DE60209610D1 - Verfahren zur Herstellung eines InGaAsN Halbleiters mit hoher Qualität - Google Patents
Verfahren zur Herstellung eines InGaAsN Halbleiters mit hoher QualitätInfo
- Publication number
- DE60209610D1 DE60209610D1 DE60209610T DE60209610T DE60209610D1 DE 60209610 D1 DE60209610 D1 DE 60209610D1 DE 60209610 T DE60209610 T DE 60209610T DE 60209610 T DE60209610 T DE 60209610T DE 60209610 D1 DE60209610 D1 DE 60209610D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- high quality
- semiconductor
- quality ingaasn
- ingaasn semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/301—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02463—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02505—Layer structure consisting of more than two layers
- H01L21/02507—Alternating layers, e.g. superlattice
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US106472 | 2002-03-25 | ||
US10/106,472 US6764926B2 (en) | 2002-03-25 | 2002-03-25 | Method for obtaining high quality InGaAsN semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60209610D1 true DE60209610D1 (de) | 2006-05-04 |
DE60209610T2 DE60209610T2 (de) | 2007-01-11 |
Family
ID=27804347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60209610T Expired - Fee Related DE60209610T2 (de) | 2002-03-25 | 2002-10-17 | Verfahren zur Herstellung eines InGaAsN Halbleiters mit hoher Qualität |
Country Status (4)
Country | Link |
---|---|
US (1) | US6764926B2 (de) |
EP (1) | EP1348778B1 (de) |
JP (1) | JP2003332251A (de) |
DE (1) | DE60209610T2 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4038046B2 (ja) * | 2001-12-18 | 2008-01-23 | シャープ株式会社 | 半導体レーザ装置の製造方法 |
US6756325B2 (en) * | 2002-05-07 | 2004-06-29 | Agilent Technologies, Inc. | Method for producing a long wavelength indium gallium arsenide nitride(InGaAsN) active region |
JP2005064364A (ja) * | 2003-08-19 | 2005-03-10 | Sony Corp | 長波長半導体発光素子およびその製造方法 |
US7372886B2 (en) | 2004-06-07 | 2008-05-13 | Avago Technologies Fiber Ip Pte Ltd | High thermal conductivity vertical cavity surface emitting laser (VCSEL) |
US20090014061A1 (en) * | 2007-07-10 | 2009-01-15 | The Board Of Trustees Of The Leland Stanford Junior University | GaInNAsSb solar cells grown by molecular beam epitaxy |
JP2009184836A (ja) * | 2008-02-01 | 2009-08-20 | Sumitomo Electric Ind Ltd | Iii−v族化合物半導体の結晶成長方法、発光デバイスの製造方法および電子デバイスの製造方法 |
US20100319764A1 (en) * | 2009-06-23 | 2010-12-23 | Solar Junction Corp. | Functional Integration Of Dilute Nitrides Into High Efficiency III-V Solar Cells |
US20110114163A1 (en) * | 2009-11-18 | 2011-05-19 | Solar Junction Corporation | Multijunction solar cells formed on n-doped substrates |
US20110232730A1 (en) * | 2010-03-29 | 2011-09-29 | Solar Junction Corp. | Lattice matchable alloy for solar cells |
US9214580B2 (en) | 2010-10-28 | 2015-12-15 | Solar Junction Corporation | Multi-junction solar cell with dilute nitride sub-cell having graded doping |
US8962991B2 (en) | 2011-02-25 | 2015-02-24 | Solar Junction Corporation | Pseudomorphic window layer for multijunction solar cells |
US8766087B2 (en) | 2011-05-10 | 2014-07-01 | Solar Junction Corporation | Window structure for solar cell |
CN103975449A (zh) * | 2011-09-02 | 2014-08-06 | 安伯韦弗公司 | 太阳能电池 |
WO2013074530A2 (en) | 2011-11-15 | 2013-05-23 | Solar Junction Corporation | High efficiency multijunction solar cells |
CN103999189B (zh) * | 2011-12-23 | 2018-04-13 | 索泰克公司 | 用于光敏器件的稀释氮化物半导体材料的制造方法及相关结构体 |
KR101892124B1 (ko) * | 2011-12-23 | 2018-08-27 | 소이텍 | 광활성 장치 및 관련 구조에 이용되는 희석 질화물 물질의 형성방법 |
US8879275B2 (en) * | 2012-02-21 | 2014-11-04 | International Business Machines Corporation | Anti-corrosion conformal coating comprising modified porous silica fillers for metal conductors electrically connecting an electronic component |
US9153724B2 (en) | 2012-04-09 | 2015-10-06 | Solar Junction Corporation | Reverse heterojunctions for solar cells |
US9240317B2 (en) | 2013-03-28 | 2016-01-19 | Umm Al-Qura University | High temperature GaN based super semiconductor and fabrication process |
ES2831831T3 (es) | 2014-02-05 | 2021-06-09 | Array Photonics Inc | Convertidor de energía monolítico con múltiples uniones |
RU2672776C2 (ru) * | 2014-02-25 | 2018-11-19 | Конинклейке Филипс Н.В. | Светоизлучающие полупроводниковые устройства с геттерным слоем |
US20170110613A1 (en) | 2015-10-19 | 2017-04-20 | Solar Junction Corporation | High efficiency multijunction photovoltaic cells |
WO2019010037A1 (en) | 2017-07-06 | 2019-01-10 | Solar Junction Corporation | HYBRID MOCVD / MBE EPITAXIAL GROWTH OF MULTI-JUNCTION SOLAR CELLS ADAPTED TO THE HIGH-PERFORMANCE NETWORK |
WO2019067553A1 (en) | 2017-09-27 | 2019-04-04 | Solar Junction Corporation | SHORT-LENGTH WAVELENGTH INFRARED OPTOELECTRONIC DEVICES HAVING DILUTED NITRIDE LAYER |
JP7043802B2 (ja) * | 2017-11-16 | 2022-03-30 | 住友電気工業株式会社 | 垂直共振型面発光レーザ、垂直共振型面発光レーザを作製する方法 |
JP7095498B2 (ja) * | 2018-08-31 | 2022-07-05 | 住友電気工業株式会社 | 垂直共振型面発光レーザ、垂直共振型面発光レーザを作製する方法 |
EP3939085A1 (de) | 2019-03-11 | 2022-01-19 | Array Photonics, Inc. | Optoelektronische vorrichtungen mit kurzer wellenlänge mit abgestuften oder gestuften aktiven regionen mit verdünntem nitrid |
WO2023048295A1 (ja) | 2021-09-27 | 2023-03-30 | 株式会社Jvcケンウッド | 感覚伝達システム、感覚伝達方法及び感覚伝達プログラム |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US50934A (en) * | 1865-11-14 | Improvement in devices for opening artesian wells | ||
JP3854693B2 (ja) * | 1996-09-30 | 2006-12-06 | キヤノン株式会社 | 半導体レーザの製造方法 |
US5903586A (en) | 1997-07-30 | 1999-05-11 | Motorola, Inc. | Long wavelength vertical cavity surface emitting laser |
US5978398A (en) | 1997-07-31 | 1999-11-02 | Motorola, Inc. | Long wavelength vertical cavity surface emitting laser |
US5944913A (en) | 1997-11-26 | 1999-08-31 | Sandia Corporation | High-efficiency solar cell and method for fabrication |
JP2003520440A (ja) | 2000-01-13 | 2003-07-02 | インフィネオン テクノロジーズ アクチエンゲゼルシャフト | 半導体レーザー構造 |
US6750480B2 (en) * | 2000-11-27 | 2004-06-15 | Kopin Corporation | Bipolar transistor with lattice matched base layer |
-
2002
- 2002-03-25 US US10/106,472 patent/US6764926B2/en not_active Expired - Fee Related
- 2002-10-17 DE DE60209610T patent/DE60209610T2/de not_active Expired - Fee Related
- 2002-10-17 EP EP02023298A patent/EP1348778B1/de not_active Expired - Fee Related
-
2003
- 2003-03-25 JP JP2003082488A patent/JP2003332251A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP1348778B1 (de) | 2006-03-08 |
DE60209610T2 (de) | 2007-01-11 |
US20030181024A1 (en) | 2003-09-25 |
US6764926B2 (en) | 2004-07-20 |
JP2003332251A (ja) | 2003-11-21 |
EP1348778A1 (de) | 2003-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: SCHOPPE, ZIMMERMANN, STOECKELER & ZINKLER, 82049 PU |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D. STAATES, US |
|
8339 | Ceased/non-payment of the annual fee |