DE68915470D1 - Chipkondensator und Verfahren zur Herstellung. - Google Patents

Chipkondensator und Verfahren zur Herstellung.

Info

Publication number
DE68915470D1
DE68915470D1 DE68915470T DE68915470T DE68915470D1 DE 68915470 D1 DE68915470 D1 DE 68915470D1 DE 68915470 T DE68915470 T DE 68915470T DE 68915470 T DE68915470 T DE 68915470T DE 68915470 D1 DE68915470 D1 DE 68915470D1
Authority
DE
Germany
Prior art keywords
manufacturing
chip capacitor
capacitor
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68915470T
Other languages
English (en)
Other versions
DE68915470T2 (de
Inventor
Susumu Ando
Ikuo Hagiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemi Con Corp
Original Assignee
Nippon Chemi Con Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63054599A external-priority patent/JPH01227413A/ja
Priority claimed from JP63161431A external-priority patent/JPH0630329B2/ja
Priority claimed from JP63280864A external-priority patent/JP2841339B2/ja
Application filed by Nippon Chemi Con Corp filed Critical Nippon Chemi Con Corp
Application granted granted Critical
Publication of DE68915470D1 publication Critical patent/DE68915470D1/de
Publication of DE68915470T2 publication Critical patent/DE68915470T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE68915470T 1988-03-07 1989-03-07 Chipkondensator und Verfahren zur Herstellung. Expired - Fee Related DE68915470T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP63054599A JPH01227413A (ja) 1988-03-07 1988-03-07 チップ形コンデンサ
JP63161431A JPH0630329B2 (ja) 1988-06-29 1988-06-29 チップ形コンデンサの製造方法
JP20038388 1988-08-11
JP63280864A JP2841339B2 (ja) 1988-08-11 1988-11-07 チップ形コンデンサ

Publications (2)

Publication Number Publication Date
DE68915470D1 true DE68915470D1 (de) 1994-06-30
DE68915470T2 DE68915470T2 (de) 1994-09-08

Family

ID=27463088

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68915470T Expired - Fee Related DE68915470T2 (de) 1988-03-07 1989-03-07 Chipkondensator und Verfahren zur Herstellung.

Country Status (4)

Country Link
US (1) US4931961A (de)
EP (1) EP0332411B1 (de)
KR (1) KR970006425B1 (de)
DE (1) DE68915470T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5420748A (en) * 1993-03-31 1995-05-30 Samsung Electro-Mechanics Co., Ltd. Surface mounting type chip capacitor
DE19710963C1 (de) * 1997-03-17 1998-09-17 Wolfgang Westermann SMD-Folienkondensator
US20040079616A1 (en) * 1997-07-11 2004-04-29 Castleberry Billy J. Snack dispenser
EP1048042A1 (de) * 1998-09-02 2000-11-02 Koninklijke Philips Electronics N.V. Dünnfilmkondensator
US8130486B2 (en) * 2008-07-10 2012-03-06 Panasonic Corporation Electronic component and method of manufacturing the same
JP5802387B2 (ja) * 2010-12-24 2015-10-28 サン電子工業株式会社 チップ形コンデンサ及びその製造方法
USD901386S1 (en) * 2019-05-20 2020-11-10 Sheng Ye Electric Co., Ltd Condenser

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3474300A (en) * 1964-09-08 1969-10-21 Mallory & Co Inc P R Encapsulated capacitor made of thermoplastic materials
FR1566728A (de) * 1968-03-29 1969-05-09
US3778532A (en) * 1972-07-03 1973-12-11 Illinois Tool Works Electrical circuit component having solder preform connection means
US3806766A (en) * 1972-12-27 1974-04-23 Western Electric Co Packaged electrical component assembly and method of fabrication
US3955124A (en) * 1975-02-10 1976-05-04 Air Products And Chemicals, Inc. Removable coulometric timer connector assembly for printed circuit boards
JPS5778129A (en) * 1980-10-31 1982-05-15 Matsushita Electric Ind Co Ltd Method of producing chip shaped solid electrolytic condenser
GB8324839D0 (en) * 1983-09-16 1983-10-19 Lucas Ind Plc Mounting carrier for microelectronic silicon chip
JPS60245116A (ja) * 1984-05-18 1985-12-04 松下電器産業株式会社 アルミ電解コンデンサ
US4818823A (en) * 1987-07-06 1989-04-04 Micro-Circuits, Inc. Adhesive component means for attaching electrical components to conductors

Also Published As

Publication number Publication date
KR970006425B1 (ko) 1997-04-28
KR890015311A (ko) 1989-10-28
DE68915470T2 (de) 1994-09-08
EP0332411A3 (en) 1989-11-29
EP0332411B1 (de) 1994-05-25
EP0332411A2 (de) 1989-09-13
US4931961A (en) 1990-06-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee