DE60313552D1 - Verfahren zur Herstellung eines Dehnungsmesssensors - Google Patents

Verfahren zur Herstellung eines Dehnungsmesssensors

Info

Publication number
DE60313552D1
DE60313552D1 DE60313552T DE60313552T DE60313552D1 DE 60313552 D1 DE60313552 D1 DE 60313552D1 DE 60313552 T DE60313552 T DE 60313552T DE 60313552 T DE60313552 T DE 60313552T DE 60313552 D1 DE60313552 D1 DE 60313552D1
Authority
DE
Germany
Prior art keywords
producing
strain gauge
gauge sensor
sensor
strain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60313552T
Other languages
English (en)
Other versions
DE60313552T2 (de
Inventor
Hiroshi Nagasaka
Naoki Yoshida
Hiroshi Kodama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nagano Keiki Co Ltd
Original Assignee
Nagano Keiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagano Keiki Co Ltd filed Critical Nagano Keiki Co Ltd
Publication of DE60313552D1 publication Critical patent/DE60313552D1/de
Application granted granted Critical
Publication of DE60313552T2 publication Critical patent/DE60313552T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
DE60313552T 2002-09-30 2003-09-30 Verfahren zur Herstellung eines Dehnungsmesssensors Expired - Lifetime DE60313552T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002287881 2002-09-30
JP2002287881A JP3713008B2 (ja) 2002-09-30 2002-09-30 歪み量検出装置の製造方法

Publications (2)

Publication Number Publication Date
DE60313552D1 true DE60313552D1 (de) 2007-06-14
DE60313552T2 DE60313552T2 (de) 2007-08-30

Family

ID=31973455

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60313552T Expired - Lifetime DE60313552T2 (de) 2002-09-30 2003-09-30 Verfahren zur Herstellung eines Dehnungsmesssensors

Country Status (4)

Country Link
US (2) US20040063238A1 (de)
EP (1) EP1403629B1 (de)
JP (1) JP3713008B2 (de)
DE (1) DE60313552T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4452526B2 (ja) * 2004-03-03 2010-04-21 長野計器株式会社 歪検出素子及び圧力センサ
JP4185478B2 (ja) * 2004-07-23 2008-11-26 長野計器株式会社 歪検出器およびその製造方法
TWI416739B (zh) * 2006-05-01 2013-11-21 Tanita Seisakusho Kk 半導體型應變檢測器及其製造方法
KR101846166B1 (ko) * 2010-08-20 2018-04-06 엘지전자 주식회사 무선 통신 시스템에서 제어 정보를 송신하는 방법 및 이를 위한 장치
EP2421187B1 (de) 2010-08-20 2018-02-28 LG Electronics Inc. Verfahren zur Übertragung von Steuerinformationen in einem drahtlosen Kommunikationssystem und Vorrichtung dafür
US9121258B2 (en) * 2010-11-08 2015-09-01 Baker Hughes Incorporated Sensor on a drilling apparatus
US9372124B2 (en) * 2012-01-20 2016-06-21 Baker Hughes Incorporated Apparatus including strain gauges for estimating downhole string parameters
US9057247B2 (en) 2012-02-21 2015-06-16 Baker Hughes Incorporated Measurement of downhole component stress and surface conditions
JP2015184100A (ja) * 2014-03-24 2015-10-22 セイコーエプソン株式会社 物理量センサー、物理量センサーの製造方法、圧力センサー、高度計、電子機器および移動体
US20160231097A1 (en) * 2014-08-22 2016-08-11 The Regents Of The University Of Michigan Patterned Nano-Engineered Thin Films On Flexible Substrates For Sensing Applications
JP6714439B2 (ja) * 2016-06-09 2020-06-24 長野計器株式会社 歪検出器及びその製造方法

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JPS5611312A (en) * 1979-07-10 1981-02-04 Hitachi Ltd Semiconductor displacement converter
JPH0670969B2 (ja) * 1984-09-13 1994-09-07 株式会社長野計器製作所 シリコン薄膜ピエゾ抵抗素子の製造法
JPH01173846A (ja) * 1987-09-10 1989-07-10 Komatsu Ltd 薄膜圧力センサの製造方法
US5167158A (en) * 1987-10-07 1992-12-01 Kabushiki Kaisha Komatsu Seisakusho Semiconductor film pressure sensor and method of manufacturing same
DE3814348A1 (de) * 1988-04-28 1989-11-09 Philips Patentverwaltung Verfahren zur herstellung einer polykristallinen halbleitenden widerstandsschicht aus silicium auf einem siliciumtraeger
US5191798A (en) * 1988-09-30 1993-03-09 Kabushiki Kaisha Komatsu Seisakusho Pressure sensor
JPH02215166A (ja) * 1989-02-15 1990-08-28 Nippon Soken Inc 圧力検出器
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US5417111A (en) * 1990-08-17 1995-05-23 Analog Devices, Inc. Monolithic chip containing integrated circuitry and suspended microstructure
US5326726A (en) * 1990-08-17 1994-07-05 Analog Devices, Inc. Method for fabricating monolithic chip containing integrated circuitry and suspended microstructure
US5351555A (en) * 1991-07-29 1994-10-04 Magnetoelastic Devices, Inc. Circularly magnetized non-contact torque sensor and method for measuring torque using same
EP0738882B1 (de) * 1991-12-27 2001-10-24 ISHIDA CO., Ltd. Wägezelle mit einer Platte mit einer Öffnung und überbrückendem Dehnungssensor
CA2278841C (en) * 1997-01-29 2007-05-01 Nippon Steel Corporation High strength steels having excellent formability and high impact energy absorption properties, and a method for producing the same
JP3998046B2 (ja) * 1997-08-22 2007-10-24 株式会社イシダ ロードセルの製造方法およびロードセル
US6406570B1 (en) * 1998-03-26 2002-06-18 Mettler-Toledo, Gmbh Elastic component for a precision instrument and process for its manufacture
DE19813459A1 (de) * 1998-03-26 1999-09-30 Mettler Toledo Gmbh Elastisch verformbares Bauteil und Verfahren zu seiner Herstellung
US6729187B1 (en) * 1999-04-29 2004-05-04 The Board Of Governors For Higher Education, State Of Rhode Island And Providence Plantations Self-compensated ceramic strain gage for use at high temperatures
US6546806B1 (en) * 1999-09-17 2003-04-15 Ut-Battelle Multi-range force sensors utilizing shape memory alloys
JP3452251B2 (ja) * 2000-03-29 2003-09-29 愛知製鋼株式会社 機械構造用マルテンサイト系析出硬化型ステンレス鋼
KR100683321B1 (ko) * 2000-05-15 2007-02-15 미쓰비시덴키 가부시키가이샤 센서 소자 및 그의 제조 방법
JP2002038242A (ja) * 2000-07-27 2002-02-06 Kawasaki Steel Corp 二次加工性に優れた自動車構造部材用ステンレス鋼管
US6427539B1 (en) * 2000-07-31 2002-08-06 Motorola, Inc. Strain gauge
JP4250868B2 (ja) * 2000-09-05 2009-04-08 株式会社デンソー 半導体圧力センサの製造方法
JP3675710B2 (ja) * 2000-10-27 2005-07-27 矢崎総業株式会社 センシング素子の固定構造
US6622558B2 (en) * 2000-11-30 2003-09-23 Orbital Research Inc. Method and sensor for detecting strain using shape memory alloys
JP3696552B2 (ja) * 2001-04-12 2005-09-21 日新製鋼株式会社 加工性，冷間鍛造性に優れた軟質ステンレス鋼板
US6772642B2 (en) * 2001-08-24 2004-08-10 Damian A. Hajduk High throughput mechanical property and bulge testing of materials libraries
US6690179B2 (en) * 2001-08-24 2004-02-10 Symyx Technologies, Inc. High throughput mechanical property testing of materials libraries using capacitance
US6650102B2 (en) * 2001-08-24 2003-11-18 Symyx Technologies, Inc. High throughput mechanical property testing of materials libraries using a piezoelectric

Also Published As

Publication number Publication date
EP1403629B1 (de) 2007-05-02
EP1403629A2 (de) 2004-03-31
JP2004125516A (ja) 2004-04-22
JP3713008B2 (ja) 2005-11-02
EP1403629A3 (de) 2005-07-06
US20040063238A1 (en) 2004-04-01
US7331102B2 (en) 2008-02-19
DE60313552T2 (de) 2007-08-30
US20060099821A1 (en) 2006-05-11

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Legal Events

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