DE69206868D1 - Einrichtung zum Abziehen eines Abdeckfilms von einem Halbleitersubstrat - Google Patents

Einrichtung zum Abziehen eines Abdeckfilms von einem Halbleitersubstrat

Info

Publication number
DE69206868D1
DE69206868D1 DE69206868T DE69206868T DE69206868D1 DE 69206868 D1 DE69206868 D1 DE 69206868D1 DE 69206868 T DE69206868 T DE 69206868T DE 69206868 T DE69206868 T DE 69206868T DE 69206868 D1 DE69206868 D1 DE 69206868D1
Authority
DE
Germany
Prior art keywords
peeling
semiconductor substrate
cover film
film
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69206868T
Other languages
English (en)
Other versions
DE69206868T2 (de
Inventor
Nobuo Shiga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE69206868D1 publication Critical patent/DE69206868D1/de
Publication of DE69206868T2 publication Critical patent/DE69206868T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y10S156/943—Means for delaminating semiconductive product with poking delaminating means, e.g. jabbing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/977—Thinning or removal of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69206868T 1991-04-26 1992-04-26 Einrichtung zum Abziehen eines Abdeckfilms von einem Halbleitersubstrat Expired - Fee Related DE69206868T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9690091 1991-04-26

Publications (2)

Publication Number Publication Date
DE69206868D1 true DE69206868D1 (de) 1996-02-01
DE69206868T2 DE69206868T2 (de) 1996-08-14

Family

ID=14177249

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69206868T Expired - Fee Related DE69206868T2 (de) 1991-04-26 1992-04-26 Einrichtung zum Abziehen eines Abdeckfilms von einem Halbleitersubstrat

Country Status (4)

Country Link
US (1) US5240546A (de)
EP (1) EP0510706B1 (de)
CA (1) CA2067027A1 (de)
DE (1) DE69206868T2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5432318A (en) * 1992-05-15 1995-07-11 Irvine Sensors Corporation Apparatus for segmenting stacked IC chips
JP2642317B2 (ja) * 1994-08-03 1997-08-20 ソマール株式会社 フィルム剥離方法及び装置
EP1498934A3 (de) * 1996-02-28 2005-12-21 Ebara Corporation Wafer-Transportroboter
FR2752332B1 (fr) * 1996-08-12 1998-09-11 Commissariat Energie Atomique Dispositif de decollement de plaquettes et procede de mise en oeuvre de ce dispositif
US6244931B1 (en) * 1999-04-02 2001-06-12 Applied Materials, Inc. Buffer station on CMP system
DE19958803C1 (de) * 1999-12-07 2001-08-30 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Handhaben von Halbleitersubstraten bei der Prozessierung und/oder Bearbeitung
US6309899B1 (en) * 2000-02-22 2001-10-30 Advanced Micro Devices, Inc. Method and system for removing a die from a semiconductor package
US6415843B1 (en) * 2001-01-10 2002-07-09 Anadigics, Inc. Spatula for separation of thinned wafer from mounting carrier
JP4102040B2 (ja) * 2001-07-31 2008-06-18 信越半導体株式会社 Ｓｏｉウェーハの製造方法およびウェーハ分離治具
US6685795B1 (en) * 2001-08-10 2004-02-03 Adco Products, Inc. Device and method of separating adhered layers
US7314076B2 (en) * 2004-09-22 2008-01-01 Northrup Grumman Corporation Multilayer shim peeling device
US7314808B2 (en) * 2004-12-23 2008-01-01 Applied Materials, Inc. Method for sequencing substrates
WO2006096165A2 (en) * 2005-03-04 2006-09-14 Thomson Licensing An apparatus and method for removing a temporary substrate from an optical disk
JP2009154407A (ja) * 2007-12-27 2009-07-16 Tdk Corp 剥離装置、剥離方法および情報記録媒体製造方法
TW201015652A (en) * 2008-10-07 2010-04-16 Asia Ic Mic Process Inc Separating device and method
DE102009018156A1 (de) * 2009-04-21 2010-11-18 Ev Group Gmbh Vorrichtung und Verfahren zum Trennen eines Substrats von einem Trägersubstrat
US8251576B1 (en) 2009-05-30 2012-08-28 Mia Sole Cold lift-off test for strength of film stack subjected to thermal loading
TWI534938B (zh) * 2010-02-25 2016-05-21 尼康股份有限公司 Substrate separation device, manufacturing method of semiconductor device, load lock device, substrate bonding device and substrate separation method
US8758552B2 (en) 2010-06-07 2014-06-24 Skyworks Solutions, Inc. Debonders and related devices and methods for semiconductor fabrication
US8888085B2 (en) 2010-10-05 2014-11-18 Skyworks Solutions, Inc. Devices and methodologies for handling wafers
US8758553B2 (en) * 2010-10-05 2014-06-24 Skyworks Solutions, Inc. Fixtures and methods for unbonding wafers by shear force
US20120080832A1 (en) 2010-10-05 2012-04-05 Skyworks Solutions, Inc. Devices for methodologies related to wafer carriers
CN103650171B (zh) * 2011-07-15 2018-09-18 亮锐控股有限公司 将半导体装置结合到支持衬底的方法
JP5913053B2 (ja) * 2011-12-08 2016-04-27 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
TWI571949B (zh) 2013-01-10 2017-02-21 晶元光電股份有限公司 半導體元件翻轉裝置
JP6128941B2 (ja) * 2013-05-10 2017-05-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法及び半導体製造装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3634930A (en) * 1969-06-12 1972-01-18 Western Electric Co Methods for bonding leads and testing bond strength
US4519168A (en) * 1979-09-18 1985-05-28 Speedfam Corporation Liquid waxless fixturing of microsize wafers
US4433835A (en) * 1981-11-30 1984-02-28 Tencor Instruments Wafer chuck with wafer cleaning feature
US4664739A (en) * 1983-12-19 1987-05-12 Stauffer Chemical Company Removal of semiconductor wafers from dicing film
US4893513A (en) * 1988-11-01 1990-01-16 Nordson Corporation Method and apparatus for bond testing
US5013392A (en) * 1990-02-15 1991-05-07 Hughes Aircraft Company Thin film delamination tool
US5170929A (en) * 1992-05-29 1992-12-15 International Business Machines Corporation Ultrasonic adhesion/dehesion monitoring apparatus with acoustic transducer means

Also Published As

Publication number Publication date
US5240546A (en) 1993-08-31
EP0510706A2 (de) 1992-10-28
DE69206868T2 (de) 1996-08-14
EP0510706A3 (en) 1993-01-20
EP0510706B1 (de) 1995-12-20
CA2067027A1 (en) 1992-10-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee