DE668883C - Process for making copper oxide rectifier elements - Google Patents
Process for making copper oxide rectifier elementsInfo
- Publication number
- DE668883C DE668883C DES121788D DES0121788D DE668883C DE 668883 C DE668883 C DE 668883C DE S121788 D DES121788 D DE S121788D DE S0121788 D DES0121788 D DE S0121788D DE 668883 C DE668883 C DE 668883C
- Authority
- DE
- Germany
- Prior art keywords
- copper oxide
- rectifier elements
- oxide rectifier
- making copper
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 title claims description 7
- 239000005751 Copper oxide Substances 0.000 title claims description 7
- 229910000431 copper oxide Inorganic materials 0.000 title claims description 7
- 238000000034 method Methods 0.000 title claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000010791 quenching Methods 0.000 claims description 4
- 230000000171 quenching effect Effects 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000000137 annealing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 239000012188 paraffin wax Substances 0.000 claims description 2
- 229910000634 wood's metal Inorganic materials 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/16—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising cuprous oxide or cuprous iodide
- H01L21/161—Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate, reduction treatment
- H01L21/164—Oxidation and subsequent heat treatment of the foundation plate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02614—Transformation of metal, e.g. oxidation, nitridation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Chemical And Physical Treatments For Wood And The Like (AREA)
- Lubricants (AREA)
Description
Verfahren zum Herstellen von Kupferoxydul-Gleichrichterelementen Es ist ein Verfahren zum Herstellen von Kupferoxydul-Gleichrichterelementen bekannt, nach welchem man auf einem Kupferkörper durch Erhitzung unter Luftzutritt eine Oxydulschicht bildet und ihn dann zweistufig in der Weise abkühlt, daß man ihn zunächst in einem Kühlofen kurzzeitig von der Oxydationstemperatur (etwa iooo° C) auf eine mittlere Temperatur (etwa 6oo° C) herunterkühlt und schließlich in kaltem Wasser abschreckt. Es soll auf diese Weise nicht nur eine besonders gleichmäßige und dichte, sondern vor allem eine an dem Kupferkörper festhaftende Oxydulschicht erzielt werden.Method of making copper oxide rectifier elements Es a method for producing copper oxide rectifier elements is known, after which a layer of oxide is formed on a copper body by heating it with the admission of air forms and then cools it in two stages in such a way that it is first in one Cooling furnace briefly from the oxidation temperature (about 100 ° C) to a medium one Temperature (about 600 ° C) cools down and finally quenched in cold water. In this way it should not only be particularly even and dense, but above all an oxide layer adhering firmly to the copper body can be achieved.
Mit diesem bekannten Verfahren lassen sich Kupferoxydulgleichrichter mit einer Sperrspannung von etwa 5 Volt pro Element herstellen, die einen verhältnismäßig niedrigen Widerstand in der Stromdurchflußrichtung aufweisen und bei gutem Wirkungsgrad mit verhältnismäßig hoher Stromstärke belastbar sind.This known method can be used for copper oxide rectifiers with a reverse voltage of about 5 volts per element, which is a relatively have low resistance in the direction of current flow and with good efficiency can be loaded with a relatively high amperage.
Es ist auch bekannt, daß man I#',upferoxydul-Gleichrichterelemente für eine höhere als die normale Sperrspannung, und zwar für 15 Volt und mehr, erzielen kann, wenn man die unter Luftzutritt geglühten Kupferscheiben sich allmählich in Luft bis auf Raumtemperatur abkühlen läßt. Die auf dieseWeise hergestellten Gleichrichterelemente weisen einen höheren Widerstand in der Durchlaßrichtung als die Scheiben für normale Sperrspannung auf, sind strommäßig weniger hoch belastbar und ergeben bei gleicher Leistung wie die normalen Scheiben einen gleichen Wirkungsgrad.It is also known to use I # ', copper oxide rectifier elements for a higher than normal reverse voltage, namely for 15 volts and more can, if the copper disks, annealed with air, are gradually turned into Allow air to cool to room temperature. The rectifying elements made in this way have a higher resistance in the forward direction than the discs for normal Reverse voltage on, are less highly resilient in terms of current and result in the same Performance as the normal disks have the same efficiency.
Die Erfindung bezweckt, Kupferoxydul-Gleichrichterelemente zu schaffen, deren Sperrspannung weit über dem normalen Wert von etwa 5 Volt pro Element liegt und die trotzdem einen kleinen Durchlaßwiderstand aufweisen. Da diese Elemente strom- und spannungsmäßig hoch belastbar sind, können sie höher ausgenutzt werden und ergeben einen besseren Wirkungsgrad als die durch kurzzeitige Anwendung einer Zwischentemperatur in einem Kühlofen und nachfolgendes Abschrecken in kaltem Wasser erzielten Gleichrichterelemente für normale Sperrspannung. Dieser Zweck wird gemäß der Erfindung dadurch erreicht, daß man die unter Luftzutritt bei etwa iooo° C geglühten Kupferscheiben im unmittelbaren Anschluß an die Glühung einer 30 Minuten oder länger dauernden Zwischenbehandlung in einem an sich bekannten Kühlofen bei 300 bis 6oo° C unterwirft und sie darauf in einem warmen, flüssigen Mittel abschreckt. Als Abschreckmittel ist sowohl warmes Wasser als auch geschmolzenes Paraffin oder Wood-Metall geeignet.The aim of the invention is to create copper oxide rectifier elements whose reverse voltage is well above the normal value of about 5 volts per element and which nevertheless have a low forward resistance. Since these elements can withstand high currents and voltages, they can be used to a greater extent and result in better efficiency than the rectifier elements for normal reverse voltage achieved by briefly applying an intermediate temperature in a cooling furnace and subsequent quenching in cold water. This purpose is achieved according to the invention by subjecting the copper disks annealed with air at about 100 ° C. immediately after the annealing to an intermediate treatment lasting 30 minutes or longer in a cooling furnace known per se at 300 to 600 ° C. and then subjecting them quenching in a warm liquid medium. Both warm water and molten paraffin or Wood metal are suitable as quenching agents.
Die günstige Wirkung des vorstehend beschriebenen Verfahrens dürfte
darauf zurückzuführen sein, daß infolge der verlängerten Zwischenhandlung (30 oder
mehr Minuten,
statt wie bisher nur 5- bis 8 Minuten) ein Sauerstoffausgleich
herbeigeführt wird; der
Claims (1)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES121788D DE668883C (en) | 1936-02-27 | 1936-02-27 | Process for making copper oxide rectifier elements |
GB5439/37A GB490550A (en) | 1936-02-27 | 1937-02-23 | An improved process for the production of cuprous oxide rectifier elements |
FR818370D FR818370A (en) | 1936-02-27 | 1937-02-25 | Process for manufacturing cuprous oxide rectifying elements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES121788D DE668883C (en) | 1936-02-27 | 1936-02-27 | Process for making copper oxide rectifier elements |
Publications (1)
Publication Number | Publication Date |
---|---|
DE668883C true DE668883C (en) | 1938-12-12 |
Family
ID=7535657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DES121788D Expired DE668883C (en) | 1936-02-27 | 1936-02-27 | Process for making copper oxide rectifier elements |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE668883C (en) |
FR (1) | FR818370A (en) |
GB (1) | GB490550A (en) |
-
1936
- 1936-02-27 DE DES121788D patent/DE668883C/en not_active Expired
-
1937
- 1937-02-23 GB GB5439/37A patent/GB490550A/en not_active Expired
- 1937-02-25 FR FR818370D patent/FR818370A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR818370A (en) | 1937-09-24 |
GB490550A (en) | 1938-08-17 |
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