DE60335053D1 - Dielektrische keramische Zusammensetzung und dielektrische Keramiken - Google Patents

Dielektrische keramische Zusammensetzung und dielektrische Keramiken

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Publication number
DE60335053D1
DE60335053D1 DE60335053T DE60335053T DE60335053D1 DE 60335053 D1 DE60335053 D1 DE 60335053D1 DE 60335053 T DE60335053 T DE 60335053T DE 60335053 T DE60335053 T DE 60335053T DE 60335053 D1 DE60335053 D1 DE 60335053D1
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Germany
Prior art keywords
dielectric
ceramic composition
ceramics
dielectric ceramic
dielectric ceramics
Prior art date
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DE60335053T
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English (en)
Inventor
Tatsuji Furuse
Seiichiro Hirahara
Shuji Nakazawa
Yasushi Ode
Tomoyuki Kojima
Fumiaki Sekine
Hiroshi Makino
Manabu Yonekura
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Kyocera Corp
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Kyocera Corp
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Publication date
Priority claimed from JP2002123057A external-priority patent/JP3898560B2/ja
Priority claimed from JP2002137578A external-priority patent/JP2003286074A/ja
Application filed by Kyocera Corp filed Critical Kyocera Corp
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Publication of DE60335053D1 publication Critical patent/DE60335053D1/de
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DE60335053T 2002-01-28 2003-01-27 Dielektrische keramische Zusammensetzung und dielektrische Keramiken Expired - Lifetime DE60335053D1 (de)

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JP2005154885A (ja) * 2003-03-26 2005-06-16 Mitsubishi Heavy Ind Ltd 遮熱コーティング材料
WO2004094338A1 (ja) * 2003-04-21 2004-11-04 Asahi Glass Company, Limited 誘電体形成用無鉛ガラス、誘電体形成用ガラスセラミックス組成物、誘電体および積層誘電体製造方法
US7596672B1 (en) * 2003-10-24 2009-09-29 Network Appliance, Inc. Synchronous mirroring including writing image updates to a file
CN100524168C (zh) * 2004-06-21 2009-08-05 皇家飞利浦电子股份有限公司 电源管理
KR100670140B1 (ko) 2004-08-26 2007-01-16 삼성에스디아이 주식회사 커패시터
CN100398479C (zh) * 2004-10-18 2008-07-02 成都理工大学 人造透辉石材料及其制备方法
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JP5645136B2 (ja) 2009-03-26 2014-12-24 日立金属株式会社 誘電体磁器組成物、多層誘電体基板、電子部品、及び誘電体磁器組成物の製造方法
CN102503405B (zh) * 2011-11-22 2013-05-08 电子科技大学 一种复合bzt微波陶瓷介质材料及其制备方法
DE102011119804B4 (de) 2011-11-24 2019-02-07 Schott Ag Dielektrikum für den Hochfrequenzbereich und seine Verwendung
DE102011119798A1 (de) 2011-11-24 2013-05-29 Schott Ag Glaskeramik als Dielektrikum im Hochfrequenzbereich
TW201326074A (zh) * 2011-12-23 2013-07-01 Walsin Technology Corp 具抗還原特性之微波陶瓷組成物及其微波陶瓷材料
CN103193389B (zh) * 2012-01-05 2015-11-18 东莞华科电子有限公司 微波介电玻璃陶瓷材料及其组成物
CN103193388B (zh) * 2012-01-05 2015-06-24 东莞华科电子有限公司 具抗还原特性的微波陶瓷组成物及其微波陶瓷材料
CN104108935B (zh) * 2014-07-22 2016-01-06 桂林电子科技大学 一种具有自发压电性能的高温无铅压电陶瓷及其制备方法
JP6293704B2 (ja) * 2015-05-28 2018-03-14 スナップトラック・インコーポレーテッド ガラスセラミックス焼結体及び配線基板
CN105541115B (zh) * 2016-02-03 2019-04-16 同济大学 一种钛酸铌酸复合玻璃陶瓷及其制备方法和应用
CN108529886B (zh) * 2018-05-03 2021-04-09 东莞市美志电子有限公司 一种微晶陶瓷电容芯片及其制备方法
US10858282B1 (en) 2019-06-07 2020-12-08 Qualcomm Incorporated Doped, low-temperature co-fired glass-ceramic (LTCC) insulating substrates, and related wiring boards and methods of manufacture
CN112174665B (zh) * 2020-09-25 2022-07-26 西华大学 5g基站用介电常数精准可控的滤波器陶瓷及其制备方法
CN113072379A (zh) * 2021-03-31 2021-07-06 中国振华集团云科电子有限公司 一种高介电高机械强度玻璃陶瓷烧结基板及其制备方法
CN113185280B (zh) * 2021-04-27 2022-06-28 四川海祥电子科技有限公司 一种高Qf微波介质材料制备方法
CN114573235B (zh) * 2022-01-25 2023-07-28 深圳顺络电子股份有限公司 一种高强度低损耗温度稳定型ltcc介质材料及其制备方法

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JPH06279104A (ja) * 1993-03-26 1994-10-04 Matsushita Electric Ind Co Ltd 多層配線基板用セラミック組成物
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US6753277B2 (en) * 2000-02-29 2004-06-22 Kyocera Corporation Ceramics having excellent high-frequency characteristics and method of producing the same
JP2001348268A (ja) 2000-06-05 2001-12-18 Nippon Electric Glass Co Ltd 低温焼結誘電体材料及び誘電体
JP3793560B2 (ja) * 2000-11-30 2006-07-05 京セラ株式会社 低温焼成磁器およびその製造方法

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