DE68907101T2 - Elektrobeschichtungsverfahren für Photolacke auf gedruckten Schaltungen. - Google Patents

Elektrobeschichtungsverfahren für Photolacke auf gedruckten Schaltungen.

Info

Publication number
DE68907101T2
DE68907101T2 DE1989607101 DE68907101T DE68907101T2 DE 68907101 T2 DE68907101 T2 DE 68907101T2 DE 1989607101 DE1989607101 DE 1989607101 DE 68907101 T DE68907101 T DE 68907101T DE 68907101 T2 DE68907101 T2 DE 68907101T2
Authority
DE
Germany
Prior art keywords
photoresists
electroplating process
printed circuits
printed
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1989607101
Other languages
English (en)
Other versions
DE68907101D1 (de
Inventor
Masahiro Hoshino
Isao Kobayashi
Kenji Seko
Naozumi Iwasawa
Yuu Akaki
Toshio Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Paint Co Ltd
Mitsubishi Electric Corp
Original Assignee
Kansai Paint Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63098400A external-priority patent/JPH0769612B2/ja
Priority claimed from JP63109482A external-priority patent/JPH0769613B2/ja
Priority claimed from JP18703188A external-priority patent/JPH0721637B2/ja
Application filed by Kansai Paint Co Ltd, Mitsubishi Electric Corp filed Critical Kansai Paint Co Ltd
Publication of DE68907101D1 publication Critical patent/DE68907101D1/de
Application granted granted Critical
Publication of DE68907101T2 publication Critical patent/DE68907101T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/469—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers
    • H01L21/47—Organic layers, e.g. photoresist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06F—LAUNDERING, DRYING, IRONING, PRESSING OR FOLDING TEXTILE ARTICLES
    • D06F39/00—Details of washing machines not specific to a single type of machines covered by groups D06F9/00 - D06F27/00 
    • D06F39/08—Liquid supply or discharge arrangements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Textile Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Materials For Photolithography (AREA)
DE1989607101 1988-03-28 1989-03-28 Elektrobeschichtungsverfahren für Photolacke auf gedruckten Schaltungen. Expired - Fee Related DE68907101T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP7208388 1988-03-28
JP63098400A JPH0769612B2 (ja) 1988-03-28 1988-04-22 プリント配線フオトレジスト用電着塗装方法
JP63109482A JPH0769613B2 (ja) 1988-05-02 1988-05-02 プリント配線フオトレジスト用カチオン型電着塗装方法
JP18703188A JPH0721637B2 (ja) 1988-07-28 1988-07-28 ポジ型フオトレジストの形成方法

Publications (2)

Publication Number Publication Date
DE68907101D1 DE68907101D1 (de) 1993-07-22
DE68907101T2 true DE68907101T2 (de) 1993-11-11

Family

ID=27465427

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1989607101 Expired - Fee Related DE68907101T2 (de) 1988-03-28 1989-03-28 Elektrobeschichtungsverfahren für Photolacke auf gedruckten Schaltungen.

Country Status (6)

Country Link
US (1) US4898656A (de)
EP (1) EP0335330B1 (de)
KR (1) KR940008381B1 (de)
AU (1) AU613463B2 (de)
CA (1) CA1337864C (de)
DE (1) DE68907101T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8822145D0 (en) * 1988-09-21 1988-10-26 Ciba Geigy Ag Method
JPH03177586A (ja) * 1989-12-04 1991-08-01 Nippon Paint Co Ltd フォトレジスト膜の形成方法
JP2865147B2 (ja) * 1990-06-20 1999-03-08 関西ペイント株式会社 ポジ型感光性電着塗料組成物
US5268256A (en) * 1990-08-02 1993-12-07 Ppg Industries, Inc. Photoimageable electrodepositable photoresist composition for producing non-tacky films
EP0469537B1 (de) * 1990-08-02 1998-12-30 Ppg Industries, Inc. Lichtempfindliche, elektroabscheidbare Photoresistzusammensetzung
JP2847321B2 (ja) * 1990-08-14 1999-01-20 日本石油株式会社 ポジ型フォトレジスト組成物
US5246816A (en) * 1990-09-03 1993-09-21 Nippon Oil Co., Ltd. Cationic electrodeposition negative type resist composition
JPH0539444A (ja) * 1990-11-30 1993-02-19 Hitachi Chem Co Ltd ポジ型感光性アニオン電着塗料樹脂組成物、これを用いた電着塗装浴、電着塗装法及びプリント回路板の製造方法
US5314789A (en) * 1991-10-01 1994-05-24 Shipley Company Inc. Method of forming a relief image comprising amphoteric compositions
US5384229A (en) * 1992-05-07 1995-01-24 Shipley Company Inc. Photoimageable compositions for electrodeposition
JPH06164102A (ja) * 1992-11-25 1994-06-10 Nippon Paint Co Ltd 電着型感光性樹脂被膜の表面処理方法
DE4339019A1 (de) * 1993-11-10 1995-05-11 Atotech Deutschland Gmbh Verfahren zur Herstellung von Leiterplatten
JP3648704B2 (ja) * 2000-02-14 2005-05-18 タムラ化研株式会社 活性エネルギー線硬化性組成物及びプリント配線板
US6541537B1 (en) 2001-01-19 2003-04-01 Renaissance Technology Llc Acrylate polymeric compositions and methods
JP2004343351A (ja) * 2003-05-14 2004-12-02 Kansai Paint Co Ltd 自動車用アンテナ形成方法
US7863485B2 (en) * 2004-12-10 2011-01-04 Omnitech Environmental, Llc Additive and vehicle for inks, paints, coatings and adhesives
US7635552B2 (en) * 2006-07-25 2009-12-22 Endicott Interconnect Technologies, Inc. Photoresist composition with antibacterial agent

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL270834A (de) * 1960-10-31
CA1051707A (en) * 1973-10-25 1979-04-03 Michael Gulla Photoresist film with non-photosensitive resist layer
JPS50152803A (de) * 1974-05-29 1975-12-09
US4421620A (en) * 1982-02-11 1983-12-20 Ppg Industries, Inc. Novel process for pretreating and coating metallic substrates electrophoretically
JPS61206293A (ja) * 1985-03-08 1986-09-12 日本ペイント株式会社 回路板の製造方法

Also Published As

Publication number Publication date
AU613463B2 (en) 1991-08-01
AU3173589A (en) 1989-09-28
EP0335330A2 (de) 1989-10-04
DE68907101D1 (de) 1993-07-22
US4898656A (en) 1990-02-06
KR890015383A (ko) 1989-10-30
KR940008381B1 (ko) 1994-09-12
CA1337864C (en) 1996-01-02
EP0335330A3 (en) 1990-04-11
EP0335330B1 (de) 1993-06-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee