TW239914B - Composite substrate for preparation of printed circuits - Google Patents

Composite substrate for preparation of printed circuits

Info

Publication number
TW239914B
TW239914B TW82109095A TW82109095A TW239914B TW 239914 B TW239914 B TW 239914B TW 82109095 A TW82109095 A TW 82109095A TW 82109095 A TW82109095 A TW 82109095A TW 239914 B TW239914 B TW 239914B
Authority
TW
Taiwan
Prior art keywords
preparation
substrates
printed circuits
composite substrate
adherent layer
Prior art date
Application number
TW82109095A
Other languages
Chinese (zh)
Inventor
Albert Capote Miguel
George Todd Michael
Original Assignee
Toranaga Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toranaga Technologies Inc filed Critical Toranaga Technologies Inc
Application granted granted Critical
Publication of TW239914B publication Critical patent/TW239914B/en

Links

Abstract

Substrates for printed circuit boards and the like, in the form of a substrate base layer and at least one adherent layer fixedly attached thereto. The adherent layer preferably comprises a thermoplastic material having a glass transition temperature in the range of about 180 deg.C and about 245 deg.C, or a thermosetting material capable of B-stage curing. The preparation of the novel substrates and printed circuits using the substrates and conductive traces formed with electrically-conductive ink compositions is also described.
TW82109095A 1992-06-23 1993-10-30 Composite substrate for preparation of printed circuits TW239914B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US90304292A 1992-06-23 1992-06-23

Publications (1)

Publication Number Publication Date
TW239914B true TW239914B (en) 1995-02-01

Family

ID=51400822

Family Applications (1)

Application Number Title Priority Date Filing Date
TW82109095A TW239914B (en) 1992-06-23 1993-10-30 Composite substrate for preparation of printed circuits

Country Status (1)

Country Link
TW (1) TW239914B (en)

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