DE602007005078D1 - Abdichtungsvorrichtung und Verfahren zur Herstellung einer Anzeige damit - Google Patents
Abdichtungsvorrichtung und Verfahren zur Herstellung einer Anzeige damitInfo
- Publication number
- DE602007005078D1 DE602007005078D1 DE602007005078T DE602007005078T DE602007005078D1 DE 602007005078 D1 DE602007005078 D1 DE 602007005078D1 DE 602007005078 T DE602007005078 T DE 602007005078T DE 602007005078 T DE602007005078 T DE 602007005078T DE 602007005078 D1 DE602007005078 D1 DE 602007005078D1
- Authority
- DE
- Germany
- Prior art keywords
- making
- sealing device
- display therewith
- therewith
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J17/00—Gas-filled discharge tubes with solid cathode
- H01J17/02—Details
- H01J17/18—Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/26—Sealing together parts of vessels
- H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2209/00—Apparatus and processes for manufacture of discharge tubes
- H01J2209/26—Sealing parts of the vessel to provide a vacuum enclosure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060110572A KR100846975B1 (ko) | 2006-11-09 | 2006-11-09 | 밀봉 장치 및 그를 이용한 표시 장치의 제조 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602007005078D1 true DE602007005078D1 (de) | 2010-04-15 |
Family
ID=39146887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602007005078T Active DE602007005078D1 (de) | 2006-11-09 | 2007-11-08 | Abdichtungsvorrichtung und Verfahren zur Herstellung einer Anzeige damit |
Country Status (7)
Country | Link |
---|---|
US (2) | US8371353B2 (de) |
EP (1) | EP1921651B1 (de) |
JP (1) | JP4659724B2 (de) |
KR (1) | KR100846975B1 (de) |
CN (1) | CN101179032B (de) |
DE (1) | DE602007005078D1 (de) |
TW (1) | TWI361017B (de) |
Families Citing this family (22)
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JP2009123421A (ja) * | 2007-11-13 | 2009-06-04 | Canon Inc | 気密容器の製造方法 |
US8448468B2 (en) * | 2008-06-11 | 2013-05-28 | Corning Incorporated | Mask and method for sealing a glass envelope |
KR20120048528A (ko) * | 2009-07-23 | 2012-05-15 | 아사히 가라스 가부시키가이샤 | 봉착 재료층이 부착된 유리 부재의 제조 방법 및 제조 장치, 그리고 전자 디바이스의 제조 방법 |
KR101084231B1 (ko) * | 2009-10-05 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 레이저 조사 시스템 및 레이저 조사 방법 |
KR101135538B1 (ko) * | 2009-11-16 | 2012-04-13 | 삼성모바일디스플레이주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
KR101084175B1 (ko) | 2009-11-23 | 2011-11-17 | 삼성모바일디스플레이주식회사 | 유기 발광 디스플레이 장치 및 그 제조 방법 |
KR101084179B1 (ko) * | 2009-12-28 | 2011-11-17 | 삼성모바일디스플레이주식회사 | 유기 발광 디스플레이 소자의 봉지 방법 |
JP2011210431A (ja) * | 2010-03-29 | 2011-10-20 | Canon Inc | 気密容器の製造方法 |
JP2011210430A (ja) * | 2010-03-29 | 2011-10-20 | Canon Inc | 気密容器の製造方法 |
JP5590935B2 (ja) * | 2010-03-29 | 2014-09-17 | キヤノン株式会社 | 気密容器の製造方法 |
KR101137394B1 (ko) * | 2010-07-05 | 2012-04-20 | 삼성모바일디스플레이주식회사 | 레이저 빔 조사 장치 및 상기 레이저 빔 조사 장치를 포함하는 기판 밀봉 장치 |
JP2012059401A (ja) | 2010-09-06 | 2012-03-22 | Canon Inc | 気密容器の製造方法 |
JP5627370B2 (ja) | 2010-09-27 | 2014-11-19 | キヤノン株式会社 | 減圧気密容器及び画像表示装置の製造方法 |
KR20120044020A (ko) * | 2010-10-27 | 2012-05-07 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
KR101693347B1 (ko) * | 2010-12-03 | 2017-01-06 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치 제조 방법 |
JP5737011B2 (ja) * | 2011-01-18 | 2015-06-17 | 日本電気硝子株式会社 | 発光デバイス、発光デバイス用セル及び発光デバイスの製造方法 |
KR101404370B1 (ko) * | 2012-02-03 | 2014-06-09 | 주식회사 엘지화학 | 접착 필름 |
TWI505525B (zh) * | 2013-01-18 | 2015-10-21 | Innolux Corp | 顯示裝置及其封裝方法 |
JP5705937B2 (ja) * | 2013-09-13 | 2015-04-22 | 信越エンジニアリング株式会社 | 貼合デバイスの製造装置及び製造方法 |
CN103552354B (zh) * | 2013-10-29 | 2016-08-17 | 深圳市联得自动化装备股份有限公司 | 贴合方法和设备 |
WO2016027547A1 (ja) * | 2014-08-19 | 2016-02-25 | 株式会社Joled | 表示装置および電子機器 |
KR20220000440A (ko) * | 2020-06-25 | 2022-01-04 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
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JP2773661B2 (ja) * | 1994-11-28 | 1998-07-09 | 日本電気株式会社 | ビームスキャン式レーザマーキング方法および装置ならびにこのためのマスク |
US5840147A (en) | 1995-06-07 | 1998-11-24 | Edison Welding Institute | Plastic joining method |
US5690775A (en) * | 1996-03-07 | 1997-11-25 | Westvaco Corporation | Apparatus for heat sealing paperboard substrates using a uniform energy distributed light energy beam |
JP3237544B2 (ja) | 1996-10-11 | 2001-12-10 | 富士通株式会社 | 平面表示パネルの製造方法及び平面表示パネル |
KR20010030852A (ko) | 1997-10-01 | 2001-04-16 | 브룩스 나이즐 | 비쥬얼 디스플레이 |
US6290589B1 (en) | 1998-12-09 | 2001-09-18 | Applied Materials, Inc. | Polishing pad with a partial adhesive coating |
DE59900005D1 (de) | 1999-01-28 | 2000-06-15 | Leister Process Technologies S | Laserfügeverfahren und Vorrichtung zum Verbinden von verschiedenen Werkstücken aus Kunststoff oder Kunststoff mit anderen Materialien |
KR100316781B1 (ko) | 2000-02-25 | 2001-12-20 | 김순택 | 레이저를 이용한 유리평판표시패널의 프릿 프레임 밀봉 방법 |
KR100370406B1 (ko) | 2000-12-22 | 2003-02-05 | 삼성에스디아이 주식회사 | 레이저를 이용한 평판표시장치의 진공 패키징 방법 |
TW493358B (en) | 2001-06-14 | 2002-07-01 | Ritdisplay Corp | Package method and apparatus of organic light-emitting diode display device |
US6569706B2 (en) | 2001-09-19 | 2003-05-27 | Osram Opto Semiconductors Gmbh | Fabrication of organic light emitting diode using selective printing of conducting polymer layers |
JP2003177506A (ja) * | 2001-12-13 | 2003-06-27 | Sony Corp | フォトリソグラフィ用マスク、薄膜形成方法、並びに液晶表示装置及び液晶表示装置の製造方法 |
ES2378067T3 (es) | 2002-05-08 | 2012-04-04 | Phoseon Technology, Inc. | Fuente de luz de estado sólido de alta eficacia y métodos de uso y fabricación |
KR100858802B1 (ko) * | 2002-07-31 | 2008-09-17 | 삼성에스디아이 주식회사 | 전자 발광 소자의 제조방법 |
KR100675625B1 (ko) | 2002-08-08 | 2007-02-01 | 엘지.필립스 엘시디 주식회사 | 유기전계발광소자 및 그 제조방법 |
US7255770B2 (en) | 2002-08-12 | 2007-08-14 | Mentor Corporation | Method for laser welding flexible polymers |
JP3829330B2 (ja) | 2002-11-29 | 2006-10-04 | 日本精機株式会社 | 紫外線カットマスク及び封止装置 |
JP4267378B2 (ja) * | 2003-06-11 | 2009-05-27 | トヨタ自動車株式会社 | 樹脂部材のレーザ溶着方法及びその装置およびレーザ溶着部材 |
TWI248773B (en) | 2004-04-09 | 2006-02-01 | Grace Semiconductor Mfg Corp | Structure and encapsulation method of organic electro-luminance light-emitting display device |
US7371143B2 (en) * | 2004-10-20 | 2008-05-13 | Corning Incorporated | Optimization of parameters for sealing organic emitting light diode (OLED) displays |
KR100640952B1 (ko) * | 2004-12-29 | 2006-11-02 | 동부일렉트로닉스 주식회사 | 반도체 소자의 금속배선 형성방법 |
FR2881591A1 (fr) | 2005-02-03 | 2006-08-04 | France Telecom | Mise en oeuvre d'une operation cryptographique a distance d'une pki |
DE202006008749U1 (de) | 2006-03-23 | 2006-08-03 | Hella Kgaa Hueck & Co. | Heizvorrichtung zum Verschweißen von Kunststoffteilen |
-
2006
- 2006-11-09 KR KR1020060110572A patent/KR100846975B1/ko active IP Right Grant
- 2006-12-01 JP JP2006325767A patent/JP4659724B2/ja active Active
-
2007
- 2007-03-16 US US11/724,854 patent/US8371353B2/en active Active
- 2007-09-13 TW TW096134238A patent/TWI361017B/zh active
- 2007-10-10 CN CN2007101809780A patent/CN101179032B/zh active Active
- 2007-11-08 EP EP07120244A patent/EP1921651B1/de active Active
- 2007-11-08 DE DE602007005078T patent/DE602007005078D1/de active Active
-
2013
- 2013-02-11 US US13/764,519 patent/US8512503B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20080110561A1 (en) | 2008-05-15 |
CN101179032A (zh) | 2008-05-14 |
TWI361017B (en) | 2012-03-21 |
JP2008123977A (ja) | 2008-05-29 |
CN101179032B (zh) | 2011-10-26 |
EP1921651A2 (de) | 2008-05-14 |
US8371353B2 (en) | 2013-02-12 |
JP4659724B2 (ja) | 2011-03-30 |
US20130153141A1 (en) | 2013-06-20 |
US8512503B2 (en) | 2013-08-20 |
KR100846975B1 (ko) | 2008-07-17 |
KR20080042321A (ko) | 2008-05-15 |
TW200822791A (en) | 2008-05-16 |
EP1921651B1 (de) | 2010-03-03 |
EP1921651A3 (de) | 2008-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |