DE69029696T2 - Verfahren zur Behandlung einer Kupferfolienoberfläche - Google Patents
Verfahren zur Behandlung einer KupferfolienoberflächeInfo
- Publication number
- DE69029696T2 DE69029696T2 DE69029696T DE69029696T DE69029696T2 DE 69029696 T2 DE69029696 T2 DE 69029696T2 DE 69029696 T DE69029696 T DE 69029696T DE 69029696 T DE69029696 T DE 69029696T DE 69029696 T2 DE69029696 T2 DE 69029696T2
- Authority
- DE
- Germany
- Prior art keywords
- treating
- copper foil
- foil surface
- copper
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
- C23C28/3225—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only with at least one zinc-based layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
- C23C28/3455—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- Ceramic Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Chemical Treatment Of Metals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1235166A JP2772684B2 (ja) | 1989-09-11 | 1989-09-11 | 銅箔の表面処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69029696D1 DE69029696D1 (de) | 1997-02-27 |
DE69029696T2 true DE69029696T2 (de) | 1997-08-07 |
Family
ID=16982037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69029696T Expired - Fee Related DE69029696T2 (de) | 1989-09-11 | 1990-03-01 | Verfahren zur Behandlung einer Kupferfolienoberfläche |
Country Status (5)
Country | Link |
---|---|
US (1) | US5096546A (de) |
EP (1) | EP0417880B1 (de) |
JP (1) | JP2772684B2 (de) |
DE (1) | DE69029696T2 (de) |
MY (1) | MY105604A (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW289900B (de) | 1994-04-22 | 1996-11-01 | Gould Electronics Inc | |
JPH0824019A (ja) * | 1994-07-18 | 1996-01-30 | Ykk Kk | 装身具 |
US6803528B1 (en) * | 1999-11-05 | 2004-10-12 | 3M Innovative Properties Company | Multi-layer double-sided wiring board and method of fabricating the same |
US9647272B1 (en) | 2016-01-14 | 2017-05-09 | Chang Chun Petrochemical Co., Ltd. | Surface-treated copper foil |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3585010A (en) * | 1968-10-03 | 1971-06-15 | Clevite Corp | Printed circuit board and method of making same |
EP0072830B2 (de) * | 1981-02-26 | 1989-04-19 | Electrofoils Technology Limited | Verfahren zur behandlung von kupferfolie |
EP0112635B1 (de) * | 1982-12-01 | 1987-04-22 | Electrofoils Technology Limited | Behandlung einer Kupferfolie |
GB8623252D0 (en) * | 1986-09-26 | 1986-10-29 | Cookson Group Plc | Treatment of copper foil |
JPH0633467B2 (ja) * | 1989-05-02 | 1994-05-02 | 日紘グールド・フォイル株式会社 | 圧延銅箔の表面処理方法 |
-
1989
- 1989-09-11 JP JP1235166A patent/JP2772684B2/ja not_active Expired - Fee Related
- 1989-12-07 MY MYPI89001718A patent/MY105604A/en unknown
-
1990
- 1990-02-28 US US07/486,390 patent/US5096546A/en not_active Expired - Fee Related
- 1990-03-01 EP EP90302176A patent/EP0417880B1/de not_active Expired - Lifetime
- 1990-03-01 DE DE69029696T patent/DE69029696T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
MY105604A (en) | 1994-11-30 |
EP0417880A1 (de) | 1991-03-20 |
US5096546A (en) | 1992-03-17 |
JPH0397876A (ja) | 1991-04-23 |
EP0417880B1 (de) | 1997-01-15 |
JP2772684B2 (ja) | 1998-07-02 |
DE69029696D1 (de) | 1997-02-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3874867D1 (de) | Verfahren zur behandlung einer kupferoberflaeche. | |
DE69325252D1 (de) | Verfahren zur Behandlung einer Oberfläche | |
DE69420339T2 (de) | Verfahren zur Behandlung einer Flüssigkeit | |
DE69208324T2 (de) | Verfahren zur Oberflächenbehandlung einer Kupferfolie für gedruckte Schaltungen | |
DE69124672T2 (de) | Verfahren zur Substratbearbeitung | |
DE69514311T2 (de) | Verfahren zur Oberflächen-Aufrauhung von Kupferfolie | |
DE3677050D1 (de) | Verfahren zur behandlung einer polymeren aufschlaemmung. | |
DE69033663D1 (de) | Verfahren zur Behandlung eines Aluminium enthaltenden Musters | |
DE69032793T2 (de) | Verfahren zum Herstellen einer Karte | |
DE69409066D1 (de) | Verfahren zur Behandlung einer Oberfläche | |
DE69016076D1 (de) | Verfahren zur Behandlung einer Metallfläche. | |
DE69122910T2 (de) | Verfahren zur Kupfer-Elektroplattierung | |
DE69521079T2 (de) | Verfahren zur Behandlung einer photographischen Schmutzlösung | |
DE3867171D1 (de) | Verfahren zur behandlung einer fluessigkeit. | |
DE69028174T2 (de) | Verfahren zum Beschichten | |
DE69029696D1 (de) | Verfahren zur Behandlung einer Kupferfolienoberfläche | |
DE69019264D1 (de) | Verfahren zur Behandlung einer Goldplattierungsschicht. | |
DE59610899D1 (de) | Verfahren zur Behandlung einer siegelfähigen Folienoberfläche | |
DE69307555T2 (de) | Verfahren zur Verbesserung einer schonenden Oxidation | |
DE68917840D1 (de) | Verfahren zum Herstellen einer dielektrischen Schicht. | |
DE3788708D1 (de) | Verfahren zur Behandlung einer Plattierungslösung. | |
DE69025221T2 (de) | Verfahren zur Herstellung elektronischer Vorrichtungen | |
DE59104091D1 (de) | Verfahren zum herstellen einer schaltung. | |
DE69207579T2 (de) | Verfahren zur Herstellung einer Kupfer-durchkontaktierten Leiterplatte | |
DE69332515D1 (de) | Verfahren zur Dielektrikum-Entfernung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |