DE69007516T2 - Kapazitiver Halbleitersensor mit gelenkig verbundener Membran für ebene Bewegung. - Google Patents

Kapazitiver Halbleitersensor mit gelenkig verbundener Membran für ebene Bewegung.

Info

Publication number
DE69007516T2
DE69007516T2 DE69007516T DE69007516T DE69007516T2 DE 69007516 T2 DE69007516 T2 DE 69007516T2 DE 69007516 T DE69007516 T DE 69007516T DE 69007516 T DE69007516 T DE 69007516T DE 69007516 T2 DE69007516 T2 DE 69007516T2
Authority
DE
Germany
Prior art keywords
semiconductor sensor
flat movement
capacitive semiconductor
articulated
membrane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69007516T
Other languages
English (en)
Other versions
DE69007516D1 (de
Inventor
Daniel H Grantham
James L Swindal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Breed Automotive Technology Inc
Original Assignee
United Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Technologies Corp filed Critical United Technologies Corp
Publication of DE69007516D1 publication Critical patent/DE69007516D1/de
Application granted granted Critical
Publication of DE69007516T2 publication Critical patent/DE69007516T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
DE69007516T 1989-02-28 1990-01-24 Kapazitiver Halbleitersensor mit gelenkig verbundener Membran für ebene Bewegung. Expired - Fee Related DE69007516T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/317,236 US4998179A (en) 1989-02-28 1989-02-28 Capacitive semiconductive sensor with hinged diaphragm for planar movement

Publications (2)

Publication Number Publication Date
DE69007516D1 DE69007516D1 (de) 1994-04-28
DE69007516T2 true DE69007516T2 (de) 1994-08-04

Family

ID=23232735

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69007516T Expired - Fee Related DE69007516T2 (de) 1989-02-28 1990-01-24 Kapazitiver Halbleitersensor mit gelenkig verbundener Membran für ebene Bewegung.

Country Status (8)

Country Link
US (1) US4998179A (de)
EP (1) EP0385574B1 (de)
JP (1) JP2918272B2 (de)
KR (1) KR0137931B1 (de)
BR (1) BR9000734A (de)
CA (1) CA2010803C (de)
DE (1) DE69007516T2 (de)
IL (1) IL93540A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011085332A1 (de) * 2011-10-27 2013-05-02 Continental Teves Ag & Co. Ohg Drucksensor
DE102015216626A1 (de) * 2015-08-31 2017-03-02 Siemens Aktiengesellschaft Drucksensoranordnung sowie Messumformer zur Prozessinstrumentierung mit einer derartigen Drucksensoranordnung

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4998179A (en) * 1989-02-28 1991-03-05 United Technologies Corporation Capacitive semiconductive sensor with hinged diaphragm for planar movement
FR2656687B1 (fr) * 1989-12-28 1994-07-22 Vectavib Procede de montage d'une piece mecanique comportant un element sensible definissant, avec un support, un condensateur variable, piece mecanique et outil pour sa mise en óoeuvre.
JP2517467B2 (ja) * 1990-10-05 1996-07-24 山武ハネウエル株式会社 静電容量式圧力センサ
GB9111838D0 (en) * 1991-06-01 1991-07-24 Buttwell Limited Treating biomass material
JP3289196B2 (ja) * 1991-06-27 2002-06-04 ドレッサ・ナガノ、インク 変換器の全非直線性を低減する方法及び変換器の非直線性を低減する方法
US5381299A (en) * 1994-01-28 1995-01-10 United Technologies Corporation Capacitive pressure sensor having a substrate with a curved mesa
US5744725A (en) * 1994-04-18 1998-04-28 Motorola Inc. Capacitive pressure sensor and method of fabricating same
JP2935812B2 (ja) * 1994-07-14 1999-08-16 三井金属鉱業株式会社 車両扉用ストライカー装置およびその製造方法
JP3114570B2 (ja) * 1995-05-26 2000-12-04 オムロン株式会社 静電容量型圧力センサ
US6058780A (en) * 1997-03-20 2000-05-09 Alliedsignal Inc. Capacitive pressure sensor housing having a ceramic base
US6324914B1 (en) 1997-03-20 2001-12-04 Alliedsignal, Inc. Pressure sensor support base with cavity
US6387318B1 (en) 1997-12-05 2002-05-14 Alliedsignal, Inc. Glass-ceramic pressure sensor support base and its fabrication
DE69922727T2 (de) 1998-03-31 2005-12-15 Hitachi, Ltd. Kapazitiver Druckwandler
US6167761B1 (en) * 1998-03-31 2001-01-02 Hitachi, Ltd. And Hitachi Car Engineering Co., Ltd. Capacitance type pressure sensor with capacitive elements actuated by a diaphragm
JP3567089B2 (ja) * 1998-10-12 2004-09-15 株式会社日立製作所 静電容量式圧力センサ
US6518084B1 (en) * 1998-12-15 2003-02-11 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Method of producing a micromechanical structure for a micro-electromechanical element
NO313723B1 (no) 1999-03-01 2002-11-18 Sintef Sensorelement
DE10036433A1 (de) * 2000-07-26 2002-02-07 Endress Hauser Gmbh Co Kapazitiver Drucksensor
WO2002008712A1 (de) 2000-07-26 2002-01-31 Endress + Hauser Gmbh + Co. Kg Kapazitiver drucksensor
DE10114838A1 (de) * 2001-03-26 2002-10-10 Implex Ag Hearing Technology I Vollständig implantierbares Hörsystem
US7028551B2 (en) * 2004-06-18 2006-04-18 Kavlico Corporation Linearity semi-conductive pressure sensor
FI119785B (fi) * 2004-09-23 2009-03-13 Vti Technologies Oy Kapasitiivinen anturi ja menetelmä kapasitiivisen anturin valmistamiseksi
JP2007085837A (ja) * 2005-09-21 2007-04-05 Alps Electric Co Ltd 静電容量型圧力センサ
JP4585426B2 (ja) * 2005-10-31 2010-11-24 アルプス電気株式会社 静電容量型圧力センサ
KR100807193B1 (ko) * 2006-09-08 2008-02-28 한국과학기술원 정전용량형 압력센서의 제조방법 및 이에 의해 제조된정전용량형 압력센서
FR2972659A1 (fr) * 2011-03-18 2012-09-21 Commissariat Energie Atomique Procede de traitement par electroerosion d'une surface d'un element en silicium et plaque de silicium obtenue grace a un tel traitement
JP5995038B2 (ja) * 2011-06-16 2016-09-21 富士電機株式会社 半導体基板および半導体装置
US10525265B2 (en) * 2014-12-09 2020-01-07 Cochlear Limited Impulse noise management
JP6041033B2 (ja) * 2015-10-23 2016-12-07 富士電機株式会社 半導体基板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5516228A (en) * 1978-07-21 1980-02-04 Hitachi Ltd Capacity type sensor
JPS5838732B2 (ja) * 1978-11-02 1983-08-25 富士電機株式会社 圧力測定用ダイアフラム
US4415948A (en) * 1981-10-13 1983-11-15 United Technologies Corporation Electrostatic bonded, silicon capacitive pressure transducer
US4405970A (en) * 1981-10-13 1983-09-20 United Technologies Corporation Silicon-glass-silicon capacitive pressure transducer
FI75426C (fi) * 1984-10-11 1988-06-09 Vaisala Oy Absoluttryckgivare.
US4586109A (en) * 1985-04-01 1986-04-29 Bourns Instruments, Inc. Batch-process silicon capacitive pressure sensor
JPS62127637A (ja) * 1985-11-28 1987-06-09 Yokogawa Electric Corp 半導体圧力変換器
US4998179A (en) * 1989-02-28 1991-03-05 United Technologies Corporation Capacitive semiconductive sensor with hinged diaphragm for planar movement

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011085332A1 (de) * 2011-10-27 2013-05-02 Continental Teves Ag & Co. Ohg Drucksensor
DE102015216626A1 (de) * 2015-08-31 2017-03-02 Siemens Aktiengesellschaft Drucksensoranordnung sowie Messumformer zur Prozessinstrumentierung mit einer derartigen Drucksensoranordnung
US10605683B2 (en) 2015-08-31 2020-03-31 Siemens Aktiengesellschaft Pressure sensor arrangement having rotating articulation including strain gauges

Also Published As

Publication number Publication date
EP0385574A1 (de) 1990-09-05
DE69007516D1 (de) 1994-04-28
BR9000734A (pt) 1991-01-22
US4998179A (en) 1991-03-05
KR0137931B1 (ko) 1998-05-15
CA2010803A1 (en) 1990-08-31
CA2010803C (en) 1995-01-24
JPH0381635A (ja) 1991-04-08
IL93540A0 (en) 1990-11-29
KR900013665A (ko) 1990-09-06
JP2918272B2 (ja) 1999-07-12
IL93540A (en) 1993-05-13
EP0385574B1 (de) 1994-03-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: BREED AUTOMOTIVE TECHNOLOGY, INC., LAKELAND, FLA.,

8339 Ceased/non-payment of the annual fee