DE60228148D1 - Lithographisches Gerät, Lithographisches Verfahren sowie Methode zur Herstellung einer Vorlage für einen Transfer - Google Patents

Lithographisches Gerät, Lithographisches Verfahren sowie Methode zur Herstellung einer Vorlage für einen Transfer

Info

Publication number
DE60228148D1
DE60228148D1 DE60228148T DE60228148T DE60228148D1 DE 60228148 D1 DE60228148 D1 DE 60228148D1 DE 60228148 T DE60228148 T DE 60228148T DE 60228148 T DE60228148 T DE 60228148T DE 60228148 D1 DE60228148 D1 DE 60228148D1
Authority
DE
Germany
Prior art keywords
lithographic
template
transfer
making
lithographic apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60228148T
Other languages
English (en)
Inventor
Akihiro Miyauchi
Chahn Lee
Mitsuru Hasegawa
Mitsuo Hayashibara
Hiroshi Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE60228148D1 publication Critical patent/DE60228148D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE60228148T 2001-01-31 2002-01-03 Lithographisches Gerät, Lithographisches Verfahren sowie Methode zur Herstellung einer Vorlage für einen Transfer Expired - Lifetime DE60228148D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001022679A JP2002224604A (ja) 2001-01-31 2001-01-31 パターン転写装置，パターン転写方法および転写用原版の製造方法

Publications (1)

Publication Number Publication Date
DE60228148D1 true DE60228148D1 (de) 2008-09-25

Family

ID=18888058

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60228148T Expired - Lifetime DE60228148D1 (de) 2001-01-31 2002-01-03 Lithographisches Gerät, Lithographisches Verfahren sowie Methode zur Herstellung einer Vorlage für einen Transfer

Country Status (6)

Country Link
US (1) US6635403B2 (de)
EP (1) EP1229387B1 (de)
JP (1) JP2002224604A (de)
KR (1) KR100761611B1 (de)
DE (1) DE60228148D1 (de)
TW (1) TW564189B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2406543B (en) * 2003-10-04 2006-06-07 Agilent Technologies Inc A method for fabricating masters for imprint lithography and related imprint process
JP4932150B2 (ja) * 2003-10-21 2012-05-16 株式会社半導体エネルギー研究所 半導体素子の作製方法
US20060213957A1 (en) * 2005-03-26 2006-09-28 Addington Cary G Conductive trace formation via wicking action
EP1884830A1 (de) * 2006-08-04 2008-02-06 Sony Deutschland GmbH Verfahren zum Aufbringen eines Materials auf ein Substrat
JP5583526B2 (ja) * 2009-09-17 2014-09-03 日本発條株式会社 液剤塗布装置
US8703406B2 (en) 2012-07-12 2014-04-22 Transfer Devices Inc. Method of forming large-area masters for replication of transfer lithography templates

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2543013A (en) * 1947-04-30 1951-02-27 Eastman Kodak Co Printing plate and method of printing
JPS56157091A (en) 1980-05-08 1981-12-04 Fujitsu Ltd Method of manufacturing printed circuit board
US4908112A (en) * 1988-06-16 1990-03-13 E. I. Du Pont De Nemours & Co. Silicon semiconductor wafer for analyzing micronic biological samples
DE4107762B4 (de) * 1990-03-09 2006-07-13 Dai Nippon Printing Co., Ltd. Verfahren zum Herstellen von Master- und Arbeitsmusterplatten für den Ätzprozess
US5882828A (en) * 1996-03-15 1999-03-16 Fuji Photo Film Co., Ltd. Method for preparation of printing plate by electrophotographic process using liquid developer
EP0843886A1 (de) * 1996-06-11 1998-05-27 Koninklijke Philips Electronics N.V. Farbelementenbildung auf substraten durch siebdruck oder schablonendruck
US6039897A (en) * 1996-08-28 2000-03-21 University Of Washington Multiple patterned structures on a single substrate fabricated by elastomeric micro-molding techniques
US20010036602A1 (en) * 1997-07-24 2001-11-01 Mcgrew Stephen P. Analog relief microstructure fabrication
EP0896251A1 (de) * 1997-07-28 1999-02-10 Agfa-Gevaert N.V. Verfahren zur Herstellung einer Litho-Druckplatte
US6089853A (en) * 1997-12-24 2000-07-18 International Business Machines Corporation Patterning device for patterning a substrate with patterning cavities fed by service cavities
AU2958299A (en) * 1998-03-26 1999-10-18 Nikon Corporation Exposure method and system, photomask, method of manufacturing photomask, micro-device and method of manufacturing micro-device
DE19815130A1 (de) * 1998-04-03 1999-10-14 Bosch Gmbh Robert Herstellung eines metallischen Stempels zur Definition von Nanostrukturen
AU3639999A (en) * 1998-04-13 1999-11-01 Trustees Of Princeton University, The Modification of polymer optoelectronic properties after film formation impurity addition or removal
JP3780700B2 (ja) * 1998-05-26 2006-05-31 セイコーエプソン株式会社 パターン形成方法、パターン形成装置、パターン形成用版、パターン形成用版の製造方法、カラーフィルタの製造方法、導電膜の製造方法及び液晶パネルの製造方法
JPH11347478A (ja) 1998-06-05 1999-12-21 Hitachi Chem Co Ltd パターン膜の製造法及び電子部品
JP3929635B2 (ja) * 1999-03-08 2007-06-13 株式会社東芝 露光方法

Also Published As

Publication number Publication date
US20020101460A1 (en) 2002-08-01
TW564189B (en) 2003-12-01
KR20020064178A (ko) 2002-08-07
EP1229387A3 (de) 2004-03-17
JP2002224604A (ja) 2002-08-13
EP1229387A2 (de) 2002-08-07
US6635403B2 (en) 2003-10-21
KR100761611B1 (ko) 2007-09-27
EP1229387B1 (de) 2008-08-13

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Legal Events

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