DE68913524D1 - Laserüberschallöten. - Google Patents
Laserüberschallöten.Info
- Publication number
- DE68913524D1 DE68913524D1 DE89912326T DE68913524T DE68913524D1 DE 68913524 D1 DE68913524 D1 DE 68913524D1 DE 89912326 T DE89912326 T DE 89912326T DE 68913524 T DE68913524 T DE 68913524T DE 68913524 D1 DE68913524 D1 DE 68913524D1
- Authority
- DE
- Germany
- Prior art keywords
- surplusing
- laser
- laser surplusing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/035—Aligning the laser beam
- B23K26/037—Aligning the laser beam by pressing on the workpiece, e.g. pressing roller foot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78261—Laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0106—Neodymium [Nd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/287,763 US4893742A (en) | 1988-12-21 | 1988-12-21 | Ultrasonic laser soldering |
PCT/US1989/004714 WO1990007191A1 (en) | 1988-12-21 | 1989-10-23 | Ultrasonic laser soldering |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68913524D1 true DE68913524D1 (de) | 1994-04-07 |
DE68913524T2 DE68913524T2 (de) | 1994-08-25 |
Family
ID=23104230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68913524T Expired - Fee Related DE68913524T2 (de) | 1988-12-21 | 1989-10-23 | Laserüberschallöten. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4893742A (de) |
EP (1) | EP0406351B1 (de) |
JP (1) | JPH03502860A (de) |
DE (1) | DE68913524T2 (de) |
WO (1) | WO1990007191A1 (de) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5164566A (en) * | 1990-06-12 | 1992-11-17 | Microelectronics And Computer Technology Corp. | Method and apparatus for fluxless solder reflow |
US5207369A (en) * | 1990-11-29 | 1993-05-04 | Matsushita Electric Industrial Co., Ltd. | Inner lead bonding apparatus |
US5201453A (en) * | 1991-09-30 | 1993-04-13 | Texas Instruments Incorporated | Linear, direct-drive microelectronic bonding apparatus and method |
WO1993013903A1 (fr) * | 1992-01-17 | 1993-07-22 | S.L.T. Japan Co., Ltd. | Procede de brasage |
US5298715A (en) * | 1992-04-27 | 1994-03-29 | International Business Machines Corporation | Lasersonic soldering of fine insulated wires to heat-sensitive substrates |
US5249728A (en) * | 1993-03-10 | 1993-10-05 | Atmel Corporation | Bumpless bonding process having multilayer metallization |
JPH06342976A (ja) * | 1993-06-01 | 1994-12-13 | Nippondenso Co Ltd | 基板の接続方法 |
JPH07221141A (ja) * | 1994-02-03 | 1995-08-18 | Matsushita Electric Ind Co Ltd | 超音波ワイヤボンディング装置 |
US5580471A (en) * | 1994-03-30 | 1996-12-03 | Panasonic Technologies, Inc. | Apparatus and method for material treatment and inspection using fiber-coupled laser diode |
EP0675581B1 (de) * | 1994-03-31 | 1997-08-27 | STMicroelectronics S.r.l. | Verbindungsvorrichtung für elektronische Halbleiter-Einheiter |
US5904868A (en) * | 1994-06-16 | 1999-05-18 | International Business Machines Corporation | Mounting and/or removing of components using optical fiber tools |
US5509597A (en) * | 1994-10-17 | 1996-04-23 | Panasonic Technologies, Inc. | Apparatus and method for automatic monitoring and control of a soldering process |
US5562842A (en) * | 1994-10-17 | 1996-10-08 | Panasonic Technologies, Inc. | Material treatment apparatus combining a laser diode and an illumination light with a video imaging system |
US5614113A (en) * | 1995-05-05 | 1997-03-25 | Texas Instruments Incorporated | Method and apparatus for performing microelectronic bonding using a laser |
US5626280A (en) * | 1995-06-05 | 1997-05-06 | He Holdings, Inc. | Infrared transparent soldering tool and infrared soldering method |
DE19639993C2 (de) * | 1995-09-18 | 2000-10-05 | Hahn Meitner Inst Berlin Gmbh | Vorrichtung zum berührungslosen, selektiven Ein- oder Auslöten von Bauelementen |
US5739433A (en) * | 1996-03-01 | 1998-04-14 | University Of Central Florida | Touch off probe |
US5731244A (en) * | 1996-05-28 | 1998-03-24 | Micron Technology, Inc. | Laser wire bonding for wire embedded dielectrics to integrated circuits |
US5821494A (en) * | 1996-09-27 | 1998-10-13 | International Business Machines Corporation | Method of electrical connection between head transducer and suspension by solder wire bumping at slider level and laser reflow |
US5938952A (en) * | 1997-01-22 | 1999-08-17 | Equilasers, Inc. | Laser-driven microwelding apparatus and process |
US5948286A (en) * | 1997-02-06 | 1999-09-07 | International Business Machines Corporation | Diffusion bonding of lead interconnections using precise laser-thermosonic energy |
US5921460A (en) * | 1997-06-05 | 1999-07-13 | Ford Motor Company | Method of soldering materials supported on low-melting substrates |
JPH11145188A (ja) * | 1997-11-10 | 1999-05-28 | Sony Corp | 半導体装置及びその製造方法 |
US6056185A (en) * | 1998-03-18 | 2000-05-02 | Ga-Tek Inc. | Method of connecting batteries to electronic circuits |
DE19814118A1 (de) * | 1998-03-30 | 1999-10-14 | F&K Delvotec Bondtechnik Gmbh | Vorrichtung zum Thermokompressionsbonden, und Thermokompressionsbonden |
US20090149479A1 (en) * | 1998-11-02 | 2009-06-11 | Elan Pharma International Limited | Dosing regimen |
JP3587748B2 (ja) * | 1999-10-18 | 2004-11-10 | ソニーケミカル株式会社 | 多層フレキシブル配線板及び多層フレキシブル配線板製造方法 |
US6501043B1 (en) | 1999-10-22 | 2002-12-31 | Medtronic, Inc. | Apparatus and method for laser welding of ribbons |
IT1311304B1 (it) * | 1999-12-07 | 2002-03-12 | Bruno Bisiach | Piede di appoggio per teste di saldatura. |
US6329629B1 (en) * | 2000-04-28 | 2001-12-11 | Branson Ultrasonics Corporation | Distance mode control for laser welding |
US6478212B1 (en) * | 2001-01-16 | 2002-11-12 | International Business Machines Corporation | Bond pad structure and method for reduced downward force wirebonding |
DE10120269C1 (de) * | 2001-04-25 | 2002-07-25 | Muehlbauer Ag | Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders |
US6520399B1 (en) * | 2001-09-14 | 2003-02-18 | Raytheon Company | Thermosonic bonding apparatus, tool, and method |
US6641027B2 (en) | 2001-12-18 | 2003-11-04 | Ngk Spark Plug Co., Ltd. | Method of connecting electric leads to battery tabs |
DE10205609A1 (de) * | 2002-02-11 | 2003-08-28 | Infineon Technologies Ag | Anordnung zum Drahtbonden und Verfahren zur Herstellung einer Bondverbindung |
US6776328B2 (en) † | 2002-09-17 | 2004-08-17 | The Boeing Company | Radiation assisted friction welding |
EP1535689A3 (de) * | 2003-11-26 | 2006-09-20 | International Business Machines Corporation | Verfahren zum flussmittelfrei Löten von Werkstucken |
US20050109746A1 (en) * | 2003-11-26 | 2005-05-26 | International Business Machines Corporation | Method for fluxless soldering of workpieces |
US7677432B2 (en) * | 2005-05-03 | 2010-03-16 | Texas Instruments Incorporated | Spot heat wirebonding |
KR101180916B1 (ko) * | 2007-11-20 | 2012-09-07 | 삼성테크윈 주식회사 | 카메라 모듈 본딩장치, 이를 구비한 카메라 모듈 조립장비및 이를 이용한 카메라 모듈 조립방법 |
SG155779A1 (en) * | 2008-03-10 | 2009-10-29 | Micron Technology Inc | Apparatus and methods of forming wire bonds |
EP2100686A1 (de) * | 2008-03-11 | 2009-09-16 | ProLas GmbH | Verfahren zum Verlöten von metallischen Fügepartnern sowie Vorrichtung dafür |
US9059074B2 (en) * | 2008-03-26 | 2015-06-16 | Stats Chippac Ltd. | Integrated circuit package system with planar interconnect |
US8436251B2 (en) | 2009-07-08 | 2013-05-07 | Medtronic, Inc. | Ribbon connecting electrical components |
US8129220B2 (en) | 2009-08-24 | 2012-03-06 | Hong Kong Polytechnic University | Method and system for bonding electrical devices using an electrically conductive adhesive |
CN104842069A (zh) * | 2014-02-13 | 2015-08-19 | 泰科电子(上海)有限公司 | 激光焊接系统 |
TWI610411B (zh) * | 2014-08-14 | 2018-01-01 | 艾馬克科技公司 | 用於半導體晶粒互連的雷射輔助接合 |
DE102017104097A1 (de) * | 2017-02-28 | 2018-08-30 | Pac Tech-Packaging Technologies Gmbh | Verfahren und Laseranordnung zum Aufschmelzen eines Lotmaterialdepots mittels Laserenergie |
CN109759666B (zh) * | 2017-07-11 | 2020-12-04 | 温州职业技术学院 | 一种整流二极管装配件的激光锡焊方法 |
JP2022550263A (ja) * | 2019-09-06 | 2022-12-01 | シュンク ソノジステム ゲゼルシャフト ミット ベシュレンクテル ハフツング | 少なくとも2つの構成部品を溶接するための溶接装置および方法 |
DE102019124334A1 (de) * | 2019-09-11 | 2021-03-11 | Hesse Gmbh | Bondanordnung und Bondwerkzeug |
CN216576042U (zh) * | 2021-11-03 | 2022-05-24 | 必能信超声(上海)有限公司 | 一种模块化设计的超声波金属焊机架 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3304403A (en) * | 1963-10-14 | 1967-02-14 | Texas Instruments Inc | Laser welding of contacts |
US3463898A (en) * | 1965-07-09 | 1969-08-26 | Tokyo Shibaura Electric Co | Welding device utilizing laser beams |
US3734382A (en) * | 1972-04-03 | 1973-05-22 | Motorola Inc | Apparatus for control of welding apparatus |
GB1434833A (en) * | 1972-06-02 | 1976-05-05 | Siemens Ag | Solder carrying electrical connector wires |
US3874963A (en) * | 1973-11-08 | 1975-04-01 | Kuss & Co R L | Sonic bonding process |
SU642114A1 (ru) * | 1977-02-18 | 1979-01-15 | Предприятие П/Я Х-5263 | Способ диффузионной сварки |
JPS5925378B2 (ja) * | 1980-05-23 | 1984-06-16 | 松下電器産業株式会社 | 電子部品の実装方法 |
US4320281A (en) * | 1980-07-31 | 1982-03-16 | Western Electric Company, Inc. | Laser bonding technique and article formed thereby |
JPS58209493A (ja) * | 1982-05-28 | 1983-12-06 | Nippon Univac Kk | 光溶接装置 |
JPS592333A (ja) * | 1982-06-28 | 1984-01-07 | Toshiba Corp | ワイヤボンデイング装置 |
JPS59175736A (ja) * | 1983-03-25 | 1984-10-04 | Fujitsu Ltd | ワイヤボンデイング装置 |
US4534811A (en) * | 1983-12-30 | 1985-08-13 | International Business Machines Corporation | Apparatus for thermo bonding surfaces |
JPS61101043A (ja) * | 1984-10-24 | 1986-05-19 | Hitachi Ltd | ワイヤボンデイング装置 |
-
1988
- 1988-12-21 US US07/287,763 patent/US4893742A/en not_active Expired - Lifetime
-
1989
- 1989-10-23 JP JP1511461A patent/JPH03502860A/ja active Pending
- 1989-10-23 WO PCT/US1989/004714 patent/WO1990007191A1/en active IP Right Grant
- 1989-10-23 EP EP89912326A patent/EP0406351B1/de not_active Expired - Lifetime
- 1989-10-23 DE DE68913524T patent/DE68913524T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH03502860A (ja) | 1991-06-27 |
WO1990007191A1 (en) | 1990-06-28 |
US4893742A (en) | 1990-01-16 |
DE68913524T2 (de) | 1994-08-25 |
EP0406351B1 (de) | 1994-03-02 |
EP0406351A1 (de) | 1991-01-09 |
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