
US6878004B2 (en) 2002-03-04 2005-04-12 Littelfuse, Inc. Multi-element fuse array
US7183891B2 (en) 2002-04-08 2007-02-27 Littelfuse, Inc. Direct application voltage variable material, devices employing same and methods of manufacturing such devices
JP2007512185A (ja) 2003-11-26 2007-05-17 リッテルフューズ，インコーポレイティド 車両用電気的保護装置、及び車両用電気的保護装置を使用するシステム
WO2005086196A1 (en) * 2004-03-03 2005-09-15 3M Innovative Properties Company Flexible fuse
US20070018774A1 (en) * 2005-07-20 2007-01-25 Dietsch Gordon T Reactive fuse element with exothermic reactive material
US7983024B2 (en) 2007-04-24 2011-07-19 Littelfuse, Inc. Fuse card system for automotive circuit protection
US20100141375A1 (en) * 2008-12-09 2010-06-10 Square D Company Trace fuse with positive expulsion
ES2563170T3 (es) * 2010-07-16 2016-03-11 Schurter Ag Elemento de fusible
EP2573790A1 (de) * 2011-09-26 2013-03-27 Siemens Aktiengesellschaft Sicherungselement
KR20150087413A (ko) * 2013-01-11 2015-07-29 가부시키가이샤 무라타 세이사쿠쇼 퓨즈
CN107492473B (zh) * 2017-08-17 2019-01-04 中国振华集团云科电子有限公司 片式熔断器阻挡层的加工方法
JP7432384B2 (ja) * 2020-02-05 2024-02-16 日本メクトロン株式会社 プリント基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2151626B2 (de) * 1971-10-16 1975-10-23 Reuter Maschinen- Und Werkzeugbau Gmbh, 2844 Lemfoerde Verfahren zur Herstellung eines starren, durch Elektrizität aufheizbaren Flächenheizelementes
JPH0831303B2 (ja) * 1986-12-01 1996-03-27 オムロン株式会社 チツプ型ヒユ−ズ
US5099219A (en) * 1991-02-28 1992-03-24 Rock, Ltd. Partnership Fusible flexible printed circuit and method of making same
US5166656A (en) * 1992-02-28 1992-11-24 Avx Corporation Thin film surface mount fuses

Also Published As

Publication number Publication date
US5309625A (en) 1994-05-10
DE69308416T2 (de) 1997-06-19
EP0581428A1 (de) 1994-02-02
EP0581428B1 (de) 1997-03-05
JPH0636672A (ja) 1994-02-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee