DE69031103D1 - Verfahren zur Herstellung einer Ohmschen Elektrode auf einer GaAlAs Schicht - Google Patents
Verfahren zur Herstellung einer Ohmschen Elektrode auf einer GaAlAs SchichtInfo
- Publication number
- DE69031103D1 DE69031103D1 DE69031103T DE69031103T DE69031103D1 DE 69031103 D1 DE69031103 D1 DE 69031103D1 DE 69031103 T DE69031103 T DE 69031103T DE 69031103 T DE69031103 T DE 69031103T DE 69031103 D1 DE69031103 D1 DE 69031103D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- ohmic electrode
- gaalas layer
- gaalas
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/452—Ohmic electrodes on AIII-BV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1225903A JP2907452B2 (ja) | 1989-08-30 | 1989-08-30 | 化合物半導体用電極 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69031103D1 true DE69031103D1 (de) | 1997-08-28 |
DE69031103T2 DE69031103T2 (de) | 1998-01-22 |
Family
ID=16836695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69031103T Expired - Fee Related DE69031103T2 (de) | 1989-08-30 | 1990-08-29 | Verfahren zur Herstellung einer Ohmschen Elektrode auf einer GaAlAs Schicht |
Country Status (4)
Country | Link |
---|---|
US (2) | US5192994A (de) |
EP (1) | EP0419062B1 (de) |
JP (1) | JP2907452B2 (de) |
DE (1) | DE69031103T2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69128123T2 (de) * | 1990-08-31 | 1998-03-05 | Texas Instruments Inc | Verfahren zum Herstellen selbst-ausrichtender bipolarer Transistoren mit Heteroübergang |
US5317190A (en) * | 1991-10-25 | 1994-05-31 | International Business Machines Corporation | Oxygen assisted ohmic contact formation to N-type gallium arsenide |
US5633047A (en) * | 1994-02-22 | 1997-05-27 | International Business Machines Corporation | Electronic devices having metallurgies containing copper-semiconductor compounds |
DE4405716C2 (de) * | 1994-02-23 | 1996-10-31 | Telefunken Microelectron | Verfahren zur Herstellung von ohmschen Kontakten für Verbindungshalbleiter |
US5523623A (en) * | 1994-03-09 | 1996-06-04 | Matsushita Electric Industrial Co., Ltd. | Ohmic electrode for a p-type compound semiconductor and a bipolar transistor incorporating the ohmic electrode |
US5550081A (en) * | 1994-04-08 | 1996-08-27 | Board Of Trustees Of The University Of Illinois | Method of fabricating a semiconductor device by oxidizing aluminum-bearing 1H-V semiconductor in water vapor environment |
US5924002A (en) * | 1994-12-22 | 1999-07-13 | Sony Corporation | Method of manufacturing a semiconductor device having ohmic electrode |
DE19958096B4 (de) * | 1999-12-02 | 2012-04-19 | Telefonaktiebolaget Lm Ericsson (Publ) | Verfahren zum Entwerfen einer Filterschaltung |
WO2002031865A1 (en) | 2000-10-13 | 2002-04-18 | Emcore Corporation | Method of making an electrode |
KR100955953B1 (ko) * | 2007-10-31 | 2010-05-03 | 주식회사 부강시너지 | 배수로용 블록 |
DE102013104953B4 (de) * | 2013-05-14 | 2023-03-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
RU2757176C1 (ru) * | 2021-03-31 | 2021-10-11 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Чеченский государственный университет" | Способ изготовления полупроводникового прибора с многослойными проводниками |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5522938B2 (de) * | 1973-03-09 | 1980-06-19 | ||
JPS5736749B2 (de) * | 1973-09-26 | 1982-08-05 | ||
DE2359640C2 (de) * | 1973-11-30 | 1983-09-15 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Elektrischer Anschlußkontakt an einen Halbleiterkörper und Verwendung |
JPS5394873A (en) * | 1977-01-31 | 1978-08-19 | Mitsubishi Electric Corp | Manufacture of ohmic contact electrode |
JPS5530834A (en) * | 1978-08-25 | 1980-03-04 | Nec Corp | Method of forming ohmic contact in semiconductor pellet |
JPS59500542A (ja) * | 1982-04-12 | 1984-03-29 | モトロ−ラ・インコ−ポレ−テツド | N型GaAs用のオ−ム接触装置 |
US4853346A (en) * | 1987-12-31 | 1989-08-01 | International Business Machines Corporation | Ohmic contacts for semiconductor devices and method for forming ohmic contacts |
US4927782A (en) * | 1989-06-27 | 1990-05-22 | The United States Of America As Represented By The Secretary Of The Navy | Method of making self-aligned GaAs/AlGaAs FET's |
-
1989
- 1989-08-30 JP JP1225903A patent/JP2907452B2/ja not_active Expired - Fee Related
-
1990
- 1990-08-28 US US07/573,756 patent/US5192994A/en not_active Expired - Fee Related
- 1990-08-29 EP EP90309456A patent/EP0419062B1/de not_active Expired - Lifetime
- 1990-08-29 DE DE69031103T patent/DE69031103T2/de not_active Expired - Fee Related
-
1992
- 1992-10-26 US US07/966,535 patent/US5284798A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5284798A (en) | 1994-02-08 |
US5192994A (en) | 1993-03-09 |
JP2907452B2 (ja) | 1999-06-21 |
EP0419062A3 (en) | 1993-08-25 |
EP0419062A2 (de) | 1991-03-27 |
DE69031103T2 (de) | 1998-01-22 |
JPH0387066A (ja) | 1991-04-11 |
EP0419062B1 (de) | 1997-07-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |