DE69301060D1 - Verfahren zum Aufbringen von Lot - Google Patents
Verfahren zum Aufbringen von LotInfo
- Publication number
- DE69301060D1 DE69301060D1 DE69301060T DE69301060T DE69301060D1 DE 69301060 D1 DE69301060 D1 DE 69301060D1 DE 69301060 T DE69301060 T DE 69301060T DE 69301060 T DE69301060 T DE 69301060T DE 69301060 D1 DE69301060 D1 DE 69301060D1
- Authority
- DE
- Germany
- Prior art keywords
- applying solder
- solder
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/886,895 US5211328A (en) | 1992-05-22 | 1992-05-22 | Method of applying solder |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69301060D1 true DE69301060D1 (de) | 1996-02-01 |
DE69301060T2 DE69301060T2 (de) | 1996-07-04 |
Family
ID=25390022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69301060T Expired - Fee Related DE69301060T2 (de) | 1992-05-22 | 1993-04-23 | Verfahren zum Aufbringen von Lot |
Country Status (4)
Country | Link |
---|---|
US (1) | US5211328A (de) |
EP (1) | EP0570716B1 (de) |
JP (1) | JPH0785487B2 (de) |
DE (1) | DE69301060T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5356658A (en) * | 1993-07-19 | 1994-10-18 | Motorola, Inc. | Flexible high speed liquid dispenser |
CA2135508C (en) * | 1994-11-09 | 1998-11-03 | Robert J. Lyn | Method for forming solder balls on a semiconductor substrate |
US6448169B1 (en) * | 1995-12-21 | 2002-09-10 | International Business Machines Corporation | Apparatus and method for use in manufacturing semiconductor devices |
JP3385872B2 (ja) * | 1995-12-25 | 2003-03-10 | 三菱電機株式会社 | はんだ供給法およびはんだ供給装置 |
DE19634646A1 (de) * | 1996-08-27 | 1998-03-05 | Pac Tech Gmbh | Verfahren zur selektiven Belotung |
US6230963B1 (en) | 1997-01-28 | 2001-05-15 | Eric L. Hertz | Method and apparatus using colored foils for placing conductive preforms |
US6202918B1 (en) | 1997-01-28 | 2001-03-20 | Eric Hertz | Method and apparatus for placing conductive preforms |
US6056190A (en) * | 1997-02-06 | 2000-05-02 | Speedline Technologies, Inc. | Solder ball placement apparatus |
US6427903B1 (en) | 1997-02-06 | 2002-08-06 | Speedline Technologies, Inc. | Solder ball placement apparatus |
US6641030B1 (en) | 1997-02-06 | 2003-11-04 | Speedline Technologies, Inc. | Method and apparatus for placing solder balls on a substrate |
US7842599B2 (en) * | 1997-05-27 | 2010-11-30 | Wstp, Llc | Bumping electronic components using transfer substrates |
US7819301B2 (en) * | 1997-05-27 | 2010-10-26 | Wstp, Llc | Bumping electronic components using transfer substrates |
US7007833B2 (en) | 1997-05-27 | 2006-03-07 | Mackay John | Forming solder balls on substrates |
US6609652B2 (en) | 1997-05-27 | 2003-08-26 | Spheretek, Llc | Ball bumping substrates, particuarly wafers |
US7654432B2 (en) | 1997-05-27 | 2010-02-02 | Wstp, Llc | Forming solder balls on substrates |
US6293456B1 (en) | 1997-05-27 | 2001-09-25 | Spheretek, Llc | Methods for forming solder balls on substrates |
US7288471B2 (en) * | 1997-05-27 | 2007-10-30 | Mackay John | Bumping electronic components using transfer substrates |
DE10045359A1 (de) * | 2000-09-14 | 2002-03-28 | Gerald Hecht | Vorrichtung zum Aufbringen von Lotpaste auf eine Leiterplatte |
US20040198082A1 (en) * | 2003-04-07 | 2004-10-07 | Victor Zaderej | Method of making an electrical connector |
US7273806B2 (en) * | 2004-12-09 | 2007-09-25 | International Business Machines Corporation | Forming of high aspect ratio conductive structure using injection molded solder |
CN101197296B (zh) * | 2006-12-04 | 2010-08-11 | 中芯国际集成电路制造(上海)有限公司 | 无助焊剂的凸点回流工艺 |
US7348270B1 (en) * | 2007-01-22 | 2008-03-25 | International Business Machines Corporation | Techniques for forming interconnects |
KR20090067249A (ko) * | 2007-12-21 | 2009-06-25 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US20100270363A1 (en) * | 2009-04-23 | 2010-10-28 | Seagate Technology Llc | Controlled Application of Solder Blocks to Establish Solder Connections |
WO2015052780A1 (ja) * | 2013-10-08 | 2015-04-16 | リンテック株式会社 | 電子部品実装体の製造方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3516155A (en) * | 1967-02-02 | 1970-06-23 | Bunker Ramo | Method and apparatus for assembling electrical components |
US3583063A (en) * | 1968-02-13 | 1971-06-08 | Motorola Inc | Process for soldering printed board assemblies utilizing paste solder and infrared radiation |
US4311267A (en) * | 1979-05-04 | 1982-01-19 | Gte Automatic Electric Laboratories, Inc. | Method of screening paste solder onto leaded hybrid substrates |
IL64015A (en) * | 1980-10-24 | 1984-10-31 | Pretini Gisberto | Automated bank counter |
US4412642A (en) * | 1982-03-15 | 1983-11-01 | Western Electric Co., Inc. | Cast solder leads for leadless semiconductor circuits |
JPS5919066A (ja) * | 1982-07-21 | 1984-01-31 | Nec Home Electronics Ltd | 半田付方法 |
US4684055A (en) * | 1985-09-09 | 1987-08-04 | Harris Corporation | Method of selectively soldering the underside of a substrate having leads |
US4722470A (en) * | 1986-12-01 | 1988-02-02 | International Business Machines Corporation | Method and transfer plate for applying solder to component leads |
US4759491A (en) * | 1987-05-18 | 1988-07-26 | American Telephone And Telegraph Company | Method and apparatus for applying bonding material to component leads |
JPS63304636A (ja) * | 1987-06-05 | 1988-12-12 | Hitachi Ltd | はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法 |
US4872261A (en) * | 1987-12-11 | 1989-10-10 | Digital Equipment Corporation | Method of and apparatus for surface mounting electronic components onto a printed wiring board |
JPH01241776A (ja) * | 1988-03-23 | 1989-09-26 | Fujitsu Ltd | コネクタの半田付け方法 |
US4842184A (en) * | 1988-06-23 | 1989-06-27 | Ltv Aerospace & Defense Company | Method and apparatus for applying solder preforms |
US4832255A (en) * | 1988-07-25 | 1989-05-23 | International Business Machines Corporation | Precision solder transfer method and means |
US4898320A (en) * | 1988-11-21 | 1990-02-06 | Honeywell, Inc. | Method of manufacturing a high-yield solder bumped semiconductor wafer |
US5076487A (en) * | 1989-03-20 | 1991-12-31 | The Boc Group, Inc. | Process for reflow soldering |
US5014162A (en) * | 1989-06-27 | 1991-05-07 | At&T Bell Laboratories | Solder assembly of components |
US5048747A (en) * | 1989-06-27 | 1991-09-17 | At&T Bell Laboratories | Solder assembly of components |
US4998342A (en) * | 1989-08-31 | 1991-03-12 | International Business Machines Corporation | Method of attaching electronic components |
US5001829A (en) * | 1990-01-02 | 1991-03-26 | General Electric Company | Method for connecting a leadless chip carrier to a substrate |
-
1992
- 1992-05-22 US US07/886,895 patent/US5211328A/en not_active Expired - Fee Related
-
1993
- 1993-04-23 EP EP93106650A patent/EP0570716B1/de not_active Expired - Lifetime
- 1993-04-23 DE DE69301060T patent/DE69301060T2/de not_active Expired - Fee Related
- 1993-05-13 JP JP5111696A patent/JPH0785487B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0570716B1 (de) | 1995-12-20 |
US5211328A (en) | 1993-05-18 |
DE69301060T2 (de) | 1996-07-04 |
JPH0785487B2 (ja) | 1995-09-13 |
EP0570716A1 (de) | 1993-11-24 |
JPH0637142A (ja) | 1994-02-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |