DE68929001T2 - Flammenbeständige epoxygiessformverbindung, verfahren und eingekapselte vorrichtung - Google Patents

Flammenbeständige epoxygiessformverbindung, verfahren und eingekapselte vorrichtung

Info

Publication number
DE68929001T2
DE68929001T2 DE68929001T DE68929001T DE68929001T2 DE 68929001 T2 DE68929001 T2 DE 68929001T2 DE 68929001 T DE68929001 T DE 68929001T DE 68929001 T DE68929001 T DE 68929001T DE 68929001 T2 DE68929001 T2 DE 68929001T2
Authority
DE
Germany
Prior art keywords
weight
molding compound
hardener
flame retardant
percent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68929001T
Other languages
English (en)
Other versions
DE68929001D1 (de
Inventor
Anthony A Gallo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE68929001D1 publication Critical patent/DE68929001D1/de
Application granted granted Critical
Publication of DE68929001T2 publication Critical patent/DE68929001T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K3/2279—Oxides; Hydroxides of metals of antimony
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Cable Accessories (AREA)
  • Insulators (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE68929001T 1988-10-17 1989-10-16 Flammenbeständige epoxygiessformverbindung, verfahren und eingekapselte vorrichtung Expired - Fee Related DE68929001T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25854788A 1988-10-17 1988-10-17
US07/418,757 US5041254A (en) 1988-10-17 1989-10-05 Method of encapsulating a semiconductor device with a flame retardant epoxy molding compound
PCT/US1989/004619 WO1990004854A1 (en) 1988-10-17 1989-10-16 Flame retardant epoxy molding compound, method and encapsulated device

Publications (2)

Publication Number Publication Date
DE68929001D1 DE68929001D1 (de) 1999-06-24
DE68929001T2 true DE68929001T2 (de) 1999-12-09

Family

ID=26946706

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68929001T Expired - Fee Related DE68929001T2 (de) 1988-10-17 1989-10-16 Flammenbeständige epoxygiessformverbindung, verfahren und eingekapselte vorrichtung

Country Status (6)

Country Link
US (2) US5041254A (de)
EP (1) EP0438524B1 (de)
JP (1) JPH068379B2 (de)
AT (1) ATE180358T1 (de)
DE (1) DE68929001T2 (de)
WO (1) WO1990004854A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5104604A (en) * 1989-10-05 1992-04-14 Dexter Electronic Materials Div. Of Dexter Corp. Flame retardant epoxy molding compound, method and encapsulated device method of encapsulating a semiconductor device with a flame retardant epoxy molding compound
US5476716A (en) * 1988-10-17 1995-12-19 The Dexter Corporation Flame retardant epoxy molding compound, method and encapsulated device
US5413861A (en) * 1988-10-17 1995-05-09 Dextor Corporation Semiconductor device encapsulated with a flame retardant epoxy molding compound
EP0566043B1 (de) * 1992-04-14 1999-08-11 Hitachi Chemical Co., Ltd. Verfahren zur Herstellung von Platten für gedruckte Schaltungen
WO1996013055A2 (en) * 1994-10-13 1996-05-02 National Semiconductor Corporation Plastic encapsulation of ic device by two level epoxy encapsulation
US6359062B1 (en) * 1999-03-02 2002-03-19 The Valspar Corporation Coating compositions
US7163973B2 (en) * 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
US20040101689A1 (en) * 2002-11-26 2004-05-27 Ludovic Valette Hardener composition for epoxy resins
US9263360B2 (en) * 2012-07-06 2016-02-16 Henkel IP & Holding GmbH Liquid compression molding encapsulants

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2433189C3 (de) * 1973-07-11 1978-05-03 Mitsubishi Rayon Co. Ltd., Tokio Schwer entflammbare, glasfaserverstärkte Polytetramethylenterephthalatformmasse
US4042550A (en) * 1975-11-28 1977-08-16 Allied Chemical Corporation Encapsulant compositions based on anhydride-hardened epoxy resins
IL53778A (en) * 1978-01-11 1980-10-26 Makhteshim Chem Works Ltd Epoxy compositions derived from tetrabromo bisphenol-a waste residues and their use as flame retardants in polymers
US4248920A (en) * 1978-04-26 1981-02-03 Tokyo Shibaura Denki Kabushiki Kaisha Resin-sealed semiconductor device
US4282136A (en) * 1979-04-09 1981-08-04 Hunt Earl R Flame retardant epoxy molding compound method and encapsulated device
US4542164A (en) * 1982-10-04 1985-09-17 Toray Industries, Incorporated Flame-retardant polyolefin foam
JPS6153321A (ja) * 1984-08-23 1986-03-17 Toshiba Corp 半導体封止用エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置
JPS61138619A (ja) * 1984-12-10 1986-06-26 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物
JPS61162514A (ja) * 1985-01-09 1986-07-23 Hitachi Ltd 成形用難燃性エポキシ樹脂組成物及びそれを用いて封止された電子部品
JPS61163922A (ja) * 1985-01-14 1986-07-24 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
IL77130A (en) * 1985-11-25 1991-03-10 Bromine Compounds Ltd Fire retardant polymer compositions
JPS62212422A (ja) * 1986-03-14 1987-09-18 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH0648710B2 (ja) * 1987-08-03 1994-06-22 株式会社日立製作所 樹脂封止型半導体装置
CA1327414C (en) * 1988-06-27 1994-03-01 Junichiro Washiyama Heat-resistant resin composition

Also Published As

Publication number Publication date
EP0438524A1 (de) 1991-07-31
EP0438524B1 (de) 1999-05-19
US5338781A (en) 1994-08-16
DE68929001D1 (de) 1999-06-24
ATE180358T1 (de) 1999-06-15
US5041254A (en) 1991-08-20
EP0438524A4 (en) 1992-04-08
JPH03503294A (ja) 1991-07-25
WO1990004854A1 (en) 1990-05-03
JPH068379B2 (ja) 1994-02-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee