DE602007003060D1 - Anodische Bindungsvorrichtung - Google Patents

Anodische Bindungsvorrichtung

Info

Publication number
DE602007003060D1
DE602007003060D1 DE602007003060T DE602007003060T DE602007003060D1 DE 602007003060 D1 DE602007003060 D1 DE 602007003060D1 DE 602007003060 T DE602007003060 T DE 602007003060T DE 602007003060 T DE602007003060 T DE 602007003060T DE 602007003060 D1 DE602007003060 D1 DE 602007003060D1
Authority
DE
Germany
Prior art keywords
bonding device
anodic bonding
anodic
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007003060T
Other languages
English (en)
Inventor
Takayoshi Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Publication of DE602007003060D1 publication Critical patent/DE602007003060D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Joining Of Glass To Other Materials (AREA)
DE602007003060T 2006-07-18 2007-07-18 Anodische Bindungsvorrichtung Active DE602007003060D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006195018A JP5281739B2 (ja) 2006-07-18 2006-07-18 陽極接合装置

Publications (1)

Publication Number Publication Date
DE602007003060D1 true DE602007003060D1 (de) 2009-12-17

Family

ID=38805771

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007003060T Active DE602007003060D1 (de) 2006-07-18 2007-07-18 Anodische Bindungsvorrichtung

Country Status (5)

Country Link
US (1) US20080210380A1 (de)
EP (1) EP1894903B1 (de)
JP (1) JP5281739B2 (de)
KR (1) KR20080008274A (de)
DE (1) DE602007003060D1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5062897B2 (ja) * 2008-06-06 2012-10-31 クライムプロダクツ株式会社 ワーク貼合装置
CN101439843B (zh) * 2008-10-10 2011-08-31 北京大学 一种微型原子气室封装工艺方法
WO2010055730A1 (ja) * 2008-11-14 2010-05-20 東京エレクトロン株式会社 貼り合わせ装置及び貼り合わせ方法
KR101017361B1 (ko) * 2010-02-08 2011-02-28 주식회사 엘트린 기판 접합 시스템 및 이에 사용되는 이동형 챔버
US20120145308A1 (en) * 2010-12-08 2012-06-14 Jiangwei Feng Methods for anodic bonding material layers to one another and resultant apparatus
JP2012169376A (ja) * 2011-02-10 2012-09-06 Seiko Instruments Inc 陽極接合装置、パッケージ製造方法、圧電振動子、発振器、電子機器および電波時計
JP2012175043A (ja) * 2011-02-24 2012-09-10 Tokyo Electron Ltd 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
KR102350216B1 (ko) * 2011-08-12 2022-01-11 에베 그룹 에. 탈너 게엠베하 기판의 접합을 위한 장치 및 방법
JP5891848B2 (ja) * 2012-02-27 2016-03-23 ウシオ電機株式会社 ガラス基板もしくは水晶基板からなるワークの貼り合わせ方法および装置
KR101334816B1 (ko) 2012-07-13 2013-11-29 에이피시스템 주식회사 기판 접합 장치 및 그 동작 방법
DE102012111246A1 (de) 2012-11-21 2014-05-22 Ev Group E. Thallner Gmbh Vorrichtung und Verfahren zum Bonden
JP5981358B2 (ja) 2013-01-23 2016-08-31 東京エレクトロン株式会社 伝熱シート貼付方法
JP5521066B1 (ja) * 2013-01-25 2014-06-11 東京エレクトロン株式会社 接合装置及び接合システム
CN103232024A (zh) * 2013-04-08 2013-08-07 苏州大学 一种用于长玻璃柱体阳极键合的自动化键合设备
CN103626122B (zh) * 2013-04-28 2016-05-11 苏州迪纳精密设备有限公司 一种阳极键合批量化生产设备
US9315375B2 (en) * 2013-12-27 2016-04-19 Innovative Micro Technology Method using glass substrate anodic bonding
CN103755161B (zh) 2013-12-31 2016-03-30 深圳市华星光电技术有限公司 贴合机用板材固定件的安装结构和顶板、贴合机
JP6727048B2 (ja) * 2016-07-12 2020-07-22 東京エレクトロン株式会社 基板搬送装置および接合システム
EP3501037B1 (de) * 2017-09-21 2020-01-29 EV Group E. Thallner GmbH Vorrichtung und verfahren zum verbinden von substraten
WO2023032166A1 (ja) * 2021-09-03 2023-03-09 ヤマハロボティクスホールディングス株式会社 部材間接合装置及び接合部材製造方法
CN114953643A (zh) * 2022-06-15 2022-08-30 Oppo广东移动通信有限公司 终端及其壳体组件以及壳体组件的键合方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2935116A (en) * 1958-03-24 1960-05-03 Gen Dynamics Corp Bonding apparatus
NL8003696A (nl) * 1980-06-26 1982-01-18 Philips Nv Werkwijze voor het vervaardigen van een elektrische ontladingsinrichting, welke een van een elektroden- patroon voorzien glazen substraat bevat en aldus ver- kregen elektrische ontladingsinrichting.
JP2642154B2 (ja) * 1988-08-02 1997-08-20 株式会社豊田中央研究所 静電接合治具
JPH05326352A (ja) * 1992-05-15 1993-12-10 Japan Aviation Electron Ind Ltd 陽極接合装置
JP2674572B2 (ja) * 1995-05-31 1997-11-12 日本電気株式会社 陽極接合装置
JP3824681B2 (ja) * 1995-06-21 2006-09-20 株式会社日立製作所 陽極接合装置
SE523600C2 (sv) * 2001-07-09 2004-05-04 Imego Ab Metod för anodisk bodning
JP2005016965A (ja) * 2003-06-23 2005-01-20 Sumitomo Precision Prod Co Ltd パッケージおよびその製造方法、ならびに振動ジャイロおよびその製造方法
JP3820409B2 (ja) * 2003-12-02 2006-09-13 有限会社ボンドテック 接合方法及びこの方法により作成されるデバイス並びに接合装置
JP4654458B2 (ja) * 2004-12-24 2011-03-23 リコープリンティングシステムズ株式会社 シリコン部材の陽極接合法及びこれを用いたインクジェットヘッド製造方法並びにインクジェットヘッド及びこれを用いたインクジェット記録装置
JP4777681B2 (ja) * 2005-04-08 2011-09-21 Ｏｋｉセミコンダクタ株式会社 陽極接合装置、陽極接合方法及び加速度センサの製造方法
US7470971B2 (en) * 2005-05-13 2008-12-30 Sarnoff Corporation Anodically bonded ultra-high-vacuum cell

Also Published As

Publication number Publication date
US20080210380A1 (en) 2008-09-04
EP1894903B1 (de) 2009-11-04
KR20080008274A (ko) 2008-01-23
EP1894903A1 (de) 2008-03-05
JP2008027930A (ja) 2008-02-07
JP5281739B2 (ja) 2013-09-04

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Legal Events

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