DE69122069T2 - Verfahren zur Herstellung eines aufgedampften Films - Google Patents
Verfahren zur Herstellung eines aufgedampften FilmsInfo
- Publication number
- DE69122069T2 DE69122069T2 DE69122069T DE69122069T DE69122069T2 DE 69122069 T2 DE69122069 T2 DE 69122069T2 DE 69122069 T DE69122069 T DE 69122069T DE 69122069 T DE69122069 T DE 69122069T DE 69122069 T2 DE69122069 T2 DE 69122069T2
- Authority
- DE
- Germany
- Prior art keywords
- making
- evaporated film
- evaporated
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
- C23C16/20—Deposition of aluminium only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
- H01L21/28562—Selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32051—Deposition of metallic or metal-silicide layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP90405190A JPH04221822A (ja) | 1990-12-21 | 1990-12-21 | 堆積膜形成法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69122069D1 DE69122069D1 (de) | 1996-10-17 |
DE69122069T2 true DE69122069T2 (de) | 1997-02-06 |
Family
ID=18514817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69122069T Expired - Lifetime DE69122069T2 (de) | 1990-12-21 | 1991-12-19 | Verfahren zur Herstellung eines aufgedampften Films |
Country Status (4)
Country | Link |
---|---|
US (1) | US5364664A (de) |
EP (1) | EP0493002B1 (de) |
JP (1) | JPH04221822A (de) |
DE (1) | DE69122069T2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0498580A1 (de) * | 1991-02-04 | 1992-08-12 | Canon Kabushiki Kaisha | Verfahren zur Herstellung einer abgeschiedenen Metallschicht, die Aluminium enthält, mit Anwendung von Alkylaluminiumhalid |
JP2968657B2 (ja) * | 1992-02-18 | 1999-10-25 | 日本電気株式会社 | 熱cvd方法 |
US5580808A (en) * | 1992-07-30 | 1996-12-03 | Canon Kabushiki Kaisha | Method of manufacturing a ROM device having contact holes treated with hydrogen atoms and energy beam |
US5545591A (en) * | 1993-01-29 | 1996-08-13 | Nec Corporation | Method for forming an aluminum film used as an interconnect in a semiconductor device |
JP2748819B2 (ja) * | 1993-06-04 | 1998-05-13 | 日本電気株式会社 | パターニング方法 |
JPH09501612A (ja) * | 1994-04-08 | 1997-02-18 | マーク エー. レイ, | 選択的プラズマ成長 |
US5801076A (en) * | 1995-02-21 | 1998-09-01 | Advanced Micro Devices, Inc. | Method of making non-volatile memory device having a floating gate with enhanced charge retention |
US5856236A (en) * | 1996-06-14 | 1999-01-05 | Micron Technology, Inc. | Method of depositing a smooth conformal aluminum film on a refractory metal nitride layer |
US5851367A (en) * | 1996-10-11 | 1998-12-22 | Sharp Microelectronics Technology, Inc. | Differential copper deposition on integrated circuit surfaces and method for same |
TW460597B (en) | 1997-03-27 | 2001-10-21 | Applied Materials Inc | A barrier layer structure for use in semiconductors and a method of producing an aluminum-comprising layer having a 111 crystal orientation |
US6326226B1 (en) | 1997-07-15 | 2001-12-04 | Lg. Philips Lcd Co., Ltd. | Method of crystallizing an amorphous film |
US5882399A (en) * | 1997-08-23 | 1999-03-16 | Applied Materials, Inc. | Method of forming a barrier layer which enables a consistently highly oriented crystalline structure in a metallic interconnect |
US6312979B1 (en) | 1998-04-28 | 2001-11-06 | Lg.Philips Lcd Co., Ltd. | Method of crystallizing an amorphous silicon layer |
US6524662B2 (en) * | 1998-07-10 | 2003-02-25 | Jin Jang | Method of crystallizing amorphous silicon layer and crystallizing apparatus thereof |
US6784034B1 (en) | 1998-10-13 | 2004-08-31 | Lg. Philips Lcd Co., Ltd. | Method for fabricating a thin film transistor |
KR100317641B1 (ko) | 1999-05-21 | 2001-12-22 | 구본준, 론 위라하디락사 | 박막 트랜지스터 및 그 제조방법 |
JP4102072B2 (ja) | 2002-01-08 | 2008-06-18 | 株式会社東芝 | 半導体装置 |
KR20090126273A (ko) * | 2007-03-28 | 2009-12-08 | 다우 코닝 코포레이션 | 실리콘 및 탄소를 함유하는 장벽층의 롤투롤 플라즈마 화학 기상 증착법 |
US9611133B2 (en) * | 2014-09-11 | 2017-04-04 | Invensense, Inc. | Film induced interface roughening and method of producing the same |
CN107112278B (zh) * | 2014-12-15 | 2021-05-04 | 应用材料公司 | 用于先进互连应用的超薄电介质扩散阻挡层与蚀刻终止层 |
WO2019177861A1 (en) | 2018-03-10 | 2019-09-19 | Applied Materials, Inc. | Method and apparatus for asymmetric selective physical vapor deposition |
US10950448B2 (en) | 2018-04-06 | 2021-03-16 | Applied Materials, Inc. | Film quality control in a linear scan physical vapor deposition process |
US10927450B2 (en) | 2018-12-19 | 2021-02-23 | Applied Materials, Inc. | Methods and apparatus for patterning substrates using asymmetric physical vapor deposition |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4125640A (en) * | 1975-04-21 | 1978-11-14 | Conant Louis A | Method of manufacturing defect free nickel armored laboratory and industrial brittleware |
GB1595659A (en) * | 1978-05-25 | 1981-08-12 | Standard Telephones Cables Ltd | Providing conductive tracks on semiconductor devices |
GB2038883B (en) * | 1978-11-09 | 1982-12-08 | Standard Telephones Cables Ltd | Metallizing semiconductor devices |
US4489102A (en) * | 1983-04-04 | 1984-12-18 | At&T Technologies, Inc. | Radiation-stimulated deposition of aluminum |
US4963423A (en) * | 1987-10-08 | 1990-10-16 | Anelva Corporation | Method for forming a thin film and apparatus of forming a metal thin film utilizing temperature controlling means |
US4923717A (en) * | 1989-03-17 | 1990-05-08 | Regents Of The University Of Minnesota | Process for the chemical vapor deposition of aluminum |
PT95232B (pt) * | 1989-09-09 | 1998-06-30 | Canon Kk | Processo de producao de uma pelicula de aluminio depositada |
-
1990
- 1990-12-21 JP JP90405190A patent/JPH04221822A/ja active Pending
-
1991
- 1991-12-19 DE DE69122069T patent/DE69122069T2/de not_active Expired - Lifetime
- 1991-12-19 EP EP91311832A patent/EP0493002B1/de not_active Expired - Lifetime
-
1992
- 1992-12-22 US US07/996,875 patent/US5364664A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69122069D1 (de) | 1996-10-17 |
EP0493002A1 (de) | 1992-07-01 |
JPH04221822A (ja) | 1992-08-12 |
US5364664A (en) | 1994-11-15 |
EP0493002B1 (de) | 1996-09-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69122069T2 (de) | Verfahren zur Herstellung eines aufgedampften Films | |
DE69106091D1 (de) | Verfahren zur Abscheidung eines dünnen Films. | |
DE69203875T2 (de) | Verfahren zur Herstellung eines chemisch adsorbierten Films. | |
DE69216747T2 (de) | Verfahren zur Bildung eines dünnen Films | |
DE69224888D1 (de) | Verfahren zur Herstellung eines chemisch adsorbierten Films | |
DE69133487T2 (de) | Verfahren zur Herstellung eines dünnen metallischen Films | |
DE69324633T2 (de) | Verfahren zur Herstellung eines einkristallinen Dünnfilmes | |
DE68920417D1 (de) | Verfahren zur Herstellung eines kohlenstoffhaltigen Films. | |
DE69418549T2 (de) | Verfahren zur Herstellung eines Partikelnfilmes | |
DE69204538D1 (de) | Verfahren zur Herstellung eines Beschichtungsfilms. | |
DE69318380T2 (de) | Verfahren zur Herstellung eines Orientierungsfilmes | |
DE69206838D1 (de) | Verfahren zur Herstellung eines chemisch absorbierten Films | |
DE69013948D1 (de) | Verfahren zur Herstellung eines dünnen Filmes. | |
DE68917016T2 (de) | Verfahren zur Herstellung eines elektrolumineszenten Films. | |
DE69326796T2 (de) | Verfahren zur Herstellung eines Bildes | |
DE69114395D1 (de) | Verfahren zur Herstellung eines Verbundfilms. | |
DE68924882T2 (de) | Verfahren zur Herstellung eines photohärtbaren Films. | |
DE69317709T2 (de) | Verfahren zur Herstellung eines photographischen Celluloseester-Filmträgers | |
DE59400729D1 (de) | Verfahren zur Herstellung eines Antikopierfilms | |
DE69007321D1 (de) | Verfahren zur Herstellung eines Films. | |
DE69103072D1 (de) | Verfahren zur Herstellung eines funktionellen Dünnfilms. | |
DE69014758D1 (de) | Verfahren zur Herstellung eines dünnen supraleitenden Films. | |
DE69705383D1 (de) | Verfahren zur Herstellung eines optischen einkristallinen Films | |
DE69219075D1 (de) | Verfahren zur Herstellung eines Oxidfilms | |
DE69003552D1 (de) | Verfahren zur herstellung eines filmkondensators. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |