DE602007002733D1 - Positive Resistzusammensetzung und Verfahren zur Strukturformung damit - Google Patents

Positive Resistzusammensetzung und Verfahren zur Strukturformung damit

Info

Publication number
DE602007002733D1
DE602007002733D1 DE602007002733T DE602007002733T DE602007002733D1 DE 602007002733 D1 DE602007002733 D1 DE 602007002733D1 DE 602007002733 T DE602007002733 T DE 602007002733T DE 602007002733 T DE602007002733 T DE 602007002733T DE 602007002733 D1 DE602007002733 D1 DE 602007002733D1
Authority
DE
Germany
Prior art keywords
resist composition
positive resist
repeating unit
unit containing
structural molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007002733T
Other languages
English (en)
Inventor
Kaoru Iwato
Kunihiko Kodama
Yuko Yoshida
Kei Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of DE602007002733D1 publication Critical patent/DE602007002733D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE602007002733T 2006-03-17 2007-03-14 Positive Resistzusammensetzung und Verfahren zur Strukturformung damit Active DE602007002733D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006075067 2006-03-17
JP2006245681A JP4705897B2 (ja) 2006-03-17 2006-09-11 ポジ型レジスト組成物及び該ポジ型レジスト組成物を用いたパターン形成方法

Publications (1)

Publication Number Publication Date
DE602007002733D1 true DE602007002733D1 (de) 2009-11-26

Family

ID=37959017

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007002733T Active DE602007002733D1 (de) 2006-03-17 2007-03-14 Positive Resistzusammensetzung und Verfahren zur Strukturformung damit

Country Status (7)

Country Link
US (1) US7632623B2 (de)
EP (1) EP1835343B1 (de)
JP (1) JP4705897B2 (de)
KR (1) KR101169313B1 (de)
AT (1) ATE445862T1 (de)
DE (1) DE602007002733D1 (de)
TW (1) TWI396050B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1479881B1 (de) * 2002-02-05 2017-05-10 Ibiden Co., Ltd. Wabenfilter für abgasreinigung, klebstoff, beschichtungsmaterial und verfahren zur herstellung eines wabenfilters zur abgasreinigung
JP5333227B2 (ja) * 2007-09-27 2013-11-06 Ｊｓｒ株式会社 感放射線性組成物、及びフォトレジストパターンの形成方法
JP5331358B2 (ja) * 2008-03-28 2013-10-30 富士フイルム株式会社 ポジ型レジスト組成物の製造方法、ポジ型レジスト組成物、およびパターン形成方法
JP5806800B2 (ja) * 2008-03-28 2015-11-10 富士フイルム株式会社 ポジ型レジスト組成物およびそれを用いたパターン形成方法
KR100959841B1 (ko) * 2008-04-14 2010-05-27 금호석유화학 주식회사 화학증폭형 포토레지스트용 공중합체 및 이를 포함하는포토레지스트 조성물
JP5997873B2 (ja) * 2008-06-30 2016-09-28 富士フイルム株式会社 感光性組成物及びそれを用いたパターン形成方法
JP6832104B2 (ja) * 2016-09-20 2021-02-24 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法
JP2022088041A (ja) * 2020-12-02 2022-06-14 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3676918B2 (ja) 1997-10-09 2005-07-27 富士通株式会社 レジスト材料及びレジストパターンの形成方法
JP2001194786A (ja) * 1999-07-12 2001-07-19 Fuji Photo Film Co Ltd 遠紫外線露光用ポジ型フォトレジスト組成物
US6635401B2 (en) 2001-06-21 2003-10-21 International Business Machines Corporation Resist compositions with polymers having 2-cyano acrylic monomer
US7232638B2 (en) 2002-05-02 2007-06-19 Shin-Etsu Chemical Co., Ltd. Resist composition and patterning process
JP4225806B2 (ja) 2003-03-04 2009-02-18 富士フイルム株式会社 ポジ型レジスト組成物
JP4502308B2 (ja) * 2003-05-06 2010-07-14 三菱レイヨン株式会社 共重合体
JP4114067B2 (ja) 2003-06-19 2008-07-09 信越化学工業株式会社 高分子化合物、レジスト材料及びパターン形成方法
JP4315761B2 (ja) * 2003-07-31 2009-08-19 三菱レイヨン株式会社 （共）重合体、製造方法、レジスト組成物およびパターン形成方法
JP2005087665A (ja) 2003-09-12 2005-04-07 Masaki Tada スライド式ステップ台車椅子
TWI402276B (zh) * 2004-03-08 2013-07-21 Mitsubishi Rayon Co 光阻用聚合物、光阻組成物及圖案製造方法與光阻用聚合物用原料化合物
US7906268B2 (en) 2004-03-18 2011-03-15 Fujifilm Corporation Positive resist composition for immersion exposure and pattern-forming method using the same
TWI375121B (en) * 2004-06-28 2012-10-21 Fujifilm Corp Photosensitive composition and method for forming pattern using the same
TWI368825B (en) 2004-07-07 2012-07-21 Fujifilm Corp Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same
TWI403843B (zh) 2005-09-13 2013-08-01 Fujifilm Corp 正型光阻組成物及使用它之圖案形成方法
KR20130133095A (ko) * 2005-09-28 2013-12-05 가부시끼가이샤 다이셀 시아노기 및 락톤 골격을 포함하는 다환식 에스테르
JP4866605B2 (ja) * 2005-12-28 2012-02-01 富士フイルム株式会社 感光性組成物、該感光性組成物を用いたパターン形成方法及び該感光性組成物に用いられる化合物

Also Published As

Publication number Publication date
US7632623B2 (en) 2009-12-15
TWI396050B (zh) 2013-05-11
EP1835343A1 (de) 2007-09-19
EP1835343B1 (de) 2009-10-14
KR20070094547A (ko) 2007-09-20
US20070218405A1 (en) 2007-09-20
JP2007279662A (ja) 2007-10-25
TW200801812A (en) 2008-01-01
KR101169313B1 (ko) 2012-07-30
JP4705897B2 (ja) 2011-06-22
ATE445862T1 (de) 2009-10-15

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