DE60313720D1 - Thermisch leitfähiger aus Epoxidharz gegossener Artikel und Herstellunsverfahren desselben - Google Patents

Thermisch leitfähiger aus Epoxidharz gegossener Artikel und Herstellunsverfahren desselben

Info

Publication number
DE60313720D1
DE60313720D1 DE60313720T DE60313720T DE60313720D1 DE 60313720 D1 DE60313720 D1 DE 60313720D1 DE 60313720 T DE60313720 T DE 60313720T DE 60313720 T DE60313720 T DE 60313720T DE 60313720 D1 DE60313720 D1 DE 60313720D1
Authority
DE
Germany
Prior art keywords
herstellungsunsverfahren
same
molded article
thermally conductive
conductive epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60313720T
Other languages
English (en)
Other versions
DE60313720T2 (de
Inventor
Masayuki Tobita
Naoyuki Shimoyama
Tsukasa Ishigaki
Hisashi Aoki
Toru Kimura
Mitsukazu Ochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polymatech Co Ltd
Original Assignee
Polymatech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polymatech Co Ltd filed Critical Polymatech Co Ltd
Application granted granted Critical
Publication of DE60313720D1 publication Critical patent/DE60313720D1/de
Publication of DE60313720T2 publication Critical patent/DE60313720T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C09K19/3833—Polymers with mesogenic groups in the side chain
    • C09K19/3876—Polyoxyalkylene polymers
    • C09K19/388—Polyepoxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/52—Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Epoxy Resins (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE60313720T 2002-11-27 2003-09-27 Wärmeleitfähiger, aus Epoxidharz geformter Gegenstand und Verfahren zu dessen Herstellung Expired - Lifetime DE60313720T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002343822 2002-11-27
JP2002343822A JP2004175926A (ja) 2002-11-27 2002-11-27 熱伝導性エポキシ樹脂成形体及びその製造方法

Publications (2)

Publication Number Publication Date
DE60313720D1 true DE60313720D1 (de) 2007-06-21
DE60313720T2 DE60313720T2 (de) 2008-01-24

Family

ID=32290447

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60313720T Expired - Lifetime DE60313720T2 (de) 2002-11-27 2003-09-27 Wärmeleitfähiger, aus Epoxidharz geformter Gegenstand und Verfahren zu dessen Herstellung

Country Status (6)

Country Link
US (1) US20040102597A1 (de)
EP (1) EP1424383B1 (de)
JP (1) JP2004175926A (de)
KR (1) KR20040047567A (de)
DE (1) DE60313720T2 (de)
TW (1) TW200409305A (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4414674B2 (ja) * 2003-05-07 2010-02-10 ポリマテック株式会社 熱伝導性エポキシ樹脂成形体及びその製造方法
US7033670B2 (en) * 2003-07-11 2006-04-25 Siemens Power Generation, Inc. LCT-epoxy polymers with HTC-oligomers and method for making the same
US7781063B2 (en) * 2003-07-11 2010-08-24 Siemens Energy, Inc. High thermal conductivity materials with grafted surface functional groups
WO2005085334A1 (ja) * 2004-03-09 2005-09-15 Polymatech Co., Ltd. 高分子複合成形体、該成形体を用いたプリント配線基板及びそれらの製造方法
US20080050580A1 (en) * 2004-06-15 2008-02-28 Stevens Gary C High Thermal Conductivity Mica Paper Tape
US8216672B2 (en) * 2004-06-15 2012-07-10 Siemens Energy, Inc. Structured resin systems with high thermal conductivity fillers
US20050277721A1 (en) 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
US20050274774A1 (en) * 2004-06-15 2005-12-15 Smith James D Insulation paper with high thermal conductivity materials
US7553781B2 (en) * 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
US7776392B2 (en) 2005-04-15 2010-08-17 Siemens Energy, Inc. Composite insulation tape with loaded HTC materials
CA2578687A1 (en) * 2004-07-20 2006-01-26 Nippon Kayaku Kabushiki Kaisha Epoxy resin, epoxy resin composition, and cured product thereof
JP5084148B2 (ja) * 2005-02-25 2012-11-28 Ｊｎｃ株式会社 放熱部材およびその製造方法
US7846853B2 (en) * 2005-04-15 2010-12-07 Siemens Energy, Inc. Multi-layered platelet structure
US7651963B2 (en) * 2005-04-15 2010-01-26 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
US7851059B2 (en) * 2005-06-14 2010-12-14 Siemens Energy, Inc. Nano and meso shell-core control of physical properties and performance of electrically insulating composites
US8357433B2 (en) * 2005-06-14 2013-01-22 Siemens Energy, Inc. Polymer brushes
US7955661B2 (en) * 2005-06-14 2011-06-07 Siemens Energy, Inc. Treatment of micropores in mica materials
US7781057B2 (en) * 2005-06-14 2010-08-24 Siemens Energy, Inc. Seeding resins for enhancing the crystallinity of polymeric substructures
US20070013054A1 (en) * 2005-07-12 2007-01-18 Ruchert Brian D Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages
US20070090517A1 (en) * 2005-10-05 2007-04-26 Moon Sung-Won Stacked die package with thermally conductive block embedded in substrate
JP4880986B2 (ja) * 2005-12-02 2012-02-22 ポリマテック株式会社 エポキシ樹脂組成物を用いて形成される物品の製造方法
US20090023056A1 (en) * 2007-07-18 2009-01-22 Tesla Motors, Inc. Battery pack thermal management system
TWI350716B (en) * 2008-12-29 2011-10-11 Nanya Plastics Corp High thermal conductivity, halogen-free flame-retardent resin composition and its pre-impregnated and coating materials for printed circuit boards
CN105542125B (zh) * 2009-09-29 2018-02-06 日立化成株式会社 树脂组合物、树脂片、树脂固化物及其制造方法、树脂片层叠体及其制造方法
TW201244339A (en) * 2011-04-20 2012-11-01 Delta Electronics Inc Motor and fan using the same
KR20130008409A (ko) * 2011-07-12 2013-01-22 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 방열회로기판
KR101262588B1 (ko) 2011-07-28 2013-05-08 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 방열회로기판
JP2013185145A (ja) * 2012-03-12 2013-09-19 Tdk Corp エポキシ樹脂硬化物、並びにこれを用いた積層板
JP5687323B1 (ja) * 2013-09-30 2015-03-18 住友理工株式会社 吸音カバー、吸音アセンブリ、および磁気誘導発泡成形装置
TWI658091B (zh) * 2014-05-09 2019-05-01 日商捷恩智股份有限公司 放熱部材、電子機器
JP6168676B2 (ja) * 2014-08-11 2017-07-26 株式会社アイ．エス．テイ エラストマーの熱伝導性改質剤、液晶性高分子の使用方法、エラストマーの熱伝導性改質方法、ならびに発熱体および被加熱体
US11676880B2 (en) 2016-11-26 2023-06-13 Texas Instruments Incorporated High thermal conductivity vias by additive processing
US11004680B2 (en) 2016-11-26 2021-05-11 Texas Instruments Incorporated Semiconductor device package thermal conduit
US10256188B2 (en) 2016-11-26 2019-04-09 Texas Instruments Incorporated Interconnect via with grown graphitic material
US10529641B2 (en) 2016-11-26 2020-01-07 Texas Instruments Incorporated Integrated circuit nanoparticle thermal routing structure over interconnect region
US10861763B2 (en) 2016-11-26 2020-12-08 Texas Instruments Incorporated Thermal routing trench by additive processing
US10811334B2 (en) 2016-11-26 2020-10-20 Texas Instruments Incorporated Integrated circuit nanoparticle thermal routing structure in interconnect region
CN111032721A (zh) * 2017-08-30 2020-04-17 日立化成株式会社 环氧树脂固化物、环氧树脂组合物、成形体及复合材料
KR102171222B1 (ko) 2018-08-17 2020-10-28 한국과학기술연구원 고열전도성 고분자 복합체 및 제조방법
CN113249009A (zh) * 2021-05-08 2021-08-13 国网浙江省电力有限公司湖州供电公司 一种母排用高效散热绝缘涂层及制备方法
WO2023162295A1 (ja) * 2022-02-28 2023-08-31 Tdk株式会社 樹脂硬化物、樹脂基板および積層基板
KR20240030146A (ko) 2022-08-30 2024-03-07 경북대학교 산학협력단 방열 소재용 액정성 에폭시 수지 조성물 및 이의 경화물

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4962160A (en) * 1986-01-24 1990-10-09 Hoechst Celanese Corporation Side chain liquid crystalline polymers exhibiting nonlinear optical response
US5266660A (en) * 1989-01-17 1993-11-30 The Dow Chemical Co. Curable compositions containing mesogenic epoxy compounds and cured products thereof
US5391651A (en) * 1990-08-03 1995-02-21 The Dow Chemical Company Curable mixtures of mesogenic epoxy resins and mesogenic polyamines and cured compositions
JP2002121404A (ja) * 2000-10-19 2002-04-23 Polymatech Co Ltd 熱伝導性高分子シート
JP2003301048A (ja) * 2002-04-10 2003-10-21 Polymatech Co Ltd 熱伝導性成形体
JP4414674B2 (ja) * 2003-05-07 2010-02-10 ポリマテック株式会社 熱伝導性エポキシ樹脂成形体及びその製造方法

Also Published As

Publication number Publication date
US20040102597A1 (en) 2004-05-27
EP1424383B1 (de) 2007-05-09
DE60313720T2 (de) 2008-01-24
JP2004175926A (ja) 2004-06-24
KR20040047567A (ko) 2004-06-05
EP1424383A1 (de) 2004-06-02
TW200409305A (en) 2004-06-01

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