DE69212902D1 - Halbleiteranordnung mit Halterung und Verfahren zum Montieren von Halbleiteranordnungen mit Halterung - Google Patents

Halbleiteranordnung mit Halterung und Verfahren zum Montieren von Halbleiteranordnungen mit Halterung

Info

Publication number
DE69212902D1
DE69212902D1 DE69212902T DE69212902T DE69212902D1 DE 69212902 D1 DE69212902 D1 DE 69212902D1 DE 69212902 T DE69212902 T DE 69212902T DE 69212902 T DE69212902 T DE 69212902T DE 69212902 D1 DE69212902 D1 DE 69212902D1
Authority
DE
Germany
Prior art keywords
holder
semiconductor
arrangements
mounting
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69212902T
Other languages
English (en)
Other versions
DE69212902T2 (de
Inventor
Norio Taniguchi
Junichi Kasai
Kazuto Tsuji
Michio Sono
Masanori Yoshimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE69212902D1 publication Critical patent/DE69212902D1/de
Publication of DE69212902T2 publication Critical patent/DE69212902T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1094—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69212902T 1991-05-31 1992-05-27 Halbleiteranordnung mit Halterung und Verfahren zum Montieren von Halbleiteranordnungen mit Halterung Expired - Fee Related DE69212902T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3129776A JPH04354363A (ja) 1991-05-31 1991-05-31 半導体装置ユニット

Publications (2)

Publication Number Publication Date
DE69212902D1 true DE69212902D1 (de) 1996-09-26
DE69212902T2 DE69212902T2 (de) 1997-04-03

Family

ID=15017936

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69212902T Expired - Fee Related DE69212902T2 (de) 1991-05-31 1992-05-27 Halbleiteranordnung mit Halterung und Verfahren zum Montieren von Halbleiteranordnungen mit Halterung

Country Status (5)

Country Link
US (1) US5684675A (de)
EP (1) EP0516096B1 (de)
JP (1) JPH04354363A (de)
KR (1) KR970000216B1 (de)
DE (1) DE69212902T2 (de)

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FR2688630B1 (fr) * 1992-03-13 2001-08-10 Thomson Csf Procede et dispositif d'interconnexion en trois dimensions de boitiers de composants electroniques.
JP3253765B2 (ja) * 1993-06-25 2002-02-04 富士通株式会社 半導体装置
US5457071A (en) * 1993-09-03 1995-10-10 International Business Machine Corp. Stackable vertical thin package/plastic molded lead-on-chip memory cube
KR100268460B1 (ko) * 1996-12-07 2000-10-16 윤종용 표면실장용 반도체ic의 위치결정장치
US5944199A (en) * 1997-11-25 1999-08-31 Micron Technology, Inc. Integrated circuit package support system
DE19757612C1 (de) * 1997-12-23 1999-07-08 Siemens Ag Hybridschaltung mit einem System zur Wärmeableitung
DE19846456A1 (de) * 1998-10-08 2000-01-27 Siemens Ag Elektronisches Bauteil
US6201695B1 (en) * 1998-10-26 2001-03-13 Micron Technology, Inc. Heat sink for chip stacking applications
US6496375B2 (en) * 2001-04-30 2002-12-17 Hewlett-Packard Company Cooling arrangement for high density packaging of electronic components
JP3631445B2 (ja) * 2001-06-06 2005-03-23 東芝三菱電機産業システム株式会社 平型半導体スタック装置
DE10319984B4 (de) * 2003-05-05 2009-09-03 Qimonda Ag Vorrichtung zum Kühlen von Speichermodulen
KR100586698B1 (ko) * 2003-12-23 2006-06-08 삼성전자주식회사 수직 실장된 반도체 칩 패키지를 갖는 반도체 모듈
US20060221573A1 (en) * 2005-04-04 2006-10-05 Ming Li Heat sink for multiple semiconductor modules
US8680666B2 (en) * 2006-05-24 2014-03-25 International Rectifier Corporation Bond wireless power module with double-sided single device cooling and immersion bath cooling
JP5355867B2 (ja) * 2007-07-10 2013-11-27 ローム株式会社 集積回路素子
US7968989B2 (en) * 2008-06-27 2011-06-28 Integrated Device Technology, Inc Multi-package slot array
US8767403B2 (en) * 2009-10-30 2014-07-01 Hewlett-Packard Development Company, L.P. Frame having frame blades that participate in cooling memory modules
TW201144993A (en) * 2010-06-15 2011-12-16 Hon Hai Prec Ind Co Ltd Memory heat-dissipating device
TWI421024B (zh) * 2010-06-18 2013-12-21 Hon Hai Prec Ind Co Ltd 電子裝置
US10952352B2 (en) 2017-10-27 2021-03-16 Micron Technology, Inc. Assemblies including heat dispersing elements and related systems and methods

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3579046A (en) * 1969-05-02 1971-05-18 Jordan Controls Inc Electrical housing assembly having a plurality of chambers with adjacent circuit board elements
DE2107549A1 (de) * 1970-02-19 1971-09-02 Texas Instruments Inc Trager einer elektronischen Schaltung mit einem Sammelsystem mit Warmeleitungs eigenschaften fur alle Richtungen
US4227238A (en) * 1977-09-28 1980-10-07 Nippon Gakki Seizo Kabushiki Kaisha Mounting and electrical connection means for operation unit for electric devices
US4220384A (en) * 1978-10-20 1980-09-02 Amp Incorporated Loose piece terminal mounting assembly
US4420795A (en) * 1981-08-17 1983-12-13 Scholz Donald T Electronic component mounting
US4553190A (en) * 1982-08-26 1985-11-12 Minnesota Mining And Manufacturing Co. Transparent container for electrostatic sensitive electronic components
US4498123A (en) * 1983-03-25 1985-02-05 Tellabs, Inc. Universal circuit module mounting structure
JPH0432778Y2 (de) * 1984-10-23 1992-08-06
JPS6181170U (de) * 1984-10-31 1986-05-29
WO1993013557A1 (en) * 1985-02-14 1993-07-08 Yoshiyuki Sato Structure for mounting the semiconductor chips in a three-dimensional manner
US4720771A (en) * 1985-07-05 1988-01-19 Chrysler Motors Corporation Heat sink assembly for a circuit board mounted integrated circuit
EP0218022B1 (de) * 1985-08-14 1992-07-29 OMRON Corporation Montagestruktur für einen oberflächenmontierten Bauelementtyp und Verfahren zum Montieren dieses Bauelementtyps auf einer Leiterplatte
US4727456A (en) * 1986-05-06 1988-02-23 Northern Telecom Limited Leadless electronic component carrier
US4868712A (en) * 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package
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US4965699A (en) * 1989-04-18 1990-10-23 Magnavox Government And Industrial Electronics Company Circuit card assembly cold plate
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US5050039A (en) * 1990-06-26 1991-09-17 Digital Equipment Corporation Multiple circuit chip mounting and cooling arrangement
US5057969A (en) * 1990-09-07 1991-10-15 International Business Machines Corporation Thin film electronic device

Also Published As

Publication number Publication date
EP0516096B1 (de) 1996-08-21
KR920022470A (ko) 1992-12-19
DE69212902T2 (de) 1997-04-03
US5684675A (en) 1997-11-04
KR970000216B1 (ko) 1997-01-06
EP0516096A3 (en) 1993-08-04
JPH04354363A (ja) 1992-12-08
EP0516096A2 (de) 1992-12-02

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee