DE60234950D1 - Kapselung für elektronische teile, deckel dafür, material für den deckel und verfahren zur herstellung des deckelmaterials - Google Patents

Kapselung für elektronische teile, deckel dafür, material für den deckel und verfahren zur herstellung des deckelmaterials

Info

Publication number
DE60234950D1
DE60234950D1 DE60234950T DE60234950T DE60234950D1 DE 60234950 D1 DE60234950 D1 DE 60234950D1 DE 60234950 T DE60234950 T DE 60234950T DE 60234950 T DE60234950 T DE 60234950T DE 60234950 D1 DE60234950 D1 DE 60234950D1
Authority
DE
Germany
Prior art keywords
cover
securing
covers
manufacturing
electronic parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60234950T
Other languages
English (en)
Inventor
Kazuhiro Shiomi
Masaaki Ishio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Metals Neomaterial Ltd
Original Assignee
Neomax Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neomax Materials Co Ltd filed Critical Neomax Materials Co Ltd
Application granted granted Critical
Publication of DE60234950D1 publication Critical patent/DE60234950D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
DE60234950T 2001-11-12 2002-11-08 Kapselung für elektronische teile, deckel dafür, material für den deckel und verfahren zur herstellung des deckelmaterials Expired - Lifetime DE60234950D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001346365 2001-11-12
PCT/JP2002/011704 WO2003043082A1 (en) 2001-11-12 2002-11-08 Package for electronic parts, lid thereof, material for the lid and method for producing the lid material

Publications (1)

Publication Number Publication Date
DE60234950D1 true DE60234950D1 (de) 2010-02-11

Family

ID=19159560

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60234950T Expired - Lifetime DE60234950D1 (de) 2001-11-12 2002-11-08 Kapselung für elektronische teile, deckel dafür, material für den deckel und verfahren zur herstellung des deckelmaterials

Country Status (6)

Country Link
US (1) US6921970B2 (de)
EP (1) EP1445798B1 (de)
KR (1) KR100899919B1 (de)
CN (1) CN1292474C (de)
DE (1) DE60234950D1 (de)
WO (1) WO2003043082A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10335645B3 (de) * 2003-08-04 2005-01-20 Siemens Ag Verfahren zum Betrieb eines Detektors zum Erkennen von Überlappungen flacher Sendungen in einer Sortiermaschine
US6919623B2 (en) * 2003-12-12 2005-07-19 The Boeing Company Hydrogen diffusion hybrid port and method of forming
JP2005317895A (ja) * 2004-03-31 2005-11-10 Citizen Watch Co Ltd 電子部品封止体の製造方法および電子部品封止体
JP4986615B2 (ja) * 2004-05-21 2012-07-25 株式会社Ｎｅｏｍａｘマテリアル 太陽電池用電極線材
US7906845B1 (en) 2008-04-23 2011-03-15 Amkor Technology, Inc. Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor
US8339024B2 (en) * 2009-07-20 2012-12-25 Hitachi Zosen Corporation Methods and apparatuses for reducing heat on an emitter exit window
US8901579B2 (en) * 2011-08-03 2014-12-02 Ignis Innovation Inc. Organic light emitting diode and method of manufacturing
JP6119108B2 (ja) 2012-04-10 2017-04-26 セイコーエプソン株式会社 電子デバイス、電子機器、ベース基板の製造方法および電子デバイスの製造方法
JP5979994B2 (ja) * 2012-06-12 2016-08-31 新光電気工業株式会社 電子装置
JP6028810B2 (ja) * 2012-11-20 2016-11-24 トヨタ自動車株式会社 半導体装置
US9093453B2 (en) 2013-10-07 2015-07-28 International Business Machines Corporation High performance e-fuse fabricated with sub-lithographic dimension
FR3014241B1 (fr) * 2013-11-29 2017-05-05 Commissariat Energie Atomique Structure d'encapsulation comprenant des tranchees partiellement remplies de materiau getter
FR3019375B1 (fr) 2014-03-31 2016-05-06 Commissariat Energie Atomique Procede de realisation d'un boitier hermetique destine a l'encapsulation d'un dispositif implantable et boitier correspondant
US10912650B2 (en) * 2014-07-16 2021-02-09 Zimmer, Inc. Resistance welding a porous metal layer to a metal substrate utilizing an intermediate element
JP6421595B2 (ja) * 2014-12-26 2018-11-14 日立金属株式会社 気密封止用蓋材、気密封止用蓋材の製造方法および電子部品収納パッケージ
CN104553134B (zh) * 2014-12-31 2017-05-10 北京北冶功能材料有限公司 一种硬玻璃封装用三层复合材料及其制备方法
JP2016139758A (ja) * 2015-01-29 2016-08-04 株式会社日立金属ネオマテリアル 気密封止用蓋材および電子部品収容パッケージ
CN113909665B (zh) * 2021-10-22 2023-03-17 哈尔滨工业大学 一种钼铼合金有中间层扩散焊接可伐合金的方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1176451B (de) * 1958-09-10 1964-08-20 Siemens Ag Verfahren zur Herstellung eines Halbleiter-bauelementes
GB8303937D0 (en) * 1983-02-12 1983-03-16 British Aluminium Co Plc Bonding sheets
JPH0645070B2 (ja) * 1986-05-10 1994-06-15 住友特殊金属株式会社 クラツド板の製造方法
US4835067A (en) * 1988-01-21 1989-05-30 Electro Alloys Corp. Corrosion resistant electroplating process, and plated article
DE69013310T2 (de) * 1989-12-22 1995-04-27 Westinghouse Electric Corp Gehäuse für Leistungshalbleiterbauelemente.
JPH03283549A (ja) 1990-03-30 1991-12-13 Ngk Insulators Ltd 集積回路用パッケージ
JP2000003973A (ja) 1998-06-16 2000-01-07 Toyo Commun Equip Co Ltd 電子部品用パッケージ
JP3078544B2 (ja) * 1998-09-24 2000-08-21 住友特殊金属株式会社 電子部品用パッケージ、その蓋体用の蓋材およびその蓋材の製造方法
JP2000150687A (ja) * 1998-11-18 2000-05-30 Matsushita Electric Ind Co Ltd 電子部品とその製造方法
JP2000150689A (ja) * 1998-11-18 2000-05-30 Matsushita Electric Ind Co Ltd 電子部品
JP4115024B2 (ja) * 1999-01-26 2008-07-09 古河電気工業株式会社 導電性と熱伝導性を備えたシート
US6203931B1 (en) * 1999-02-05 2001-03-20 Industrial Technology Research Institute Lead frame material and process for manufacturing the same
JP2003158211A (ja) * 2001-11-19 2003-05-30 Daishinku Corp 電子部品用パッケージおよび当該パッケージを用いた圧電振動デバイス
US20060051609A1 (en) * 2004-09-07 2006-03-09 Banker John G Method and structure for arresting/preventing fires in titanium clad compositions

Also Published As

Publication number Publication date
EP1445798B1 (de) 2009-12-30
WO2003043082A1 (en) 2003-05-22
EP1445798A4 (de) 2007-08-08
CN1292474C (zh) 2006-12-27
US20040207071A1 (en) 2004-10-21
CN1561542A (zh) 2005-01-05
EP1445798A1 (de) 2004-08-11
US6921970B2 (en) 2005-07-26
KR100899919B1 (ko) 2009-05-28
KR20040063898A (ko) 2004-07-14

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