DE68921666D1 - Anordnung zum Löten von gedruckten Schaltungen. - Google Patents

Anordnung zum Löten von gedruckten Schaltungen.

Info

Publication number
DE68921666D1
DE68921666D1 DE68921666T DE68921666T DE68921666D1 DE 68921666 D1 DE68921666 D1 DE 68921666D1 DE 68921666 T DE68921666 T DE 68921666T DE 68921666 T DE68921666 T DE 68921666T DE 68921666 D1 DE68921666 D1 DE 68921666D1
Authority
DE
Germany
Prior art keywords
arrangement
printed circuits
soldering printed
soldering
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68921666T
Other languages
English (en)
Other versions
DE68921666T2 (de
Inventor
Gilbert V Morris
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDY Industries LLC
Original Assignee
Teledyne Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teledyne Industries Inc filed Critical Teledyne Industries Inc
Publication of DE68921666D1 publication Critical patent/DE68921666D1/de
Application granted granted Critical
Publication of DE68921666T2 publication Critical patent/DE68921666T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0676—Conveyors therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating With Molten Metal (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE68921666T 1988-05-27 1989-05-24 Anordnung zum Löten von gedruckten Schaltungen. Expired - Fee Related DE68921666T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/199,604 US4903631A (en) 1988-05-27 1988-05-27 System for soldering printed circuits

Publications (2)

Publication Number Publication Date
DE68921666D1 true DE68921666D1 (de) 1995-04-20
DE68921666T2 DE68921666T2 (de) 1995-07-27

Family

ID=22738250

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68921666T Expired - Fee Related DE68921666T2 (de) 1988-05-27 1989-05-24 Anordnung zum Löten von gedruckten Schaltungen.

Country Status (4)

Country Link
US (1) US4903631A (de)
EP (1) EP0343616B1 (de)
JP (1) JPH069298B2 (de)
DE (1) DE68921666T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5116718A (en) * 1989-09-28 1992-05-26 At&T Bell Laboratories Contact printing process
US5679155A (en) * 1992-03-16 1997-10-21 Velie Circuits, Inc. Method and apparatus for soldering circuit boards
US5483984A (en) * 1992-07-10 1996-01-16 Donlan, Jr.; Fraser P. Fluid treatment apparatus and method
JPH10125618A (ja) * 1996-10-23 1998-05-15 Fujitsu Ltd 半導体装置の製造方法
US5934540A (en) 1997-07-31 1999-08-10 Teledyne Industries, Inc. Horizontal soldering system with oil blanket
JP5146662B2 (ja) * 2008-05-13 2013-02-20 ルネサスエレクトロニクス株式会社 金属電極の形成方法
JP5821797B2 (ja) * 2012-07-26 2015-11-24 Tdk株式会社 電子部品の製造方法及び電子部品の製造装置
US9243726B2 (en) 2012-10-03 2016-01-26 Aarne H. Reid Vacuum insulated structure with end fitting and method of making same
US9463918B2 (en) 2014-02-20 2016-10-11 Aarne H. Reid Vacuum insulated articles and methods of making same
US10497908B2 (en) 2015-08-24 2019-12-03 Concept Group, Llc Sealed packages for electronic and energy storage devices
US10065256B2 (en) * 2015-10-30 2018-09-04 Concept Group Llc Brazing systems and methods
EP3423854A4 (de) 2016-03-04 2020-01-01 Concept Group LLC Vakuumisolierte artikel mit verbesserung des reflektierenden materials
CN110770489B (zh) 2016-11-15 2022-03-01 概念集团有限责任公司 具有微孔绝热的增强的真空绝热制品
WO2018093773A1 (en) 2016-11-15 2018-05-24 Reid Aarne H Multiply-insulated assemblies
CN106429436A (zh) * 2016-11-30 2017-02-22 恩平市华昌陶瓷有限公司 一种陶瓷砖淋油水冷输送系统
CN111465800B (zh) 2017-08-25 2022-03-01 概念集团有限责任公司 多几何形状和多材料隔热部件
US20190366460A1 (en) * 2018-06-01 2019-12-05 Progress Y&Y Corp. Soldering apparatus and solder nozzle module thereof
CN112548255B (zh) * 2020-11-27 2022-04-12 温州瓯斯达电器实业有限公司 直插式电热蚊香片加热器电路板焊接工艺
CN114525463A (zh) * 2022-02-09 2022-05-24 江苏富川机电有限公司 一种热镀锡自动助焊剂槽
CN115209638B (zh) * 2022-07-13 2024-06-25 合肥万达光电科技有限公司 一种电路板无铅回流焊机
CN117921183B (zh) * 2024-03-20 2024-05-28 昆山市金康电子有限公司 一种全自动芯片焊接设备

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3058441A (en) * 1956-10-02 1962-10-16 Sanders Associates Inc Soldering apparatus and method of soldering electrical conductors
US3053215A (en) * 1956-12-03 1962-09-11 Rca Corp Apparatus for soldering printed sheets
US3190527A (en) * 1963-10-30 1965-06-22 Electrovert Mfg Co Ltd Means for applying oil film to solder wave
GB1102621A (en) * 1965-04-07 1968-02-07 Electrovert Mfg Company Ltd Method and apparatus for fluxing and soldering connections on printed circuit boards
US3435801A (en) * 1967-03-02 1969-04-01 Alexander F Carini Solder deposit and leveling machines
US3603646A (en) * 1970-01-26 1971-09-07 Ibm Semiconductor wafer air slide with controlled wafer motion
US3744557A (en) * 1971-07-19 1973-07-10 Argus Eng Co Apparatus for fusing and sealing platings and the like
US3724418A (en) * 1971-08-20 1973-04-03 Lain J Mc Solder coating apparatus
CH591303A5 (de) * 1974-04-19 1977-09-15 Meteor Ag
US4226526A (en) * 1976-10-04 1980-10-07 Harry Arthur Hele Spence-Bate Transport and positioning mechanism
DE2856460C3 (de) * 1978-12-28 1982-02-11 Gebr. Schmid GmbH & Co, 7290 Freudenstadt Vorrichtung zum Aufbringen einer Lotschicht auf eine Leiterplatte
DE2932398C2 (de) 1979-08-09 1981-10-15 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum Kühlen von Leiterplatten nach dem maschinellen Einlöten von elektrischen Bauteilen
US4277518A (en) * 1979-11-13 1981-07-07 Gyrex Corp. Solder-coating method
US4383494A (en) * 1979-11-13 1983-05-17 Allied Corporation Solder-coating apparatus
US4563974A (en) * 1983-09-16 1986-01-14 Monitrol, Inc. Apparatus for the application of solder to workpieces
US4608941A (en) * 1985-01-10 1986-09-02 Teledyne Electro-Mechanisms Apparatus for soldering printed circuit panels
DE3539585A1 (de) * 1985-10-11 1987-07-02 Kaspar Eidenberg Verfahren zum verloeten der anschluesse von bauteilen mit den leiterbahnen und loetaugen von leiterplatten und vorrichtung zum durchfuehren dieses verfahrens
SU1362695A1 (ru) * 1985-11-19 1987-12-30 Воронежский технологический институт Термопневмоконвейер
JPS639188A (ja) * 1986-06-27 1988-01-14 テレダイン　インダストリ−ズ　インコ−ポレ−テツド プリント基板を半田処理する装置
JPH02205254A (ja) * 1989-01-26 1990-08-15 Showa Alum Corp 熱交換器の製造方法

Also Published As

Publication number Publication date
JPH02148883A (ja) 1990-06-07
DE68921666T2 (de) 1995-07-27
JPH069298B2 (ja) 1994-02-02
US4903631A (en) 1990-02-27
EP0343616B1 (de) 1995-03-15
EP0343616A3 (en) 1990-11-07
EP0343616A2 (de) 1989-11-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee