DE68912530D1 - Verfahren zum Herstellen eines biegsamen elektrischen Verbinders. - Google Patents

Verfahren zum Herstellen eines biegsamen elektrischen Verbinders.

Info

Publication number
DE68912530D1
DE68912530D1 DE89121462T DE68912530T DE68912530D1 DE 68912530 D1 DE68912530 D1 DE 68912530D1 DE 89121462 T DE89121462 T DE 89121462T DE 68912530 T DE68912530 T DE 68912530T DE 68912530 D1 DE68912530 D1 DE 68912530D1
Authority
DE
Germany
Prior art keywords
making
electrical connector
flexible electrical
flexible
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE89121462T
Other languages
English (en)
Other versions
DE68912530T2 (de
Inventor
Gerold Firl
Stuart D Asakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE68912530D1 publication Critical patent/DE68912530D1/de
Publication of DE68912530T2 publication Critical patent/DE68912530T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Combinations Of Printed Boards (AREA)
DE68912530T 1988-11-21 1989-11-20 Verfahren zum Herstellen eines biegsamen elektrischen Verbinders. Expired - Lifetime DE68912530T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/274,534 US4989317A (en) 1988-11-21 1988-11-21 Method for making tab circuit electrical connector supporting multiple components thereon

Publications (2)

Publication Number Publication Date
DE68912530D1 true DE68912530D1 (de) 1994-03-03
DE68912530T2 DE68912530T2 (de) 1994-08-18

Family

ID=23048594

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68912530T Expired - Lifetime DE68912530T2 (de) 1988-11-21 1989-11-20 Verfahren zum Herstellen eines biegsamen elektrischen Verbinders.

Country Status (4)

Country Link
US (1) US4989317A (de)
EP (1) EP0370438B1 (de)
CA (1) CA2002402A1 (de)
DE (1) DE68912530T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit
US6003974A (en) * 1993-04-30 1999-12-21 Hewlett-Packard Company Unitary interconnect system for an inkjet printer
US5467252A (en) * 1993-10-18 1995-11-14 Motorola, Inc. Method for plating using nested plating buses and semiconductor device having the same
DE4418679A1 (de) * 1994-05-28 1995-11-30 Telefunken Microelectron Vorrichtung zur Kontaktierung zweier Schaltungsteile
US5612511A (en) * 1995-09-25 1997-03-18 Hewlett-Packard Company Double-sided electrical interconnect flexible circuit for ink-jet hard copy systems
AUPP653998A0 (en) * 1998-10-16 1998-11-05 Silverbrook Research Pty Ltd Micromechanical device and method (ij46B)
US6071427A (en) * 1998-06-03 2000-06-06 Lexmark International, Inc. Method for making a printhead
EP1121249B1 (de) 1998-10-16 2007-07-25 Silverbrook Research Pty. Limited Verfahren zur herstellung einer düse für einen tintenstrahldruckkopf
WO2000023279A1 (en) * 1998-10-16 2000-04-27 Silverbrook Research Pty. Limited Improvements relating to inkjet printers
US7216956B2 (en) * 1998-10-16 2007-05-15 Silverbrook Research Pty Ltd Printhead assembly with power and ground connections along single edge
US6371597B1 (en) 2000-01-20 2002-04-16 Lexmark International, Inc. Tab circuit to minimize corrosion due to ink
US8454149B2 (en) * 2009-06-29 2013-06-04 Videojet Technologies Inc Thermal inkjet print head with solvent resistance
US9310577B2 (en) * 2012-07-11 2016-04-12 Adc Telecommunications, Inc. Telecommunications cabinet modularization
JP6417684B2 (ja) * 2014-03-17 2018-11-07 セイコーエプソン株式会社 液体噴射ヘッド及び液体噴射装置
US9885845B2 (en) 2015-01-15 2018-02-06 Commscope, Inc. Of North Carolina Module and assembly for fiber optic interconnections
JP6741055B2 (ja) * 2018-10-02 2020-08-19 セイコーエプソン株式会社 液体噴射ヘッド
JP2019142234A (ja) * 2019-04-17 2019-08-29 セイコーエプソン株式会社 液体噴射ヘッド及び液体噴射装置
JP7036157B2 (ja) * 2020-07-01 2022-03-15 セイコーエプソン株式会社 液体噴射ヘッド及び液体噴射装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3689991A (en) * 1968-03-01 1972-09-12 Gen Electric A method of manufacturing a semiconductor device utilizing a flexible carrier
FR2402995A1 (fr) * 1977-09-12 1979-04-06 Thomson Csf Dispositif d'interconnexion de micro-circuits
JPS54114766A (en) * 1978-02-27 1979-09-07 Citizen Watch Co Ltd Method of producing circuit board
CA1138122A (en) * 1978-10-13 1982-12-21 Yoshifumi Okada Flexible printed circuit wiring board
FR2498873A1 (fr) * 1981-01-23 1982-07-30 Sev Alternateurs Procede de fabrication de circuits imprimes
US4631553A (en) * 1981-07-17 1986-12-23 Ricoh Company, Ltd. Printer head of an ink-jet printer
US4701781A (en) * 1984-07-05 1987-10-20 National Semiconductor Corporation Pre-testable semiconductor die package
US4635073A (en) * 1985-11-22 1987-01-06 Hewlett Packard Company Replaceable thermal ink jet component and thermosonic beam bonding process for fabricating same
US4683481A (en) * 1985-12-06 1987-07-28 Hewlett-Packard Company Thermal ink jet common-slotted ink feed printhead
US4680859A (en) * 1985-12-06 1987-07-21 Hewlett-Packard Company Thermal ink jet print head method of manufacture

Also Published As

Publication number Publication date
EP0370438B1 (de) 1994-01-19
EP0370438A1 (de) 1990-05-30
DE68912530T2 (de) 1994-08-18
CA2002402A1 (en) 1990-05-21
US4989317A (en) 1991-02-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE),

8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE