DE60235313D1 - Eweglichkeit einer metal-oxyd-halbleiter feldeffekttransistor aus siliziumcarbid - Google Patents

Eweglichkeit einer metal-oxyd-halbleiter feldeffekttransistor aus siliziumcarbid

Info

Publication number
DE60235313D1
DE60235313D1 DE60235313T DE60235313T DE60235313D1 DE 60235313 D1 DE60235313 D1 DE 60235313D1 DE 60235313 T DE60235313 T DE 60235313T DE 60235313 T DE60235313 T DE 60235313T DE 60235313 D1 DE60235313 D1 DE 60235313D1
Authority
DE
Germany
Prior art keywords
silicon carbide
effect transistor
semiconductor field
metal
eternality
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60235313T
Other languages
English (en)
Inventor
Richard Egloff
Satyendranath Mukherjee
Dev Alok
Emil Arnold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
Original Assignee
NXP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP BV filed Critical NXP BV
Application granted granted Critical
Publication of DE60235313D1 publication Critical patent/DE60235313D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/0445Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
    • H01L21/048Making electrodes
    • H01L21/049Conductor-insulator-semiconductor electrodes, e.g. MIS contacts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Formation Of Insulating Films (AREA)
  • Carbon And Carbon Compounds (AREA)
DE60235313T 2001-06-28 2002-06-14 Eweglichkeit einer metal-oxyd-halbleiter feldeffekttransistor aus siliziumcarbid Expired - Lifetime DE60235313D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/894,089 US6559068B2 (en) 2001-06-28 2001-06-28 Method for improving inversion layer mobility in a silicon carbide metal-oxide semiconductor field-effect transistor
PCT/IB2002/002299 WO2003003435A2 (en) 2001-06-28 2002-06-14 Method for improving inversion layer mobility in a silicon carbide metal-oxide semiconductor field-effect transistor

Publications (1)

Publication Number Publication Date
DE60235313D1 true DE60235313D1 (de) 2010-03-25

Family

ID=25402591

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60235313T Expired - Lifetime DE60235313D1 (de) 2001-06-28 2002-06-14 Eweglichkeit einer metal-oxyd-halbleiter feldeffekttransistor aus siliziumcarbid

Country Status (8)

Country Link
US (1) US6559068B2 (de)
EP (1) EP1430518B1 (de)
JP (1) JP2004533727A (de)
KR (1) KR20040014978A (de)
CN (1) CN1302521C (de)
AT (1) ATE457524T1 (de)
DE (1) DE60235313D1 (de)
WO (1) WO2003003435A2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7058941B1 (en) * 2000-11-14 2006-06-06 Microsoft Corporation Minimum delta generator for program binaries
JP4525958B2 (ja) * 2001-08-27 2010-08-18 独立行政法人産業技術総合研究所 半導体装置の製造方法
US6788136B2 (en) * 2001-10-25 2004-09-07 General Electric Company Methods and apparatus for amplification in high temperature environments
DE10336404B3 (de) 2003-08-06 2005-05-04 Adams, Michael Überwachungseinrichtung für Datenverarbeitungsanlagen
EP1666146A4 (de) * 2003-08-12 2009-07-01 Ngk Insulators Ltd Auf siliciumcarbid basierendes katalysatormaterial und herstellungsverfahren dafür
US20050269621A1 (en) * 2004-06-03 2005-12-08 Micron Technology, Inc. Flash memory devices on silicon carbide
CN101361189B (zh) * 2005-01-25 2011-02-16 莫克斯托尼克斯股份有限公司 高性能fet器件和方法
US7572741B2 (en) * 2005-09-16 2009-08-11 Cree, Inc. Methods of fabricating oxide layers on silicon carbide layers utilizing atomic oxygen
US7727904B2 (en) * 2005-09-16 2010-06-01 Cree, Inc. Methods of forming SiC MOSFETs with high inversion layer mobility
US20070096107A1 (en) * 2005-11-03 2007-05-03 Brown Dale M Semiconductor devices with dielectric layers and methods of fabricating same
CN1862202B (zh) * 2006-05-28 2010-05-12 南昌大学 高纯稀有金属冶炼炉炉衬的制备方法
JP5098295B2 (ja) * 2006-10-30 2012-12-12 株式会社デンソー 炭化珪素半導体装置の製造方法
DE102008042035A1 (de) * 2008-09-12 2010-03-18 Robert Bosch Gmbh Halbleiteranordnung sowie Verfahren zum Herstellen einer Halbleiteranordnung
CN102169104A (zh) * 2010-12-22 2011-08-31 重庆邮电大学 基于SiC的MOSFET的汽车发动机用氧传感器
US9984894B2 (en) 2011-08-03 2018-05-29 Cree, Inc. Forming SiC MOSFETs with high channel mobility by treating the oxide interface with cesium ions
JP2015177073A (ja) * 2014-03-14 2015-10-05 株式会社東芝 半導体装置およびその製造方法
CN104716045A (zh) * 2015-02-28 2015-06-17 上海芯亮电子科技有限公司 改善SiC热氧化后的界面态的制造方法
CN105206513B (zh) * 2015-09-28 2018-01-09 安徽工业大学 用氮和硼改善4H‑SiC MOSFET反型层迁移率的方法
US11345639B2 (en) * 2018-03-22 2022-05-31 Sumitomo Osaka Cement Co., Ltd. Composite sintered body, electrostatic chuck member, electrostatic chuck device, and method for producing composite sintered body

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499147A (en) * 1981-12-28 1985-02-12 Ibiden Co., Ltd. Silicon carbide substrates and a method of producing the same
JP2937817B2 (ja) * 1995-08-01 1999-08-23 松下電子工業株式会社 半導体基板表面の酸化膜の形成方法及びmos半導体デバイスの製造方法
US5972801A (en) * 1995-11-08 1999-10-26 Cree Research, Inc. Process for reducing defects in oxide layers on silicon carbide
JP3085272B2 (ja) * 1997-12-19 2000-09-04 富士電機株式会社 炭化けい素半導体装置の熱酸化膜形成方法

Also Published As

Publication number Publication date
EP1430518B1 (de) 2010-02-10
CN1531744A (zh) 2004-09-22
US6559068B2 (en) 2003-05-06
KR20040014978A (ko) 2004-02-18
EP1430518A2 (de) 2004-06-23
WO2003003435A2 (en) 2003-01-09
CN1302521C (zh) 2007-02-28
US20030008442A1 (en) 2003-01-09
ATE457524T1 (de) 2010-02-15
JP2004533727A (ja) 2004-11-04
WO2003003435A3 (en) 2004-04-29

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