DE69024710T2 - Verfahren zur Herstellung von metallbeschichteten Kunststoffgegenständen - Google Patents

Verfahren zur Herstellung von metallbeschichteten Kunststoffgegenständen

Info

Publication number
DE69024710T2
DE69024710T2 DE69024710T DE69024710T DE69024710T2 DE 69024710 T2 DE69024710 T2 DE 69024710T2 DE 69024710 T DE69024710 T DE 69024710T DE 69024710 T DE69024710 T DE 69024710T DE 69024710 T2 DE69024710 T2 DE 69024710T2
Authority
DE
Germany
Prior art keywords
resin molded
disclosed
molded article
resin composition
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69024710T
Other languages
English (en)
Other versions
DE69024710D1 (de
Inventor
Fumitoshi Ikerjiri
Sanehiro Yamamoto
Keiji Kawamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP02161569A external-priority patent/JP3009707B2/ja
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Publication of DE69024710D1 publication Critical patent/DE69024710D1/de
Application granted granted Critical
Publication of DE69024710T2 publication Critical patent/DE69024710T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
DE69024710T 1989-07-07 1990-07-05 Verfahren zur Herstellung von metallbeschichteten Kunststoffgegenständen Expired - Fee Related DE69024710T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP17605989 1989-07-07
JP23240489 1989-09-07
JP02161569A JP3009707B2 (ja) 1989-07-07 1990-06-20 メッキ層形成用樹脂組成物およびその用途

Publications (2)

Publication Number Publication Date
DE69024710D1 DE69024710D1 (de) 1996-02-22
DE69024710T2 true DE69024710T2 (de) 1996-06-05

Family

ID=27321879

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69024710T Expired - Fee Related DE69024710T2 (de) 1989-07-07 1990-07-05 Verfahren zur Herstellung von metallbeschichteten Kunststoffgegenständen

Country Status (4)

Country Link
EP (1) EP0406859B1 (de)
AT (1) ATE132885T1 (de)
CA (1) CA2020606C (de)
DE (1) DE69024710T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60032053T2 (de) 1999-04-28 2007-04-12 Neomax Co., Ltd., Osaka Verfahren zur Herstellung von einem metallbeschichteten Kunststoffteil
US20100159260A1 (en) * 2008-12-23 2010-06-24 E. I. Du Pont De Nemours And Company Chrome-free method of conditioning and etching of a thermoplastic substrate for metal plating
US20110287272A1 (en) * 2008-12-23 2011-11-24 E.I.Du Pont De Nemours And Company Polymer compositions for metal coating, articles made therefrom and process for same
US8207261B2 (en) * 2009-03-25 2012-06-26 E.I. Du Pont De Nemours And Company Plastic articles, optionally with partial metal coating
US20110274944A1 (en) * 2010-05-10 2011-11-10 Andri Elia Elia Polymeric Article Having A Surface Of Different Composition Than Its Bulk And Of Increased Bonding Strength To A Coated Metal Layer

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953536A (ja) * 1982-09-20 1984-03-28 Mitsui Petrochem Ind Ltd 成形用ポリアミド組成物
US4552626A (en) * 1984-11-19 1985-11-12 Michael Landney, Jr. Metal plating of polyamide thermoplastics

Also Published As

Publication number Publication date
CA2020606C (en) 1998-05-12
EP0406859A3 (en) 1991-08-28
CA2020606A1 (en) 1991-01-08
DE69024710D1 (de) 1996-02-22
EP0406859A2 (de) 1991-01-09
ATE132885T1 (de) 1996-01-15
EP0406859B1 (de) 1996-01-10

Similar Documents

Publication Publication Date Title
JPS6461087A (en) Resin composition for printed wiring board
SE8503073L (sv) Sett att metallpletera polyamidmaterial
TW346710B (en) Magnetic prepreg and process making the same, and printed wiring base plate made with the process thereof
DE3484570D1 (de) Zusammengesetzte leiterplatte mit metallmusterlagen und verfahren zur herstellung.
EP0487854A3 (en) Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom
DE69024710D1 (de) Verfahren zur Herstellung von metallbeschichteten Kunststoffgegenständen
FR2704567B1 (fr) Procede de preparation d'une nappe de materiau poreux revetue d'un polymere conducteur electronique et produit obtenu par ce procede.
ATE130242T1 (de) Gegossene gegenstände aus polybutylenterephthalat mit einer gemusterten oberfläche und verfahren zu deren herstellung.
DE69022325D1 (de) Gegossene Gegenstände aus Polybutylenterephthalat mit mit Mustern versehenen Flächen und Verfahren zu deren Herstellung.
SG92768A1 (en) Method for partially plating on a base
DE3887969D1 (de) Verfahren zur Herstellung eines Kunststoff-Artikels mit metallisierter Oberfläche.
DE69220588D1 (de) Verfahren zur Herstellung eines mit einer dünnen Kupferfolie kaschierten Substrats für Leiterplatten
DE69026871T2 (de) Verfahren zur Herstellung von Formkörpern für feine Präzisionsleiterbahnen
ATE118148T1 (de) Verfahren zur herstellung von platten für feine präzisionsschaltkreise.
ATE127722T1 (de) Gemusterte gegenstände, geformt aus polybutylenterephthalatharz und verfahren zum herstellen solcher gegenstände.
DE3884330T2 (de) Verfahren zur Herstellung eines aus thermoplastischem Harz gegossenen Artikels.
KR890011502A (ko) 성형된 인쇄회로기판 및 그 용도
KR910003016A (ko) 도금층 형성용 수지조성물 및 그의 용도
EP0711102A4 (de) Verfahren zur herstellung einer leitenden schaltung auf der oberfläche eines formkörpers und komponente mit einer leitenden schaltung
Cleveland et al. Molded Articles Suitable for Adherent Metallization, Molded Metallized Articles and Processes for Making the Same
SE9600169L (sv) Metod för framställning av homogena dekorativa ytskikt med elektronstrålehärdande lack
JP2533322B2 (ja) 回路基板の製法
TW239914B (en) Composite substrate for preparation of printed circuits
DE69026175D1 (de) Verfahren zur Herstellung eines geformten Gegenstands aus Polyimid
Steffen Semi-Additive Process for Manufacturing Printed Circuit-Boards

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: MITSUI CHEMICALS, INC., TOKIO/TOKYO, JP

8339 Ceased/non-payment of the annual fee