DE69034073D1 - Verfahren zur Untersuchung von inneren Drahtverbindungen und Untersuchungsvorrichtung dafür - Google Patents

Verfahren zur Untersuchung von inneren Drahtverbindungen und Untersuchungsvorrichtung dafür

Info

Publication number
DE69034073D1
DE69034073D1 DE69034073T DE69034073T DE69034073D1 DE 69034073 D1 DE69034073 D1 DE 69034073D1 DE 69034073 T DE69034073 T DE 69034073T DE 69034073 T DE69034073 T DE 69034073T DE 69034073 D1 DE69034073 D1 DE 69034073D1
Authority
DE
Germany
Prior art keywords
examination device
device therefor
wire connections
internal wire
examining internal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69034073T
Other languages
English (en)
Other versions
DE69034073T2 (de
Inventor
Kazuyuki Yamanaka
Mitsusada Shibasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69034073D1 publication Critical patent/DE69034073D1/de
Publication of DE69034073T2 publication Critical patent/DE69034073T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
DE69034073T 1989-11-24 1990-11-23 Verfahren zur Untersuchung von inneren Drahtverbindungen und Untersuchungsvorrichtung dafür Expired - Fee Related DE69034073T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30603889 1989-11-24
JP1306038A JPH06105741B2 (ja) 1989-11-24 1989-11-24 インナーリードボンディング検査方法

Publications (2)

Publication Number Publication Date
DE69034073D1 true DE69034073D1 (de) 2003-06-18
DE69034073T2 DE69034073T2 (de) 2004-01-08

Family

ID=17952315

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69034073T Expired - Fee Related DE69034073T2 (de) 1989-11-24 1990-11-23 Verfahren zur Untersuchung von inneren Drahtverbindungen und Untersuchungsvorrichtung dafür

Country Status (5)

Country Link
US (1) US5331397A (de)
EP (1) EP0430095B1 (de)
JP (1) JPH06105741B2 (de)
KR (1) KR940006087B1 (de)
DE (1) DE69034073T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2998515B2 (ja) * 1993-09-17 2000-01-11 安藤電気株式会社 測定前後のｔａｂを画像認識するｔａｂ試験装置
US6046803A (en) * 1997-05-20 2000-04-04 Hewlett-Packard Company Two and a half dimension inspection system
JP3472750B2 (ja) * 2000-04-10 2003-12-02 シーシーエス株式会社 表面検査装置
DE102005048325B4 (de) * 2005-10-08 2007-09-27 Eads Deutschland Gmbh Verfahren zur Nieterkennung sowie Vorrichtung zur Durchführung des Verfahrens
JP2018140469A (ja) * 2017-02-28 2018-09-13 株式会社ディスコ 被加工物の検査方法、被加工物の検査装置及び加工装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3877814A (en) * 1973-02-07 1975-04-15 Ppg Industries Inc Method of and apparatus for detecting concave and convex portions in a specular surface
JPS523487A (en) * 1975-06-26 1977-01-11 Mitsubishi Electric Corp Testing method and device of the bonding quality on the electric part of metal
US4242702A (en) * 1976-12-01 1980-12-30 Hitachi, Ltd. Apparatus for automatically checking external appearance of object
US4215939A (en) * 1977-12-22 1980-08-05 Owens-Illinois, Inc. Glue drop detector
JPS56164545A (en) * 1980-05-21 1981-12-17 Hitachi Ltd Pellet bonding inspection and device therefor
US4583861A (en) * 1981-08-12 1986-04-22 Tokyo Shibaura Denki Kabushiki Kaisha Surface condition judging apparatus
JPH0722166B2 (ja) * 1982-09-22 1995-03-08 株式会社東芝 ダイボンダ等におけるペレツト認識方法
EP0146005B1 (de) * 1983-11-26 1991-08-28 Kabushiki Kaisha Toshiba Apparat zum Nachweis von Oberflächenfehlern
JPS61147542A (ja) * 1984-12-21 1986-07-05 Toshiba Seiki Kk 良品ペレツトの判別装置
JPS61293657A (ja) * 1985-06-21 1986-12-24 Matsushita Electric Works Ltd 半田付け外観検査方法
JPH0666370B2 (ja) * 1987-04-14 1994-08-24 株式会社東芝 半導体デバイス用外観検査装置
US4876455A (en) * 1988-02-25 1989-10-24 Westinghouse Electric Corp. Fiber optic solder joint inspection system
US5030008A (en) * 1988-10-11 1991-07-09 Kla Instruments, Corporation Method and apparatus for the automated analysis of three-dimensional objects
JP2751435B2 (ja) * 1989-07-17 1998-05-18 松下電器産業株式会社 電子部品の半田付状態の検査方法

Also Published As

Publication number Publication date
EP0430095B1 (de) 2003-05-14
EP0430095A3 (en) 1991-07-17
EP0430095A2 (de) 1991-06-05
US5331397A (en) 1994-07-19
KR910010660A (ko) 1991-06-29
JPH03165539A (ja) 1991-07-17
DE69034073T2 (de) 2004-01-08
JPH06105741B2 (ja) 1994-12-21
KR940006087B1 (ko) 1994-07-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee