DE602008002392D1 - Weißlichtemittierende Diode und Verpackungsverfahren dafür - Google Patents

Weißlichtemittierende Diode und Verpackungsverfahren dafür

Info

Publication number
DE602008002392D1
DE602008002392D1 DE602008002392T DE602008002392T DE602008002392D1 DE 602008002392 D1 DE602008002392 D1 DE 602008002392D1 DE 602008002392 T DE602008002392 T DE 602008002392T DE 602008002392 T DE602008002392 T DE 602008002392T DE 602008002392 D1 DE602008002392 D1 DE 602008002392D1
Authority
DE
Germany
Prior art keywords
siloxane
light emitting
emitting diode
white light
weight percentage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008002392T
Other languages
English (en)
Inventor
Xian-Wu Zhan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Andy Optoelectronic Co Ltd
Original Assignee
Ningbo Andy Optoelectronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Andy Optoelectronic Co Ltd filed Critical Ningbo Andy Optoelectronic Co Ltd
Publication of DE602008002392D1 publication Critical patent/DE602008002392D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Credit Cards Or The Like (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Packaging Of Special Articles (AREA)
DE602008002392T 2007-12-20 2008-12-19 Weißlichtemittierende Diode und Verpackungsverfahren dafür Active DE602008002392D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2007101726364A CN100490201C (zh) 2007-12-20 2007-12-20 白光发光二极管

Publications (1)

Publication Number Publication Date
DE602008002392D1 true DE602008002392D1 (de) 2010-10-14

Family

ID=39547658

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008002392T Active DE602008002392D1 (de) 2007-12-20 2008-12-19 Weißlichtemittierende Diode und Verpackungsverfahren dafür

Country Status (7)

Country Link
US (1) US7655487B2 (de)
EP (1) EP2073603B1 (de)
JP (1) JP5124722B2 (de)
KR (1) KR20090067026A (de)
CN (1) CN100490201C (de)
AT (1) ATE480128T1 (de)
DE (1) DE602008002392D1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101771175B1 (ko) 2011-06-10 2017-09-06 삼성전자주식회사 광전자 소자 및 적층 구조
US8822593B2 (en) * 2012-06-22 2014-09-02 Shin-Etsu Chemical Co., Ltd. Curable resin composition, hardened material thereof, and optical semiconductor apparatus
TW201418414A (zh) * 2012-11-12 2014-05-16 Genesis Photonics Inc 波長轉換物質、波長轉換膠體以及發光裝置
CN102945910B (zh) * 2012-11-20 2015-03-11 湖南美星光电科技有限公司 一种混合型桔黄色发光二极管的制备方法
GB2519169B (en) * 2013-10-14 2016-03-09 Sumitomo Chemical Co Light-emitting composition and device thereof
CN106398634A (zh) * 2016-12-15 2017-02-15 广州美谷电子科技有限公司 一种led灯珠用的融合剂

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4287105A (en) * 1980-01-14 1981-09-01 Plaskon Products, Inc. Flash resistant epoxy encapsulating composition and process for preparing same
US5082894A (en) * 1990-03-19 1992-01-21 Dow Corning Corporation Storage stable one-part organosiloxane compositions
GB9219208D0 (en) * 1992-09-10 1992-10-28 Dow Corning Gmbh Elastomer-forming composition
JP3065263B2 (ja) * 1996-12-27 2000-07-17 日亜化学工業株式会社 発光装置及びそれを用いたｌｅｄ表示器
JPH10264331A (ja) * 1997-03-26 1998-10-06 Oji Paper Co Ltd 剥離紙
JP2005537651A (ja) * 2002-08-30 2005-12-08 ゲルコアー リミテッド ライアビリティ カンパニー 効率が向上した被覆ｌｅｄ
JP4190258B2 (ja) * 2002-11-08 2008-12-03 星和電機株式会社 蛍光体の製造方法
JP2004217850A (ja) * 2003-01-17 2004-08-05 Dow Corning Toray Silicone Co Ltd オルガノポリシロキサン組成物および硬化性オルガノポリシロキサン組成物
TW200427111A (en) * 2003-03-12 2004-12-01 Shinetsu Chemical Co Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device
US6982045B2 (en) * 2003-05-17 2006-01-03 Phosphortech Corporation Light emitting device having silicate fluorescent phosphor
JP2005060549A (ja) * 2003-08-13 2005-03-10 Shin Etsu Polymer Co Ltd 定型接着剤
US7352011B2 (en) * 2004-11-15 2008-04-01 Philips Lumileds Lighting Company, Llc Wide emitting lens for LED useful for backlighting
CN100341943C (zh) * 2004-11-29 2007-10-10 李彦民 硅橡胶组合物及其制造方法
JP4828145B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
CN1913182A (zh) * 2005-08-12 2007-02-14 比亚迪股份有限公司 一种白光二极管
JP2007116116A (ja) * 2005-09-22 2007-05-10 Toshiba Lighting & Technology Corp 発光装置
JP4820618B2 (ja) * 2005-10-21 2011-11-24 花王株式会社 複合粒子及びその製造方法、並びに、それを用いた発光デバイス
JP2007194401A (ja) * 2006-01-19 2007-08-02 Showa Denko Kk 化合物半導体発光素子を用いたｌｅｄパッケージ
US7633220B2 (en) * 2006-03-22 2009-12-15 General Electric Company Optoelectronic devices with multilayered structures
CN100477306C (zh) * 2007-01-11 2009-04-08 宁波安迪光电科技有限公司 白光发光二极管

Also Published As

Publication number Publication date
EP2073603A1 (de) 2009-06-24
KR20090067026A (ko) 2009-06-24
JP5124722B2 (ja) 2013-01-23
CN101197413A (zh) 2008-06-11
CN100490201C (zh) 2009-05-20
ATE480128T1 (de) 2010-09-15
EP2073603B1 (de) 2010-09-01
US7655487B2 (en) 2010-02-02
JP2009152601A (ja) 2009-07-09
US20090159914A1 (en) 2009-06-25

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