DE69024077T2 - Einrichtung und Verfahren zur Behandlung von Halbleiterscheiben - Google Patents
Einrichtung und Verfahren zur Behandlung von HalbleiterscheibenInfo
- Publication number
- DE69024077T2 DE69024077T2 DE69024077T DE69024077T DE69024077T2 DE 69024077 T2 DE69024077 T2 DE 69024077T2 DE 69024077 T DE69024077 T DE 69024077T DE 69024077 T DE69024077 T DE 69024077T DE 69024077 T2 DE69024077 T2 DE 69024077T2
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor wafers
- treating semiconductor
- treating
- wafers
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 235000012431 wafers Nutrition 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/005—Oxydation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/011—Bipolar transistors
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/311,686 US5167717A (en) | 1989-02-15 | 1989-02-15 | Apparatus and method for processing a semiconductor wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69024077D1 DE69024077D1 (de) | 1996-01-25 |
DE69024077T2 true DE69024077T2 (de) | 1996-05-09 |
Family
ID=23208000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69024077T Expired - Fee Related DE69024077T2 (de) | 1989-02-15 | 1990-01-29 | Einrichtung und Verfahren zur Behandlung von Halbleiterscheiben |
Country Status (4)
Country | Link |
---|---|
US (2) | US5167717A (de) |
EP (1) | EP0386447B1 (de) |
JP (1) | JPH0727895B2 (de) |
DE (1) | DE69024077T2 (de) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5167717A (en) * | 1989-02-15 | 1992-12-01 | Charles Boitnott | Apparatus and method for processing a semiconductor wafer |
US5167716A (en) * | 1990-09-28 | 1992-12-01 | Gasonics, Inc. | Method and apparatus for batch processing a semiconductor wafer |
JP3207943B2 (ja) * | 1992-11-17 | 2001-09-10 | 忠弘 大見 | 低温酸化膜形成装置および低温酸化膜形成方法 |
JPH06188413A (ja) * | 1992-12-17 | 1994-07-08 | Shin Etsu Handotai Co Ltd | Mos型半導体装置の製造方法 |
US5424097A (en) * | 1993-09-30 | 1995-06-13 | Specialty Coating Systems, Inc. | Continuous vapor deposition apparatus |
US5525159A (en) * | 1993-12-17 | 1996-06-11 | Tokyo Electron Limited | Plasma process apparatus |
US5879808A (en) * | 1995-10-27 | 1999-03-09 | Alpha Metals, Inc. | Parylene polymer layers |
US5536319A (en) * | 1995-10-27 | 1996-07-16 | Specialty Coating Systems, Inc. | Parylene deposition apparatus including an atmospheric shroud and inert gas source |
US5846888A (en) * | 1996-09-27 | 1998-12-08 | Micron Technology, Inc. | Method for in-situ incorporation of desirable impurities into high pressure oxides |
US5806319A (en) * | 1997-03-13 | 1998-09-15 | Wary; John | Method and apparatus for cryogenically cooling a deposition chamber |
US5841005A (en) * | 1997-03-14 | 1998-11-24 | Dolbier, Jr.; William R. | Parylene AF4 synthesis |
US6051276A (en) * | 1997-03-14 | 2000-04-18 | Alpha Metals, Inc. | Internally heated pyrolysis zone |
US6146469A (en) * | 1998-02-25 | 2000-11-14 | Gamma Precision Technology | Apparatus and method for cleaning semiconductor wafers |
US6372520B1 (en) | 1998-07-10 | 2002-04-16 | Lsi Logic Corporation | Sonic assisted strengthening of gate oxides |
US6303908B1 (en) * | 1999-08-26 | 2001-10-16 | Nichiyo Engineering Corporation | Heat treatment apparatus |
US6705432B2 (en) * | 2001-11-09 | 2004-03-16 | Lincoln Industrial Corporation | Lubricant injection |
JP3609077B1 (ja) * | 2003-07-09 | 2005-01-12 | 東京エレクトロン株式会社 | 高圧熱処理装置 |
US7110665B2 (en) * | 2003-10-01 | 2006-09-19 | Canon Kabushiki Kaisha | Thermal treatment equipment, thermal treatment method and manufacturing method of image display apparatus |
US20070187386A1 (en) * | 2006-02-10 | 2007-08-16 | Poongsan Microtec Corporation | Methods and apparatuses for high pressure gas annealing |
JP5636575B2 (ja) * | 2013-08-28 | 2014-12-10 | 株式会社ユーテック | 水蒸気加圧急速加熱装置及び酸化物材料膜の製造方法 |
US10224224B2 (en) * | 2017-03-10 | 2019-03-05 | Micromaterials, LLC | High pressure wafer processing systems and related methods |
US10622214B2 (en) | 2017-05-25 | 2020-04-14 | Applied Materials, Inc. | Tungsten defluorination by high pressure treatment |
JP6947914B2 (ja) | 2017-08-18 | 2021-10-13 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 高圧高温下のアニールチャンバ |
US10276411B2 (en) | 2017-08-18 | 2019-04-30 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
CN111095524B (zh) | 2017-09-12 | 2023-10-03 | 应用材料公司 | 用于使用保护阻挡物层制造半导体结构的设备和方法 |
KR102585074B1 (ko) | 2017-11-11 | 2023-10-04 | 마이크로머티어리얼즈 엘엘씨 | 고압 프로세싱 챔버를 위한 가스 전달 시스템 |
WO2019099255A2 (en) | 2017-11-17 | 2019-05-23 | Applied Materials, Inc. | Condenser system for high pressure processing system |
SG11202008256WA (en) | 2018-03-09 | 2020-09-29 | Applied Materials Inc | High pressure annealing process for metal containing materials |
US10950429B2 (en) | 2018-05-08 | 2021-03-16 | Applied Materials, Inc. | Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom |
US10748783B2 (en) | 2018-07-25 | 2020-08-18 | Applied Materials, Inc. | Gas delivery module |
US10675581B2 (en) | 2018-08-06 | 2020-06-09 | Applied Materials, Inc. | Gas abatement apparatus |
CN112996950B (zh) | 2018-11-16 | 2024-04-05 | 应用材料公司 | 使用增强扩散工艺的膜沉积 |
WO2020117462A1 (en) | 2018-12-07 | 2020-06-11 | Applied Materials, Inc. | Semiconductor processing system |
US11901222B2 (en) | 2020-02-17 | 2024-02-13 | Applied Materials, Inc. | Multi-step process for flowable gap-fill film |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3666546A (en) * | 1970-05-01 | 1972-05-30 | Cogar Corp | Ion-free insulating layers |
US4018184A (en) * | 1975-07-28 | 1977-04-19 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for treatment of semiconductor wafer |
US4154192A (en) * | 1976-12-10 | 1979-05-15 | Mitsubishi Denki Kabushiki Kaisha | Manufacturing apparatus for semiconductor devices |
US4268538A (en) * | 1977-03-09 | 1981-05-19 | Atomel Corporation | High-pressure, high-temperature gaseous chemical method for silicon oxidation |
US4167915A (en) * | 1977-03-09 | 1979-09-18 | Atomel Corporation | High-pressure, high-temperature gaseous chemical apparatus |
US4275094A (en) * | 1977-10-31 | 1981-06-23 | Fujitsu Limited | Process for high pressure oxidation of silicon |
US4253417A (en) * | 1980-02-21 | 1981-03-03 | Thermco Products Corporation | Closure for thermal reactor |
US4315479A (en) * | 1980-06-27 | 1982-02-16 | Atomel Corporation | Silicon wafer steam oxidizing apparatus |
US4351805A (en) * | 1981-04-06 | 1982-09-28 | International Business Machines Corporation | Single gas flow elevated pressure reactor |
US4634331A (en) * | 1982-05-24 | 1987-01-06 | Varian Associates, Inc. | Wafer transfer system |
JPS5982731A (ja) * | 1982-11-04 | 1984-05-12 | Toshiba Corp | ウエハ水蒸気酸化装置 |
FR2571892B1 (fr) * | 1984-10-17 | 1987-09-04 | Buevoz Jean Louis | Four d'oxydation de plaquettes en materiau semi-conducteur |
US4599247A (en) * | 1985-01-04 | 1986-07-08 | Texas Instruments Incorporated | Semiconductor processing facility for providing enhanced oxidation rate |
US4606935A (en) * | 1985-10-10 | 1986-08-19 | International Business Machines Corporation | Process and apparatus for producing high purity oxidation on a semiconductor substrate |
US5167717A (en) * | 1989-02-15 | 1992-12-01 | Charles Boitnott | Apparatus and method for processing a semiconductor wafer |
US4920918A (en) * | 1989-04-18 | 1990-05-01 | Applied Materials, Inc. | Pressure-resistant thermal reactor system for semiconductor processing |
-
1989
- 1989-02-15 US US07/311,686 patent/US5167717A/en not_active Expired - Fee Related
-
1990
- 1990-01-29 DE DE69024077T patent/DE69024077T2/de not_active Expired - Fee Related
- 1990-01-29 EP EP90101754A patent/EP0386447B1/de not_active Expired - Lifetime
- 1990-02-15 JP JP2035041A patent/JPH0727895B2/ja not_active Expired - Lifetime
-
1992
- 1992-09-11 US US07/943,996 patent/US5314846A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69024077D1 (de) | 1996-01-25 |
JPH02271529A (ja) | 1990-11-06 |
JPH0727895B2 (ja) | 1995-03-29 |
EP0386447A3 (en) | 1990-12-05 |
US5167717A (en) | 1992-12-01 |
US5314846A (en) | 1994-05-24 |
EP0386447A2 (de) | 1990-09-12 |
EP0386447B1 (de) | 1995-12-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |