DE69214389T2 - Elektrischer Messfühler mit geformten Kontakten - Google Patents

Elektrischer Messfühler mit geformten Kontakten

Info

Publication number
DE69214389T2
DE69214389T2 DE1992614389 DE69214389T DE69214389T2 DE 69214389 T2 DE69214389 T2 DE 69214389T2 DE 1992614389 DE1992614389 DE 1992614389 DE 69214389 T DE69214389 T DE 69214389T DE 69214389 T2 DE69214389 T2 DE 69214389T2
Authority
DE
Germany
Prior art keywords
electrical sensor
molded contacts
molded
contacts
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1992614389
Other languages
English (en)
Other versions
DE69214389D1 (de
Inventor
Haim Feigenbaum
William R Crumly
Christopher M Schreiber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/753,400 external-priority patent/US5207887A/en
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of DE69214389D1 publication Critical patent/DE69214389D1/de
Application granted granted Critical
Publication of DE69214389T2 publication Critical patent/DE69214389T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE1992614389 1991-08-26 1992-08-25 Elektrischer Messfühler mit geformten Kontakten Expired - Fee Related DE69214389T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US75084291A 1991-08-26 1991-08-26
US07/753,400 US5207887A (en) 1991-08-30 1991-08-30 Semi-additive circuitry with raised features using formed mandrels

Publications (2)

Publication Number Publication Date
DE69214389D1 DE69214389D1 (de) 1996-11-14
DE69214389T2 true DE69214389T2 (de) 1997-04-30

Family

ID=27115327

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1992614389 Expired - Fee Related DE69214389T2 (de) 1991-08-26 1992-08-25 Elektrischer Messfühler mit geformten Kontakten
DE1992607996 Expired - Fee Related DE69207996T2 (de) 1991-08-26 1992-08-25 Semi-additive elektrische Schaltungen mit erhöhten Einzelheiten unter Verwendung geformter Matrizen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE1992607996 Expired - Fee Related DE69207996T2 (de) 1991-08-26 1992-08-25 Semi-additive elektrische Schaltungen mit erhöhten Einzelheiten unter Verwendung geformter Matrizen

Country Status (2)

Country Link
EP (2) EP0529577B1 (de)
DE (2) DE69214389T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6133534A (en) * 1991-11-29 2000-10-17 Hitachi Chemical Company, Ltd. Wiring board for electrical tests with bumps having polymeric coating
DE69218344T2 (de) * 1991-11-29 1997-10-23 Hitachi Chemical Co Ltd Herstellungsverfahren für eine gedruckte Schaltung
US6568073B1 (en) 1991-11-29 2003-05-27 Hitachi Chemical Company, Ltd. Process for the fabrication of wiring board for electrical tests
US5504992A (en) * 1991-11-29 1996-04-09 Hitachi Chemical Company, Ltd. Fabrication process of wiring board
SG44726A1 (en) * 1993-04-27 1997-12-19 Hitachi Chemical Co Ltd Wiring board for electrical tests and method of manufacturing the same
CA2135241C (en) * 1993-12-17 1998-08-04 Mohi Sobhani Cavity and bump interconnection structure for electronic packages
US5632631A (en) 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
JP3502776B2 (ja) 1998-11-26 2004-03-02 新光電気工業株式会社 バンプ付き金属箔及び回路基板及びこれを用いた半導体装置
US6218203B1 (en) * 1999-06-28 2001-04-17 Advantest Corp. Method of producing a contact structure

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL108173C (de) * 1954-06-25
US3350250A (en) * 1962-03-21 1967-10-31 North American Aviation Inc Method of making printed wire circuitry
US4125441A (en) * 1978-01-30 1978-11-14 General Dynamics Corporation Isolated bump circuitry on tape utilizing electroforming
GB2049297B (en) * 1979-05-18 1984-01-25 Pactel Corp Method of manufacturing printed circuitry
US4374708A (en) * 1980-02-28 1983-02-22 General Dynamics, Pomona Division Fine line circuitry probes and method of manufacture
US4564423A (en) * 1984-11-28 1986-01-14 General Dynamics Pomona Division Permanent mandrel for making bumped tapes and methods of forming
US4584039A (en) * 1984-12-26 1986-04-22 Hughes Aircraft Co. Fine line flexible cable fabrication process
JP2532075B2 (ja) * 1986-12-26 1996-09-11 九州日立マクセル株式会社 バンプ付きフイルムキヤリアの製造方法
US4878294A (en) * 1988-06-20 1989-11-07 General Dynamics Corp., Pomona Division Electroformed chemically milled probes for chip testing
FR2643754B1 (fr) * 1989-02-28 1993-09-17 Thomson Brandt Armements Procede de realisation d'une connexion a plat

Also Published As

Publication number Publication date
EP0529578A2 (de) 1993-03-03
DE69214389D1 (de) 1996-11-14
EP0529577A2 (de) 1993-03-03
EP0529577B1 (de) 1996-10-09
EP0529578B1 (de) 1996-01-31
DE69207996T2 (de) 1996-09-19
EP0529578A3 (en) 1993-08-04
DE69207996D1 (de) 1996-03-14
EP0529577A3 (en) 1993-08-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee