DE69119506D1 - Leiterplatte mit EMI-Unterdrückung - Google Patents
Leiterplatte mit EMI-UnterdrückungInfo
- Publication number
- DE69119506D1 DE69119506D1 DE69119506T DE69119506T DE69119506D1 DE 69119506 D1 DE69119506 D1 DE 69119506D1 DE 69119506 T DE69119506 T DE 69119506T DE 69119506 T DE69119506 T DE 69119506T DE 69119506 D1 DE69119506 D1 DE 69119506D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- emi suppression
- emi
- suppression
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56162690A | 1990-08-02 | 1990-08-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69119506D1 true DE69119506D1 (de) | 1996-06-20 |
DE69119506T2 DE69119506T2 (de) | 1996-11-21 |
Family
ID=24242755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69119506T Expired - Fee Related DE69119506T2 (de) | 1990-08-02 | 1991-06-18 | Leiterplatte mit EMI-Unterdrückung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5428506A (de) |
EP (1) | EP0470031B1 (de) |
JP (1) | JPH0831705B2 (de) |
DE (1) | DE69119506T2 (de) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0589560B1 (de) * | 1992-09-23 | 1997-10-22 | The Whitaker Corporation | Vorrichtung zum Schutz gegen elektrische Überbeanspruchung |
US6835523B1 (en) | 1993-05-09 | 2004-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus for fabricating coating and method of fabricating the coating |
US5497037A (en) * | 1994-07-14 | 1996-03-05 | Advanced Micro Devices, Inc. | Method and apparatus for decoupling of unused power supply pins of a printed circuit board capable of operating at a plurality of predetermined voltages |
KR0175000B1 (ko) * | 1994-12-14 | 1999-02-01 | 윤종용 | 전자파 억제구조를 갖는 반도체 소자 |
DE19503949A1 (de) * | 1995-02-07 | 1996-08-08 | Schroff Gmbh | Mehrlagen-Leiterplatte für Schaltnetzteile |
SE506941C2 (sv) * | 1995-03-31 | 1998-03-02 | Ericsson Telefon Ab L M | Kretskort med interferensskärmande skikt |
US5736796A (en) * | 1995-05-01 | 1998-04-07 | Apple Computer, Inc. | Printed circuit board having split voltage planes |
JP2734447B2 (ja) * | 1995-09-14 | 1998-03-30 | 日本電気株式会社 | 多層プリント基板 |
US5929375A (en) * | 1996-05-10 | 1999-07-27 | Ford Motor Company | EMI protection and CTE control of three-dimensional circuitized substrates |
US5981869A (en) * | 1996-08-28 | 1999-11-09 | The Research Foundation Of State University Of New York | Reduction of switching noise in high-speed circuit boards |
US5912809A (en) * | 1997-01-21 | 1999-06-15 | Dell Usa, L.P. | Printed circuit board (PCB) including channeled capacitive plane structure |
JP3698896B2 (ja) * | 1998-07-29 | 2005-09-21 | 株式会社日立製作所 | 給電系インピーダンス低減方法および回路基板ならびに電子機器 |
US6150895A (en) * | 1999-01-25 | 2000-11-21 | Dell Usa, L.P. | Circuit board voltage plane impedance matching |
JP2001148569A (ja) * | 1999-11-19 | 2001-05-29 | Yazaki Corp | 回路形成方法 |
US6441313B1 (en) * | 1999-11-23 | 2002-08-27 | Sun Microsystems, Inc. | Printed circuit board employing lossy power distribution network to reduce power plane resonances |
JP2001156414A (ja) * | 1999-11-30 | 2001-06-08 | Yazaki Corp | 導電性ペースト及び回路形成方法 |
US6775122B1 (en) * | 1999-12-28 | 2004-08-10 | Intel Corporation | Circuit board with added impedance |
JP2001326300A (ja) * | 2000-05-18 | 2001-11-22 | Nissan Motor Co Ltd | 半導体装置 |
US6798666B1 (en) * | 2000-12-29 | 2004-09-28 | Ncr Corporation | Introducing loss in a power bus to reduce EMI and electrical noise |
US6810583B2 (en) * | 2001-08-07 | 2004-11-02 | International Business Machines Corporation | Coupling of conductive vias to complex power-signal substructures |
US6900992B2 (en) * | 2001-09-18 | 2005-05-31 | Intel Corporation | Printed circuit board routing and power delivery for high frequency integrated circuits |
JP2006506802A (ja) * | 2001-12-14 | 2006-02-23 | レアード テクノロジーズ, インコーポレイテッド | 損失媒体を含むemiシールド |
US6706974B2 (en) * | 2002-01-18 | 2004-03-16 | Intel Corporation | Plane splits filled with lossy materials |
US6873219B2 (en) | 2003-01-28 | 2005-03-29 | Hewlett-Packard Development Company, L.P. | Printed circuit board noise attenuation using lossy conductors |
US7701323B1 (en) * | 2003-05-30 | 2010-04-20 | Interconnect Portfolio Llc | Low profile discrete electronic components and applications of same |
KR100583458B1 (ko) * | 2004-01-28 | 2006-05-26 | 삼성전자주식회사 | Emi를 고려한 인쇄회로기판 |
JP4910335B2 (ja) * | 2005-08-29 | 2012-04-04 | 株式会社トッパンNecサーキットソリューションズ | 印刷配線板及び半導体集積回路装置 |
US7705691B2 (en) * | 2005-10-18 | 2010-04-27 | Agency For Science, Technology & Research | Capacitor interconnection |
US7714430B2 (en) * | 2006-09-28 | 2010-05-11 | Intel Corporation | Substrate with lossy material insert |
JP5165912B2 (ja) * | 2007-03-15 | 2013-03-21 | 株式会社日立製作所 | 低ノイズ半導体装置 |
JP5176736B2 (ja) | 2008-07-15 | 2013-04-03 | 富士ゼロックス株式会社 | プリント配線基板 |
US7525319B1 (en) * | 2008-08-28 | 2009-04-28 | International Business Machines Corporation | Method and apparatus to electrically qualify high speed PCB connectors |
EP2280589A1 (de) * | 2009-07-31 | 2011-02-02 | Telefonaktiebolaget L M Ericsson (Publ) | Elektronische Schaltung |
KR101038236B1 (ko) * | 2009-09-16 | 2011-06-01 | 삼성전기주식회사 | 전자기 밴드갭 구조를 구비하는 인쇄회로기판 |
US8869223B2 (en) | 2009-10-26 | 2014-10-21 | General Instrument Corporation | Increased cable television tap bandwidth utilizing existing tap housings |
US8646018B2 (en) * | 2009-10-26 | 2014-02-04 | General Instrument Corporation | Increased cable television tap bandwidth utilizing existing tap housings |
US8569631B2 (en) * | 2011-05-05 | 2013-10-29 | Tangitek, Llc | Noise dampening energy efficient circuit board and method for constructing and using same |
TW201316895A (zh) * | 2011-10-14 | 2013-04-16 | Hon Hai Prec Ind Co Ltd | 可抑制電磁干擾的電路板 |
JP5906736B2 (ja) * | 2011-12-28 | 2016-04-20 | 日本電気株式会社 | 配線回路基板 |
CN103379727A (zh) * | 2012-04-26 | 2013-10-30 | 鸿富锦精密工业(深圳)有限公司 | 具有静电防护结构的电路板 |
KR101926797B1 (ko) * | 2012-07-31 | 2018-12-07 | 삼성전기주식회사 | 인쇄회로기판 |
US9407558B2 (en) | 2013-05-10 | 2016-08-02 | At&T Intellectual Property I, L.P. | Method and system for automatic triggering network management control for VoIP border elements |
KR20220040804A (ko) | 2020-09-24 | 2022-03-31 | 삼성전자주식회사 | 플라즈마 처리 장치 및 플라즈마 처리 방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3189847A (en) * | 1961-05-29 | 1965-06-15 | Ibm | D. c. power distribution system |
US3904886A (en) * | 1974-02-01 | 1975-09-09 | Ibm | Voltage distribution systems for integrated circuits |
US4408255A (en) * | 1981-01-12 | 1983-10-04 | Harold Adkins | Absorptive electromagnetic shielding for high speed computer applications |
US4812792A (en) * | 1983-12-22 | 1989-03-14 | Trw Inc. | High-frequency multilayer printed circuit board |
CA1261481A (en) * | 1986-03-13 | 1989-09-26 | Kazumasa Eguchi | Printed circuit board capable of preventing electromagnetic interference |
JPH01192191A (ja) * | 1988-01-27 | 1989-08-02 | Mitsubishi Electric Corp | プリント配線基板 |
JP2629893B2 (ja) * | 1988-10-13 | 1997-07-16 | 松下電器産業株式会社 | プリント配線板 |
JPH02116199A (ja) * | 1988-10-25 | 1990-04-27 | Nec Corp | 電波吸収体 |
JP2631544B2 (ja) * | 1989-01-27 | 1997-07-16 | 日本シイエムケイ株式会社 | プリント配線板 |
US4965408A (en) * | 1989-02-01 | 1990-10-23 | Borden, Inc. | Composite sheet material for electromagnetic radiation shielding |
US4904968A (en) * | 1989-04-07 | 1990-02-27 | Tektronix, Inc. | Circuit board configuration for reducing signal distortion |
US4954929A (en) * | 1989-08-22 | 1990-09-04 | Ast Research, Inc. | Multi-layer circuit board that suppresses radio frequency interference from high frequency signals |
-
1991
- 1991-06-07 JP JP3162416A patent/JPH0831705B2/ja not_active Expired - Lifetime
- 1991-06-18 EP EP91480092A patent/EP0470031B1/de not_active Expired - Lifetime
- 1991-06-18 DE DE69119506T patent/DE69119506T2/de not_active Expired - Fee Related
-
1992
- 1992-03-13 US US07/852,826 patent/US5428506A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5428506A (en) | 1995-06-27 |
JPH0831705B2 (ja) | 1996-03-27 |
DE69119506T2 (de) | 1996-11-21 |
EP0470031A3 (en) | 1993-01-20 |
EP0470031B1 (de) | 1996-05-15 |
JPH0714018A (ja) | 1995-01-17 |
EP0470031A2 (de) | 1992-02-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |