DE69206935D1 - Vorrichtung zum Montieren von Werkstücken - Google Patents
Vorrichtung zum Montieren von WerkstückenInfo
- Publication number
- DE69206935D1 DE69206935D1 DE69206935T DE69206935T DE69206935D1 DE 69206935 D1 DE69206935 D1 DE 69206935D1 DE 69206935 T DE69206935 T DE 69206935T DE 69206935 T DE69206935 T DE 69206935T DE 69206935 D1 DE69206935 D1 DE 69206935D1
- Authority
- DE
- Germany
- Prior art keywords
- assembling workpieces
- workpieces
- assembling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
- H05K13/0853—Determination of transport trajectories inside mounting machines
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3248060A JPH0590789A (ja) | 1991-09-26 | 1991-09-26 | ワーク実装機 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69206935D1 true DE69206935D1 (de) | 1996-02-01 |
DE69206935T2 DE69206935T2 (de) | 1996-06-13 |
Family
ID=17172608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69206935T Expired - Fee Related DE69206935T2 (de) | 1991-09-26 | 1992-09-25 | Vorrichtung zum Montieren von Werkstücken |
Country Status (6)
Country | Link |
---|---|
US (1) | US5287616A (de) |
EP (1) | EP0534455B1 (de) |
JP (1) | JPH0590789A (de) |
KR (1) | KR960010032B1 (de) |
DE (1) | DE69206935T2 (de) |
TW (1) | TW199940B (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06275991A (ja) * | 1993-03-23 | 1994-09-30 | Japan Tobacco Inc | ワーク実装機 |
US5926950A (en) * | 1995-12-28 | 1999-07-27 | Fuji Machine Mfg. Co., Ltd. | Electronic component transferring device and method, and electronic component mounting system and method |
US6168009B1 (en) | 1995-12-28 | 2001-01-02 | Fuji Machine Mfg. Co. Ltd. | Apparatus for positioning electronic component holder head and apparatus for transferring electronic component |
JP3398109B2 (ja) * | 2000-01-27 | 2003-04-21 | 三洋電機株式会社 | 電子部品装着装置 |
DE10203601A1 (de) * | 2002-01-30 | 2003-08-14 | Siemens Ag | Chipentnahmevorrichtung, Chipentnahmesystem, Bestücksystem und Verfahren zum Entnehmen von Chips von einem Wafer |
MY142931A (en) * | 2002-06-14 | 2011-01-31 | Ismeca Semiconductor Holding | Method for adjusting barrel supports and barrel |
CN104776395B (zh) * | 2015-04-30 | 2017-02-22 | 京东方光科技有限公司 | 一种led灯条安装设备 |
JP6840866B2 (ja) * | 2017-12-14 | 2021-03-10 | ヤマハ発動機株式会社 | ワーク作業装置 |
DE102018009475A1 (de) * | 2018-12-03 | 2020-06-04 | Giesecke+Devrient Currency Technology Gmbh | Aufbringung und Befestigung von Einzelelementen auf einer Substratbahn |
TWI706698B (zh) * | 2018-12-19 | 2020-10-01 | 鴻勁精密股份有限公司 | 電子元件作業機構及其應用之作業設備 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4372802A (en) * | 1980-06-02 | 1983-02-08 | Tokyo Denki Kagaku Kogyo Kabushiki Kaisha | Apparatus for mounting chip type circuit elements on printed circuit boards |
CA1217572A (en) * | 1983-05-02 | 1987-02-03 | Kenichi Saito | Mounting apparatus for chip type electronic parts |
JP2537770B2 (ja) * | 1984-08-31 | 1996-09-25 | 松下電器産業株式会社 | 電子部品の装着方法 |
JPH0777308B2 (ja) * | 1987-05-28 | 1995-08-16 | 三洋電機株式会社 | 部品装着装置 |
JP3011423B2 (ja) * | 1989-10-18 | 2000-02-21 | 三洋電機株式会社 | 部品吸着装置 |
-
1991
- 1991-09-26 JP JP3248060A patent/JPH0590789A/ja active Pending
-
1992
- 1992-09-22 TW TW081107474A patent/TW199940B/zh active
- 1992-09-25 KR KR1019920017475A patent/KR960010032B1/ko not_active IP Right Cessation
- 1992-09-25 EP EP92116432A patent/EP0534455B1/de not_active Expired - Lifetime
- 1992-09-25 US US07/950,716 patent/US5287616A/en not_active Expired - Fee Related
- 1992-09-25 DE DE69206935T patent/DE69206935T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0590789A (ja) | 1993-04-09 |
US5287616A (en) | 1994-02-22 |
EP0534455A1 (de) | 1993-03-31 |
DE69206935T2 (de) | 1996-06-13 |
KR930007334A (ko) | 1993-04-22 |
EP0534455B1 (de) | 1995-12-20 |
KR960010032B1 (ko) | 1996-07-25 |
TW199940B (de) | 1993-02-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |