DE69109687T2 - Flüssigkeitskühlsystem mit luftauslassmechanismus. - Google Patents
Flüssigkeitskühlsystem mit luftauslassmechanismus.Info
- Publication number
- DE69109687T2 DE69109687T2 DE69109687T DE69109687T DE69109687T2 DE 69109687 T2 DE69109687 T2 DE 69109687T2 DE 69109687 T DE69109687 T DE 69109687T DE 69109687 T DE69109687 T DE 69109687T DE 69109687 T2 DE69109687 T2 DE 69109687T2
- Authority
- DE
- Germany
- Prior art keywords
- cooling system
- air exhaust
- liquid cooling
- exhaust mechanism
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D19/00—Details
- F24D19/08—Arrangements for drainage, venting or aerating
- F24D19/082—Arrangements for drainage, venting or aerating for water heating systems
- F24D19/083—Venting arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S165/00—Heat exchange
- Y10S165/917—Pressurization and/or degassification
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/596,108 US5048599A (en) | 1990-10-11 | 1990-10-11 | Leak tolerant liquid cooling system employing an improved air purging mechanism |
PCT/US1991/007479 WO1992007454A1 (en) | 1990-10-11 | 1991-10-10 | Liquid cooling system employing air purging mechanism |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69109687D1 DE69109687D1 (de) | 1995-06-14 |
DE69109687T2 true DE69109687T2 (de) | 1996-01-25 |
Family
ID=24386009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69109687T Expired - Fee Related DE69109687T2 (de) | 1990-10-11 | 1991-10-10 | Flüssigkeitskühlsystem mit luftauslassmechanismus. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5048599A (de) |
EP (1) | EP0552258B1 (de) |
JP (1) | JP2933718B2 (de) |
DE (1) | DE69109687T2 (de) |
WO (1) | WO1992007454A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013010086A1 (de) * | 2013-06-18 | 2014-12-18 | VENSYS Elektrotechnik GmbH | Kühlvorrichtung für ein Stromumrichtermodul |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2705523A1 (fr) * | 1993-05-17 | 1994-11-25 | Olivier Andre | Installation de refroidissement, notamment pour une carte de circuit électronique. |
US5774334A (en) * | 1994-08-26 | 1998-06-30 | Hitachi, Ltd. | Low thermal resistant, fluid-cooled semiconductor module |
US6700396B1 (en) | 2001-05-16 | 2004-03-02 | Ltx Corporation | Integrated micromachine relay for automated test equipment applications |
TWI234063B (en) * | 2002-05-15 | 2005-06-11 | Matsushita Electric Ind Co Ltd | Cooling apparatus for electronic equipment |
JP3885679B2 (ja) * | 2002-06-28 | 2007-02-21 | 株式会社日立製作所 | 電子機器 |
US7310230B2 (en) * | 2003-08-21 | 2007-12-18 | Delta Design, Inc. | Temperature control system which sprays liquid coolant droplets against an IC-module at a sub-atmospheric pressure |
US7274567B2 (en) * | 2005-06-21 | 2007-09-25 | Intel Corporation | Capillary tube bubble containment in liquid cooling systems |
DE102005046112A1 (de) * | 2005-09-27 | 2007-03-29 | Thermo Electron (Karlsruhe) Gmbh | Temperiervorrichtung |
US20080101023A1 (en) * | 2006-11-01 | 2008-05-01 | Hsia-Yuan Hsu | Negative pressure pump device |
JP5194457B2 (ja) * | 2007-01-24 | 2013-05-08 | 株式会社リコー | 画像形成装置の冷却装置 |
US8875537B1 (en) * | 2007-02-14 | 2014-11-04 | Utac Thai Limited | Method of and system for cooling a singulation process |
US20080283221A1 (en) * | 2007-05-15 | 2008-11-20 | Christian Blicher Terp | Direct Air Contact Liquid Cooling System Heat Exchanger Assembly |
US8272428B2 (en) * | 2007-07-04 | 2012-09-25 | Denso Corporation | Cooling apparatus using brine |
US8449356B1 (en) | 2007-11-14 | 2013-05-28 | Utac Thai Limited | High pressure cooling nozzle for semiconductor package |
JP5403980B2 (ja) * | 2008-09-19 | 2014-01-29 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 水冷媒圧縮システムを用いた電子装置ラックの冷却を促進するための装置および方法 |
US9010141B2 (en) | 2010-04-19 | 2015-04-21 | Chilldyne, Inc. | Computer cooling system and method of use |
US20110253347A1 (en) | 2010-04-19 | 2011-10-20 | Steve Harrington | Vacuum Pumped Liquid Cooling System for Computers |
US9349679B2 (en) | 2010-08-31 | 2016-05-24 | Utac Thai Limited | Singulation method for semiconductor package with plating on side of connectors |
JP5760796B2 (ja) * | 2011-07-22 | 2015-08-12 | 富士通株式会社 | 冷却ユニット |
JP5760797B2 (ja) * | 2011-07-22 | 2015-08-12 | 富士通株式会社 | 冷却ユニット |
CA2863198C (en) * | 2012-02-14 | 2018-08-14 | Nec Corporation | Cooling apparatus and cooling system |
US8820351B1 (en) * | 2013-06-25 | 2014-09-02 | Chilldyne, Inc. | No drip hot swap connector and method of use |
TWI687639B (zh) * | 2015-06-26 | 2020-03-11 | 美商三角設計公司 | 使用改進空氣淨化機構之耐洩漏液體冷卻系統 |
US10729040B2 (en) * | 2015-09-14 | 2020-07-28 | Mitsubishi Electric Corporation | Cooler, power conversion apparatus, and cooling system |
TWM533845U (en) * | 2016-06-06 | 2016-12-11 | Cooler Master Technology Inc | Pressurized infusion device and liquid cooling system |
US10314199B2 (en) * | 2017-08-14 | 2019-06-04 | F Clay Smith, III | Conduitless, liquid phase, internal circulation, immersion cooling system |
TWI688326B (zh) * | 2018-01-17 | 2020-03-11 | 緯創資通股份有限公司 | 冷卻液補充機構及具有冷卻液補充機構的冷卻循環系統及電子設備 |
CN113513934B (zh) * | 2021-06-30 | 2022-05-06 | 西安交通大学 | 一种基于双动力驱动强化传热的重力热管 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH472793A (de) * | 1968-02-02 | 1969-05-15 | Siemens Ag Albis | Geräteschrank mit Belüftung |
US3586101A (en) * | 1969-12-22 | 1971-06-22 | Ibm | Cooling system for data processing equipment |
US3989102A (en) * | 1974-10-18 | 1976-11-02 | General Electric Company | Cooling liquid de-gassing system |
DE2638702C3 (de) * | 1976-08-27 | 1979-04-05 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Kühlvorrichtung |
DE2946226C2 (de) * | 1979-11-16 | 1986-01-30 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Kühlsystem in einem Geräte der elektrischen Nachrichtentechnik und/oder Meßtechnik aufnehmenden Gehäuse |
DE3206059C2 (de) * | 1982-02-19 | 1984-11-29 | Siemens AG, 1000 Berlin und 8000 München | Kühleinrichtung für elektrische Bauelemente |
US4698728A (en) * | 1986-10-14 | 1987-10-06 | Unisys Corporation | Leak tolerant liquid cooling system |
US4967832A (en) * | 1989-12-27 | 1990-11-06 | Nrc Corporation | Cooling method and apparatus for integrated circuit chips |
-
1990
- 1990-10-11 US US07/596,108 patent/US5048599A/en not_active Expired - Lifetime
-
1991
- 1991-10-10 JP JP3517309A patent/JP2933718B2/ja not_active Expired - Fee Related
- 1991-10-10 EP EP91919055A patent/EP0552258B1/de not_active Expired - Lifetime
- 1991-10-10 DE DE69109687T patent/DE69109687T2/de not_active Expired - Fee Related
- 1991-10-10 WO PCT/US1991/007479 patent/WO1992007454A1/en active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013010086A1 (de) * | 2013-06-18 | 2014-12-18 | VENSYS Elektrotechnik GmbH | Kühlvorrichtung für ein Stromumrichtermodul |
Also Published As
Publication number | Publication date |
---|---|
EP0552258B1 (de) | 1995-05-10 |
EP0552258A1 (de) | 1993-07-28 |
US5048599A (en) | 1991-09-17 |
DE69109687D1 (de) | 1995-06-14 |
JPH06501819A (ja) | 1994-02-24 |
JP2933718B2 (ja) | 1999-08-16 |
WO1992007454A1 (en) | 1992-04-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |