DE69118642D1 - Montageeinrichtung zum Montieren von einem elektronischen Bauelement über einem Substrat bei der Oberflächemontagetechnologie - Google Patents

Montageeinrichtung zum Montieren von einem elektronischen Bauelement über einem Substrat bei der Oberflächemontagetechnologie

Info

Publication number
DE69118642D1
DE69118642D1 DE69118642T DE69118642T DE69118642D1 DE 69118642 D1 DE69118642 D1 DE 69118642D1 DE 69118642 T DE69118642 T DE 69118642T DE 69118642 T DE69118642 T DE 69118642T DE 69118642 D1 DE69118642 D1 DE 69118642D1
Authority
DE
Germany
Prior art keywords
mounting
substrate
electronic component
component over
technology
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69118642T
Other languages
English (en)
Other versions
DE69118642T2 (de
Inventor
Kenjiro Taniuchi
Hideo Miyazawa
Kouji Ishikawa
Kouji Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE69118642D1 publication Critical patent/DE69118642D1/de
Application granted granted Critical
Publication of DE69118642T2 publication Critical patent/DE69118642T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
DE69118642T 1990-10-11 1991-10-11 Montageeinrichtung zum Montieren von einem elektronischen Bauelement über einem Substrat bei der Oberflächemontagetechnologie Expired - Fee Related DE69118642T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2272551A JPH0732042B2 (ja) 1990-10-11 1990-10-11 スルーホール接続形電子デバイスとその実装方法

Publications (2)

Publication Number Publication Date
DE69118642D1 true DE69118642D1 (de) 1996-05-15
DE69118642T2 DE69118642T2 (de) 1996-09-19

Family

ID=17515482

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69118642T Expired - Fee Related DE69118642T2 (de) 1990-10-11 1991-10-11 Montageeinrichtung zum Montieren von einem elektronischen Bauelement über einem Substrat bei der Oberflächemontagetechnologie

Country Status (4)

Country Link
US (1) US5326936A (de)
EP (1) EP0480754B1 (de)
JP (1) JPH0732042B2 (de)
DE (1) DE69118642T2 (de)

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JPH06111865A (ja) * 1992-08-06 1994-04-22 Du Pont Singapore Pte Ltd 面実装コネクタ装置及びその製造方法
TW238431B (de) 1992-12-01 1995-01-11 Stanford W Crane Jr
US5634821A (en) * 1992-12-01 1997-06-03 Crane, Jr.; Stanford W. High-density electrical interconnect system
JP2716336B2 (ja) * 1993-03-10 1998-02-18 日本電気株式会社 集積回路装置
GB9314038D0 (en) * 1993-07-07 1993-08-18 Amp Holland High temperature connection
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US5543586A (en) * 1994-03-11 1996-08-06 The Panda Project Apparatus having inner layers supporting surface-mount components
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
KR970701885A (ko) * 1994-03-11 1997-04-12 크레인, 스탠포드 더블유 고대역폭 컴퓨터를 위한 모듈 구조(modular architecture for high bandwidth computers)
US5541449A (en) * 1994-03-11 1996-07-30 The Panda Project Semiconductor chip carrier affording a high-density external interface
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US5576931A (en) * 1994-05-03 1996-11-19 The Panda Project Computer with two fans and two air circulation areas
JP3531971B2 (ja) * 1994-05-16 2004-05-31 フィガロ技研株式会社 ガスまたは湿度を検出するセンサとその製造方法
US5692297A (en) * 1994-11-25 1997-12-02 Sumitomo Wiring Systems, Ltd. Method of mounting terminal to flexible printed circuit board
US5839189A (en) * 1995-04-03 1998-11-24 Emerson Electric Co. Bracket for attaching pin-in-hole components to a surface mount board
US5670750A (en) * 1995-04-27 1997-09-23 International Business Machines Corporation Electric circuit card having a donut shaped land
US6000126A (en) * 1996-03-29 1999-12-14 General Dynamics Information Systems, Inc. Method and apparatus for connecting area grid arrays to printed wire board
US5743751A (en) * 1996-05-14 1998-04-28 Davis; Philip E. Straddle adapter for mounting edge connectors to a printed circuit board
US5876222A (en) * 1997-11-07 1999-03-02 Molex Incorporated Electrical connector for printed circuit boards
US6369333B1 (en) * 1998-02-13 2002-04-09 Intel Corporation Flexible connection system
US6078102A (en) * 1998-03-03 2000-06-20 Silicon Bandwidth, Inc. Semiconductor die package for mounting in horizontal and upright configurations
US6141869A (en) 1998-10-26 2000-11-07 Silicon Bandwidth, Inc. Apparatus for and method of manufacturing a semiconductor die carrier
DE10229953A1 (de) * 2002-07-03 2004-01-29 Hartmann Codier Gmbh & Co.Kg Bauelement zur Leiterplattenmontage
JP4416616B2 (ja) * 2004-09-29 2010-02-17 株式会社リコー 電子部品実装体及び電子機器
CN1873891A (zh) * 2005-06-03 2006-12-06 清华大学 真空器件、其制造方法以及吸气装置
JP2007194434A (ja) * 2006-01-19 2007-08-02 Fujitsu Ltd 実装材整列基板、実装装置、実装方法及び回路基板製造方法
JP2007194435A (ja) * 2006-01-19 2007-08-02 Fujitsu Ltd 実装材整列基板、実装装置、実装方法及び回路基板製造方法
JP2007317688A (ja) * 2006-05-23 2007-12-06 Sony Corp 電子部品及び電子部品の実装方法
JP2009158892A (ja) * 2007-12-28 2009-07-16 Nec Corp 多層配線基板及びその製造方法
TWM366773U (en) * 2009-03-31 2009-10-11 Hon Hai Prec Ind Co Ltd Electrical connector
US8907694B2 (en) * 2009-12-17 2014-12-09 Xcerra Corporation Wiring board for testing loaded printed circuit board
US8057240B2 (en) * 2010-03-23 2011-11-15 Tyco Electronics Corporation Circuit board for an electrical connector assembly
JP6139280B2 (ja) 2013-06-05 2017-05-31 トヨタ自動車株式会社 半導体装置
KR101660582B1 (ko) * 2014-06-19 2016-09-29 황규천 엘이디등 및 이를 포함하는 경화기
JP2016193078A (ja) * 2015-03-31 2016-11-17 株式会社大一商会 遊技機
DE102015107972A1 (de) * 2015-05-20 2016-11-24 Epcos Ag Vorrichtung zur Ausrichtung von Kontaktanschlüssen eines elektrischen Bauteils für die Montage auf einer Platine einer elektrischen Schaltung
JP6265946B2 (ja) * 2015-07-17 2018-01-24 株式会社大一商会 遊技機
JP6265947B2 (ja) * 2015-07-17 2018-01-24 株式会社大一商会 遊技機
JP6192127B2 (ja) * 2015-07-17 2017-09-06 株式会社大一商会 遊技機
JP6376663B2 (ja) * 2015-08-11 2018-08-22 株式会社大一商会 遊技機
JP2017035357A (ja) * 2015-08-11 2017-02-16 株式会社大一商会 遊技機
CN109390764B (zh) * 2017-08-04 2021-09-21 富士康(昆山)电脑接插件有限公司 一种端子模组、具有端子模组的电连接器及其制造方法
JP7166874B2 (ja) * 2018-10-25 2022-11-08 古河電気工業株式会社 光モジュール実装基板および容器実装基板

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4142286A (en) * 1978-03-15 1979-03-06 Burroughs Corporation Apparatus and method for inserting solder preforms on selected circuit board back plane pins
US4216350A (en) * 1978-11-01 1980-08-05 Burroughs Corporation Multiple solder pre-form with non-fusible web
JP2654476B2 (ja) * 1987-03-06 1997-09-17 アンプ インコ−ポレ−テツド 多極コネクタ
JPH054217Y2 (de) * 1987-08-03 1993-02-02
EP0360971A3 (de) * 1988-08-31 1991-07-17 Mitsui Mining & Smelting Co., Ltd. Substrat für die Montage und sein Herstellungsverfahren und gedruckte Leiterplatte mit Verbinderfunktion und Verbindungsverfahren hierfür
US5117330A (en) * 1990-04-09 1992-05-26 Hewlett-Packard Company Fixture for circuit components

Also Published As

Publication number Publication date
JPH0732042B2 (ja) 1995-04-10
DE69118642T2 (de) 1996-09-19
EP0480754A3 (en) 1992-06-17
US5326936A (en) 1994-07-05
JPH04147579A (ja) 1992-05-21
EP0480754B1 (de) 1996-04-10
EP0480754A2 (de) 1992-04-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee