DE60310666D1 - Integriertes Schaltungssystem mit Latentwärmespeichermodul - Google Patents

Integriertes Schaltungssystem mit Latentwärmespeichermodul

Info

Publication number
DE60310666D1
DE60310666D1 DE60310666T DE60310666T DE60310666D1 DE 60310666 D1 DE60310666 D1 DE 60310666D1 DE 60310666 T DE60310666 T DE 60310666T DE 60310666 T DE60310666 T DE 60310666T DE 60310666 D1 DE60310666 D1 DE 60310666D1
Authority
DE
Germany
Prior art keywords
integrated circuit
heat storage
storage module
latent heat
circuit system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60310666T
Other languages
English (en)
Other versions
DE60310666T2 (de
Inventor
Michael Frisch
Ralf Ehler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vincotech GmbH
Original Assignee
Tyco Electronics AMP GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics AMP GmbH filed Critical Tyco Electronics AMP GmbH
Priority to DE60310666T priority Critical patent/DE60310666T2/de
Publication of DE60310666D1 publication Critical patent/DE60310666D1/de
Application granted granted Critical
Publication of DE60310666T2 publication Critical patent/DE60310666T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/913—Material designed to be responsive to temperature, light, moisture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249955—Void-containing component partially impregnated with adjacent component
    • Y10T428/249956—Void-containing component is inorganic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/24999—Inorganic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/249991—Synthetic resin or natural rubbers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE60310666T 2002-10-30 2003-10-16 Integriertes Schaltungssystem mit Latentwärmespeichermodul Expired - Lifetime DE60310666T2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE60310666T DE60310666T2 (de) 2002-10-30 2003-10-16 Integriertes Schaltungssystem mit Latentwärmespeichermodul

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10250604 2002-10-30
DE2002150604 DE10250604A1 (de) 2002-10-30 2002-10-30 Integriertes Schaltungssystem mit Latentwärmespeichermodul
DE60310666T DE60310666T2 (de) 2002-10-30 2003-10-16 Integriertes Schaltungssystem mit Latentwärmespeichermodul

Publications (2)

Publication Number Publication Date
DE60310666D1 true DE60310666D1 (de) 2007-02-08
DE60310666T2 DE60310666T2 (de) 2007-11-15

Family

ID=32087293

Family Applications (2)

Application Number Title Priority Date Filing Date
DE2002150604 Ceased DE10250604A1 (de) 2002-10-30 2002-10-30 Integriertes Schaltungssystem mit Latentwärmespeichermodul
DE60310666T Expired - Lifetime DE60310666T2 (de) 2002-10-30 2003-10-16 Integriertes Schaltungssystem mit Latentwärmespeichermodul

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE2002150604 Ceased DE10250604A1 (de) 2002-10-30 2002-10-30 Integriertes Schaltungssystem mit Latentwärmespeichermodul

Country Status (3)

Country Link
US (1) US6963131B2 (de)
EP (1) EP1416534B1 (de)
DE (2) DE10250604A1 (de)

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US7147071B2 (en) * 2004-02-04 2006-12-12 Battelle Energy Alliance, Llc Thermal management systems and methods
US7265983B2 (en) 2003-10-13 2007-09-04 Tyco Electronics Raychem Gmbh Power unit comprising a heat sink, and assembly method
US7284882B2 (en) * 2005-02-17 2007-10-23 Federal-Mogul World Wide, Inc. LED light module assembly
WO2007075130A1 (en) * 2005-12-27 2007-07-05 Abb Ab Device and method for cooling a power device
DE102006006175A1 (de) * 2006-02-10 2007-08-23 Ecpe Engineering Center For Power Electronics Gmbh Leistungselektronikanordnung
CN101443904B (zh) * 2006-03-13 2010-11-10 株式会社丰田自动织机 功率模块用基体
US7495916B2 (en) * 2007-06-19 2009-02-24 Honeywell International Inc. Low cost cold plate with film adhesive
DE102008004053A1 (de) * 2008-01-11 2009-07-23 Airbus Deutschland Gmbh Spitzenlast-Kühlung von elektronischen Bauteilen durch phasenwechselnde Materialien
TWI414235B (zh) * 2009-08-24 2013-11-01 Compal Electronics Inc 散熱模組
DE102009042519A1 (de) * 2009-09-16 2011-03-24 Esw Gmbh Vorrichtung zur Kühlung von Halbleitern
DE102010041714A1 (de) * 2010-09-30 2011-08-25 Infineon Technologies AG, 85579 Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls
US20120206880A1 (en) * 2011-02-14 2012-08-16 Hamilton Sundstrand Corporation Thermal spreader with phase change thermal capacitor for electrical cooling
DE102011001883B4 (de) * 2011-04-07 2020-02-20 Deutsches Zentrum für Luft- und Raumfahrt e.V. Wärmespeichervorrichtung und Bausatz für eine Wärmespeichervorrichtung
DE102011075565A1 (de) 2011-05-10 2012-11-15 Robert Bosch Gmbh Schaltungsmodul mit Kühlung durch Phasenwechselmaterial
US20140090808A1 (en) * 2011-05-17 2014-04-03 Sharp Kabushiki Kaisha Heat-transfer device
US20120293952A1 (en) * 2011-05-19 2012-11-22 International Business Machines Corporation Heat transfer apparatus
EP2568790B1 (de) * 2011-09-06 2013-09-04 ABB Research Ltd. Vorrichtung und Verfahren
EP2568789B1 (de) 2011-09-06 2014-04-16 ABB Research Ltd. Wärmetauscher
TW201320877A (zh) * 2011-11-04 2013-05-16 Most Energy Corp 熱管理裝置及電子設備
WO2014083717A1 (ja) * 2012-11-28 2014-06-05 三菱電機株式会社 パワーモジュール
DE102013217829A1 (de) 2013-09-06 2015-03-12 Siemens Aktiengesellschaft Integriertes Schaltungssystem mit einer ein Latentwärme-Speichermedium nutzenden Kühlvorrichtung
US9826662B2 (en) * 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
DE102014203225A1 (de) * 2014-02-24 2015-01-29 Siemens Aktiengesellschaft Anordnung und Verfahren zur Abfuhr der Wärmeverluste von elektrischen Bauelementen hoher Pulsleistung
KR102007351B1 (ko) 2015-03-24 2019-08-05 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조 방법
US10191422B2 (en) * 2016-08-29 2019-01-29 Kabushiki Kaisha Toshiba Heater and image forming apparatus
DE102016222248A1 (de) * 2016-11-14 2018-05-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Temperaturabhängiger Schaltmechanismus und dessen Verwendung
DE102017110722B4 (de) * 2017-05-17 2021-03-18 Semikron Elektronik Gmbh & Co. Kg Leistungselektronische Anordnung und elektrisches Fahrzeug hiermit
WO2021049604A1 (ja) * 2019-09-12 2021-03-18 株式会社デンソー 車載用電子装置
US20220357114A1 (en) * 2021-05-06 2022-11-10 Lenovo (Singapore) Pte. Ltd. High conductance fin
DE102023126586A1 (de) 2022-09-30 2024-04-04 Bernd WILDPANNER Halbleiter-Bauelement

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US4057101A (en) * 1976-03-10 1977-11-08 Westinghouse Electric Corporation Heat sink
JPS5935786A (ja) * 1982-08-20 1984-02-27 Taisei Corp 潜熱蓄熱体
DE3915707A1 (de) * 1989-05-13 1990-11-22 Asea Brown Boveri Kunststoffgehaeuse und leistungshalbleitermodul mit diesem gehaeuse
DE59010109D1 (de) 1989-06-06 1996-03-21 Gerd Hoermansdoerfer Latentwärmespeichermittel und deren Verwendung
JPH04101450A (ja) * 1990-08-20 1992-04-02 Meidensha Corp 冷却装置
JP3122173B2 (ja) * 1990-11-09 2001-01-09 株式会社東芝 放熱器、放熱装置および放熱器の製造方法
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US5455458A (en) * 1993-08-09 1995-10-03 Hughes Aircraft Company Phase change cooling of semiconductor power modules
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul
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DE19645636C1 (de) * 1996-11-06 1998-03-12 Telefunken Microelectron Leistungsmodul zur Ansteuerung von Elektromotoren
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
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US6009938A (en) * 1997-12-11 2000-01-04 Eastman Kodak Company Extruded, tiered high fin density heat sinks and method of manufacture
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US6668567B2 (en) * 1999-09-17 2003-12-30 Robert Levenduski Thermal storage apparatus and method for air conditioning system
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Also Published As

Publication number Publication date
US20040145048A1 (en) 2004-07-29
DE10250604A1 (de) 2004-05-19
DE60310666T2 (de) 2007-11-15
US6963131B2 (en) 2005-11-08
EP1416534B1 (de) 2006-12-27
EP1416534A1 (de) 2004-05-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: VINCOTECH (GERMANY) GMBH, 82008 UNTERHACHING, DE