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Publication of TW239914BpublicationCriticalpatent/TW239914B/en
Substrates for printed circuit boards and the like, in the form of a substrate base layer and at least one adherent layer fixedly attached thereto. The adherent layer preferably comprises a thermoplastic material having a glass transition temperature in the range of about 180 deg.C and about 245 deg.C, or a thermosetting material capable of B-stage curing. The preparation of the novel substrates and printed circuits using the substrates and conductive traces formed with electrically-conductive ink compositions is also described.
TW82109095A1992-06-231993-10-30Composite substrate for preparation of printed circuits
TW239914B
(en)
Curable resin composition modified with a cyanate ester and varnish made therefrom, prepreg, metal-coated layer plate, film, printed circuit board and multilayer circuit board