DE68921848T2 - Wärmeleitungsmodul. - Google Patents

Wärmeleitungsmodul.

Info

Publication number
DE68921848T2
DE68921848T2 DE68921848T DE68921848T DE68921848T2 DE 68921848 T2 DE68921848 T2 DE 68921848T2 DE 68921848 T DE68921848 T DE 68921848T DE 68921848 T DE68921848 T DE 68921848T DE 68921848 T2 DE68921848 T2 DE 68921848T2
Authority
DE
Germany
Prior art keywords
piston
cylindrical
hole
chip
angle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68921848T
Other languages
German (de)
English (en)
Other versions
DE68921848D1 (de
Inventor
Gary Franklin Goth
Kevin Patrick Moran
Michael Lynn Zumbrunnen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE68921848D1 publication Critical patent/DE68921848D1/de
Publication of DE68921848T2 publication Critical patent/DE68921848T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/774—Pistons, e.g. spring-loaded members

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE68921848T 1988-10-31 1989-08-01 Wärmeleitungsmodul. Expired - Fee Related DE68921848T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/265,065 US5005638A (en) 1988-10-31 1988-10-31 Thermal conduction module with barrel shaped piston for improved heat transfer

Publications (2)

Publication Number Publication Date
DE68921848D1 DE68921848D1 (de) 1995-04-27
DE68921848T2 true DE68921848T2 (de) 1995-10-12

Family

ID=23008814

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68921848T Expired - Fee Related DE68921848T2 (de) 1988-10-31 1989-08-01 Wärmeleitungsmodul.

Country Status (4)

Country Link
US (1) US5005638A (https=)
EP (1) EP0369115B1 (https=)
JP (1) JPH02156658A (https=)
DE (1) DE68921848T2 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5170319A (en) * 1990-06-04 1992-12-08 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels
US5161089A (en) * 1990-06-04 1992-11-03 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
DE69117891T2 (de) * 1990-11-20 1996-07-25 Sumitomo Electric Industries Verfahren zum Montieren von Halbleiterelementen
DE69211074T2 (de) * 1991-08-26 1996-10-02 Sun Microsystems Inc Verfahren und Apparat zum Kühlen von Mehrchip-Moduln durch die vollständige Wärmerohr-Technologie
FR2685816A1 (fr) * 1991-12-30 1993-07-02 Bull Sa Systeme de refroidissement pour module "multi-puces".
JPH06349989A (ja) * 1992-12-21 1994-12-22 Internatl Business Mach Corp <Ibm> 熱伝達冷却装置
JPH0786471A (ja) * 1993-09-20 1995-03-31 Hitachi Ltd 半導体モジュ−ル
US5983997A (en) * 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate
US5965937A (en) * 1997-12-15 1999-10-12 Intel Corporation Thermal interface attach mechanism for electrical packages
DE69827304T2 (de) * 1998-12-30 2005-11-03 Acqiris Sa Elektronische baugruppe mit kühlelementen für elektronische bauelemente
US6651988B2 (en) 2000-12-27 2003-11-25 General Dynamics Advanced Information Systems, Inc. Compact actuator with hydraulic seal
US6683787B1 (en) * 2002-02-14 2004-01-27 Mercury Computer Systems, Inc. Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks
US6781831B1 (en) 2002-02-14 2004-08-24 Mercury Computer Systems, Inc. Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers
US6879486B1 (en) 2002-02-14 2005-04-12 Mercury Computer Systems, Inc. Central inlet circuit board assembly
US6759588B1 (en) 2002-02-14 2004-07-06 Mercury Computer Systems, Inc. Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover
US6690575B1 (en) 2002-02-14 2004-02-10 Mercury Computer Systems, Inc. Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies
US20050018402A1 (en) * 2003-07-21 2005-01-27 Oman Todd P. Thermally enhanced electronic module
US7164587B1 (en) * 2004-01-14 2007-01-16 Sun Microsystems, Inc. Integral heatsink grounding arrangement
US20060221571A1 (en) * 2005-03-30 2006-10-05 Oberlin Gary E Thermal conductor and use thereof
US7589971B2 (en) * 2006-10-10 2009-09-15 Deere & Company Reconfigurable heat sink assembly
US9313923B2 (en) 2014-05-07 2016-04-12 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Multi-component heatsink with self-adjusting pin fins
JP6981637B2 (ja) * 2017-02-06 2021-12-15 日本電気株式会社 熱伝導装置および電子部品
US10980151B2 (en) * 2018-07-31 2021-04-13 Hewlett Packard Enterprise Development Lp Flexible heat transfer mechanism configurations
US11769710B2 (en) * 2020-03-27 2023-09-26 Xilinx, Inc. Heterogeneous integration module comprising thermal management apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US423528A (en) * 1890-03-18 Registering toy savings bank or safe
CH440464A (de) * 1966-07-14 1967-07-31 Bbc Brown Boveri & Cie Kühlkörper für Halbleiterelemente
GB1598174A (en) * 1977-05-31 1981-09-16 Ibm Cooling electrical apparatus
US4235283A (en) * 1979-12-17 1980-11-25 International Business Machines Corporation Multi-stud thermal conduction module
US4462462A (en) * 1981-11-17 1984-07-31 International Business Machines Corporation Thermal conduction piston for semiconductor packages
US4639829A (en) * 1984-06-29 1987-01-27 International Business Machines Corporation Thermal conduction disc-chip cooling enhancement means
JPH063831B2 (ja) * 1987-04-08 1994-01-12 株式会社日立製作所 冷却装置及びそれを用いた半導体装置
US4765400A (en) * 1987-04-14 1988-08-23 International Business Machines Corp. Circuit module with pins conducting heat from floating plate contacting heat producing device

Also Published As

Publication number Publication date
EP0369115A1 (en) 1990-05-23
US5005638A (en) 1991-04-09
JPH02156658A (ja) 1990-06-15
EP0369115B1 (en) 1995-03-22
JPH0587183B2 (https=) 1993-12-15
DE68921848D1 (de) 1995-04-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee