DE60305333T2 - Druckprozess und lötmaskenfarbstoffzusammensetzung - Google Patents

Druckprozess und lötmaskenfarbstoffzusammensetzung Download PDF

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Publication number
DE60305333T2
DE60305333T2 DE60305333T DE60305333T DE60305333T2 DE 60305333 T2 DE60305333 T2 DE 60305333T2 DE 60305333 T DE60305333 T DE 60305333T DE 60305333 T DE60305333 T DE 60305333T DE 60305333 T2 DE60305333 T2 DE 60305333T2
Authority
DE
Germany
Prior art keywords
parts
solder mask
ink
weight
monomers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60305333T
Other languages
German (de)
English (en)
Other versions
DE60305333D1 (de
Inventor
John Alan Blackley HOPPER
Robert Mark Blackley JAMES
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Imaging Colorants Ltd
Original Assignee
Fujifilm Imaging Colorants Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Imaging Colorants Ltd filed Critical Fujifilm Imaging Colorants Ltd
Application granted granted Critical
Publication of DE60305333D1 publication Critical patent/DE60305333D1/de
Publication of DE60305333T2 publication Critical patent/DE60305333T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
    • C09D11/36Inkjet printing inks based on non-aqueous solvents
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Glass Compositions (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE60305333T 2002-09-20 2003-08-22 Druckprozess und lötmaskenfarbstoffzusammensetzung Expired - Lifetime DE60305333T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0221893 2002-09-20
GBGB0221893.1A GB0221893D0 (en) 2002-09-20 2002-09-20 Process
PCT/GB2003/003695 WO2004028225A1 (en) 2002-09-20 2003-08-22 Printing process and solder mask ink composition

Publications (2)

Publication Number Publication Date
DE60305333D1 DE60305333D1 (de) 2006-06-22
DE60305333T2 true DE60305333T2 (de) 2007-03-29

Family

ID=9944479

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60305333T Expired - Lifetime DE60305333T2 (de) 2002-09-20 2003-08-22 Druckprozess und lötmaskenfarbstoffzusammensetzung

Country Status (11)

Country Link
US (1) US20060047014A1 (https=)
EP (1) EP1543704B1 (https=)
JP (1) JP2005539390A (https=)
KR (1) KR20050057461A (https=)
CN (1) CN1695407A (https=)
AT (1) ATE326828T1 (https=)
AU (1) AU2003260739A1 (https=)
DE (1) DE60305333T2 (https=)
GB (1) GB0221893D0 (https=)
TW (1) TWI318231B (https=)
WO (1) WO2004028225A1 (https=)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7625420B1 (en) * 1997-02-24 2009-12-01 Cabot Corporation Copper powders methods for producing powders and devices fabricated from same
US20050039634A1 (en) * 2003-07-11 2005-02-24 Hermansky Clarence Gaetano Non-aqueous ink jet inks with improved decap
JP4290510B2 (ja) * 2003-08-22 2009-07-08 太陽インキ製造株式会社 インクジェット用光硬化性・熱硬化性組成物とそれを用いたプリント配線板
US7439285B2 (en) * 2004-01-23 2008-10-21 Printar Ltd. Liquid thermosetting ink
US7485242B2 (en) 2004-01-23 2009-02-03 Printar Ltd Reactive fine particles
GB0414847D0 (en) * 2004-07-02 2004-08-04 Avecia Ltd Process
JP4852953B2 (ja) * 2004-09-30 2012-01-11 セイコーエプソン株式会社 インク組成物およびそれを用いた画像形成方法
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
WO2006076605A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Circuit modeling and selective deposition
US20060158497A1 (en) * 2005-01-14 2006-07-20 Karel Vanheusden Ink-jet printing of compositionally non-uniform features
US8334464B2 (en) * 2005-01-14 2012-12-18 Cabot Corporation Optimized multi-layer printing of electronics and displays
TW200640596A (en) * 2005-01-14 2006-12-01 Cabot Corp Production of metal nanoparticles
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US20060176350A1 (en) * 2005-01-14 2006-08-10 Howarth James J Replacement of passive electrical components
WO2006076614A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation A process for manufacturing application specific printable circuits (aspc's) and other custom electronic devices
WO2006076603A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Printable electrical conductors
US20060160373A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Processes for planarizing substrates and encapsulating printable electronic features
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US7533361B2 (en) * 2005-01-14 2009-05-12 Cabot Corporation System and process for manufacturing custom electronics by combining traditional electronics with printable electronics
JP2009506187A (ja) 2005-08-31 2009-02-12 プリンター リミテッド Uv硬化可能なハイブリッド硬化インクジェットインク組成物およびそれを使用するソルダマスク
JP5520444B2 (ja) * 2005-11-11 2014-06-11 東洋インキScホールディングス株式会社 活性エネルギー線硬化型インクジェットインキ
EP1790695B1 (en) * 2005-11-28 2009-02-18 Agfa Graphics N.V. Non-aqueous quinacridone dispersions using dispersion synergists
EP1803784B3 (en) 2005-12-28 2018-02-14 Fujifilm Corporation Inkjet recording composition, inkjet recording method, method for producing planographic printing plate, and planographic printing plate
JP4979232B2 (ja) * 2005-12-28 2012-07-18 富士フイルム株式会社 インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
US20070281099A1 (en) * 2006-05-31 2007-12-06 Cabot Corporation Solderable pads utilizing nickel and silver nanoparticle ink jet inks
US20080291169A1 (en) * 2007-05-21 2008-11-27 Brenner David S Multimodal Adaptive User Interface for a Portable Electronic Device
US7883092B2 (en) 2007-12-31 2011-02-08 Scientific Games International, Inc. Energy cured coating
KR101401488B1 (ko) * 2008-01-10 2014-06-03 동우 화인켐 주식회사 착색 감광성 수지 조성물 및 이를 이용하여 제조된컬러필터와 액정표시장치
US8399175B2 (en) * 2008-04-07 2013-03-19 Addison Clear Wave, Llc Photopolymer resins for photo replication of information layers
US8778074B2 (en) 2009-07-20 2014-07-15 Markem-Imaje Corporation Solvent-based inkjet ink formulations
JP2011178832A (ja) * 2010-02-26 2011-09-15 Dic Corp 紫外線硬化型インクジェット記録用インク、それから得られた絶縁膜、電子素子及び電子素子の製造方法
EP2466380B1 (en) * 2010-12-20 2015-10-14 Agfa Graphics N.V. A method of preparing a flexographic printing master
US9309341B2 (en) 2010-12-20 2016-04-12 Agfa Graphics Nv Curable jettable fluid for making a flexographic printing master
TW201233403A (en) * 2011-02-11 2012-08-16 Univ Nat Taiwan Dental composite material and applications thereof
CN102858091B (zh) * 2011-06-28 2015-08-19 北大方正集团有限公司 一种清除混压成型pcb板树脂流胶的方法
JP6057406B2 (ja) * 2012-01-06 2017-01-11 住友重機械工業株式会社 薄膜形成装置及び薄膜形成方法
CN104093779A (zh) * 2012-01-19 2014-10-08 伊索拉美国有限公司 合成树脂以及由其制造的清漆、预浸料和层压板
TW201442130A (zh) * 2013-04-29 2014-11-01 Zen Voce Corp 可增進積體電路基板植球良率之方法
CN103568612B (zh) * 2013-11-06 2015-06-17 复旦大学 一种基于压电式家用喷墨打印技术制备印制电子阻焊材料的方法
US20150197062A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR Method, device, and system of three-dimensional printing
TW201600349A (zh) * 2014-03-26 2016-01-01 肯提克有限公司 多色列印技術
US9902006B2 (en) 2014-07-25 2018-02-27 Raytheon Company Apparatus for cleaning an electronic circuit board
US9606430B2 (en) * 2014-08-28 2017-03-28 Xerox Corporation Method of aerosol printing a solder mask ink composition
EP3289029B1 (en) 2015-05-01 2022-02-23 Sun Chemical Corporation Electrically-insulating energy curable ink or coating composition
EP3119170B1 (en) 2015-07-14 2018-12-26 Agfa-Gevaert Manufacturing printed circuit boards using uv free radical curable inkjet inks
EP3491080B1 (en) * 2016-07-27 2026-04-29 Sun Chemical Corporation Water-based electrically-insulating energy-curable fluids
EP3296368B1 (en) * 2016-09-14 2020-11-11 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing printed circuit boards
EP3321331B1 (en) 2016-11-10 2020-10-21 Agfa-Gevaert Solder mask inkjet inks for manufacturing printed circuit boards
US11098215B2 (en) 2016-11-10 2021-08-24 Agfa-Gevaert Solder mask inkjet inks for manufacturing printed circuit boards
EP3321332B1 (en) 2016-11-10 2019-07-31 Agfa-Gevaert Method for manufacturing an electronic device, such as printed circuit board
EP3321330B1 (en) 2016-11-10 2022-01-05 Agfa-Gevaert Nv Solder mask inkjet inks for manufacturing printed circuit boards
KR102456361B1 (ko) * 2017-09-11 2022-10-19 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 유전체 필름 형성 조성물
US20200326597A1 (en) * 2017-10-17 2020-10-15 Kateeva, Inc. Ink compositions with high quantum dot concentrations for display devices
CN111587274A (zh) * 2017-12-18 2020-08-25 爱克发-格法特公司 用于制造印刷电路板的阻焊喷墨油墨
EP3498788B1 (en) 2017-12-18 2023-05-03 Agfa-Gevaert Nv Solder mask inkjet inks for manufacturing printed circuit boards
JP7025570B2 (ja) 2018-03-02 2022-02-24 アグフア-ゲヴエルト,ナームローゼ・フエンノートシヤツプ プリント回路基板を製造するためのインキジェットインキ
CN111902493A (zh) * 2018-03-23 2020-11-06 科迪华公司 用于形成有机薄膜的组合物和技术
KR20210084544A (ko) 2018-11-26 2021-07-07 아그파-게바에르트 엔.브이. 신규 광개시제
EP3656824A1 (en) 2018-11-26 2020-05-27 Agfa-Gevaert Nv Radiation curable inkjet for manufacturing printed circuit boards
EP3686252A1 (en) 2019-01-24 2020-07-29 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
WO2020165897A1 (en) * 2019-02-14 2020-08-20 Orbotech Ltd A method and apparatus for preparing a pcb product having highly dense conductors
CN110831345A (zh) * 2019-11-22 2020-02-21 东莞市鸿运电子有限公司 一种厚铜板的印刷方法
EP3981846A1 (en) * 2020-10-09 2022-04-13 Agfa Nv Free radical curable inkjet inks and inkjet printing methods
CN114395287A (zh) * 2021-12-30 2022-04-26 广州斯达利电子原料有限公司 阻焊油墨、阻焊层、Mini-LED印刷线路板
CN118206895A (zh) * 2022-12-16 2024-06-18 庆鼎精密电子(淮安)有限公司 感光防焊油墨及电路板的制造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1179398A (en) * 1967-06-26 1970-01-28 Ford Motor Co Improvements in or relating to Printed Circuit Boards
JPS61278577A (ja) * 1985-06-05 1986-12-09 Mitsubishi Rayon Co Ltd 紫外線硬化型インキ組成物
US4789620A (en) * 1986-03-03 1988-12-06 Mitsubishi Rayon Co. Ltd. Liquid photosensitive resin composition containing carboxylated epoxy acrylates or methacrylates
JPH0686505B2 (ja) * 1986-03-10 1994-11-02 キヤノン株式会社 活性エネルギ−線硬化型樹脂組成物
US5089376A (en) * 1986-12-08 1992-02-18 Armstrong World Industries, Inc. Photoimagable solder mask coating
GB9123070D0 (en) * 1991-10-30 1991-12-18 Domino Printing Sciences Plc Ink
GB9014299D0 (en) * 1990-06-27 1990-08-15 Domino Printing Sciences Plc Ink composition
US5248752A (en) * 1991-11-12 1993-09-28 Union Carbide Chemicals & Plastics Technology Corporation Polyurethane (meth)acrylates and processes for preparing same
US5270368A (en) * 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process
US5288589A (en) * 1992-12-03 1994-02-22 Mckeever Mark R Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
US5910854A (en) * 1993-02-26 1999-06-08 Donnelly Corporation Electrochromic polymeric solid films, manufacturing electrochromic devices using such solid films, and processes for making such solid films and devices
DE69619575T2 (de) * 1995-04-13 2002-09-12 Mitsui Chemicals, Inc. Epoxyacrylatharze und ihre Verwendungen
US5643657A (en) * 1995-04-28 1997-07-01 E. I. Du Pont De Nemours And Company Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
GB9603667D0 (en) * 1996-02-21 1996-04-17 Coates Brothers Plc Ink composition
JPH10158582A (ja) * 1996-05-01 1998-06-16 Minnesota Mining & Mfg Co <3M> 保護用コーティングおよびインクカートリッジのためのその液体の適用
FR2772522B1 (fr) * 1997-12-17 2000-02-25 Framatome Connectors Int Dispositif de connexion a emboitement perpendiculaire, connecteur etanche a double verrouillage obtenu
DE19842379A1 (de) * 1998-09-16 2000-05-11 Tron Elektronik Gmbh F Verfahren zum zweidimensional-gerasterten Herstellen von Schichtstrukturen auf Schaltungsplatinen
US6310115B1 (en) * 1998-10-29 2001-10-30 Agfa-Gevaert Ink compositions for ink jet printing
JP2001288387A (ja) * 2000-04-05 2001-10-16 Sony Chem Corp 電離放射線硬化型インクジェット用インク及びその印画物
JP4611554B2 (ja) * 2000-12-01 2011-01-12 昭和電工株式会社 感光性組成物およびその硬化物ならびにそれを用いたプリント配線基板
AU2002230607B2 (en) * 2000-11-09 2006-06-29 3M Innovative Properties Company Weather resistant, ink jettable, radiation curable, fluid compositions particularly suitable for outdoor applications
US20030203994A1 (en) * 2002-04-26 2003-10-30 Michael Chen Solventless photo-sensitive thermosetting-type ink

Also Published As

Publication number Publication date
JP2005539390A (ja) 2005-12-22
EP1543704A1 (en) 2005-06-22
CN1695407A (zh) 2005-11-09
US20060047014A1 (en) 2006-03-02
TW200420682A (en) 2004-10-16
ATE326828T1 (de) 2006-06-15
TWI318231B (en) 2009-12-11
GB0221893D0 (en) 2002-10-30
DE60305333D1 (de) 2006-06-22
KR20050057461A (ko) 2005-06-16
EP1543704B1 (en) 2006-05-17
AU2003260739A1 (en) 2004-04-08
WO2004028225A1 (en) 2004-04-01

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