DE602006020670D1 - Lithografischer Apparat mit Sensorhalterung - Google Patents

Lithografischer Apparat mit Sensorhalterung

Info

Publication number
DE602006020670D1
DE602006020670D1 DE602006020670T DE602006020670T DE602006020670D1 DE 602006020670 D1 DE602006020670 D1 DE 602006020670D1 DE 602006020670 T DE602006020670 T DE 602006020670T DE 602006020670 T DE602006020670 T DE 602006020670T DE 602006020670 D1 DE602006020670 D1 DE 602006020670D1
Authority
DE
Germany
Prior art keywords
lithographic apparatus
sensor holder
holder
sensor
lithographic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006020670T
Other languages
English (en)
Inventor
Sebastiaan Maria Johannes Cornelissen
Martinus Agnes Willem Cuijpers
Cornelis Christiaan Ottens
Peter Smits
De Wal Johannes Antonius Maria Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of DE602006020670D1 publication Critical patent/DE602006020670D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE602006020670T 2005-10-11 2006-09-28 Lithografischer Apparat mit Sensorhalterung Active DE602006020670D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/246,554 US7755742B2 (en) 2005-10-11 2005-10-11 Lithographic apparatus with mounted sensor

Publications (1)

Publication Number Publication Date
DE602006020670D1 true DE602006020670D1 (de) 2011-04-28

Family

ID=37594373

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006020670T Active DE602006020670D1 (de) 2005-10-11 2006-09-28 Lithografischer Apparat mit Sensorhalterung

Country Status (8)

Country Link
US (1) US7755742B2 (de)
EP (1) EP1775636B1 (de)
JP (1) JP4541338B2 (de)
KR (2) KR100837290B1 (de)
CN (2) CN1949081B (de)
DE (1) DE602006020670D1 (de)
SG (1) SG131866A1 (de)
TW (1) TWI346256B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7804579B2 (en) * 2007-06-21 2010-09-28 Asml Netherlands B.V. Control system, lithographic projection apparatus, method of controlling a support structure, and a computer program product
EP2264528A1 (de) * 2009-06-19 2010-12-22 ASML Netherlands B.V. Sensor und Lithografievorrichtung
NL2005586A (en) 2009-12-02 2011-06-06 Asml Netherlands Bv Lithographic apparatus and sealing device for a lithographic apparatus.
CN101976021B (zh) * 2010-10-12 2012-11-14 上海微电子装备有限公司 对准系统参考板和探测光纤的安装、调整装置及装调方法
NL2007451A (en) * 2010-10-27 2012-05-01 Asml Netherlands Bv Leaf spring, stage system, and lithographic apparatus.
DE102011005885A1 (de) * 2011-03-22 2012-09-27 Carl Zeiss Smt Gmbh Lithographievorrichtung
JP5922788B2 (ja) * 2011-11-09 2016-05-24 ザイゴ コーポレーションＺｙｇｏ Ｃｏｒｐｏｒａｔｉｏｎ 熱的に安定な光学センサマウント
US9491863B2 (en) 2014-06-26 2016-11-08 Align Technology, Inc. Mounting system that maintains stability of optics as temperature changes
CN109791380B (zh) 2016-10-04 2021-04-16 Asml荷兰有限公司 对准系统的无热化
CN110686717B (zh) * 2019-11-22 2021-07-20 徐州双裕电子技术有限公司 一种稳固安装的传感器组件

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4855792A (en) * 1988-05-13 1989-08-08 Mrs Technology, Inc. Optical alignment system for use in photolithography and having reduced reflectance errors
JP3024289B2 (ja) * 1991-07-12 2000-03-21 キヤノン株式会社 反射ミラー支持装置及びそれを用いた位置決め装置
EP0915499B1 (de) * 1997-11-05 2011-03-23 Tokyo Electron Limited Halbleiterscheibenhaltevorrichtung
EP1250630B1 (de) 2000-10-05 2008-12-03 ASML Holding N.V. Photolithographisches System mit montier- und abnehmbarem Sensor
KR100471018B1 (ko) * 2000-11-28 2005-03-08 스미도모쥬기가이고교 가부시키가이샤 두 개의 대상물 간의 갭 조절장치 및 조절방법
US7015491B2 (en) * 2001-06-01 2006-03-21 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby, control system
US6747282B2 (en) * 2001-06-13 2004-06-08 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
JP2003241049A (ja) * 2002-02-22 2003-08-27 Nikon Corp 光学素子保持方法、光学素子研磨加工方法及び光学素子成膜方法
SG121822A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1486828B1 (de) 2003-06-09 2013-10-09 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
TWI245170B (en) 2003-07-22 2005-12-11 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
JP4649136B2 (ja) 2003-07-31 2011-03-09 キヤノン株式会社 アクチュエータ、露光装置及びデバイス製造方法
US7119884B2 (en) * 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JPWO2005074015A1 (ja) * 2004-01-29 2007-09-13 株式会社ニコン 板部材の支持方法、板部材支持装置、ステージ装置、露光装置、及びデバイスの製造方法
US7583357B2 (en) * 2004-11-12 2009-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
CN1949081A (zh) 2007-04-18
EP1775636A1 (de) 2007-04-18
SG131866A1 (en) 2007-05-28
CN101762990A (zh) 2010-06-30
JP4541338B2 (ja) 2010-09-08
CN1949081B (zh) 2010-12-01
JP2007129212A (ja) 2007-05-24
US20070081141A1 (en) 2007-04-12
TW200720852A (en) 2007-06-01
KR100837290B1 (ko) 2008-06-11
KR20080039852A (ko) 2008-05-07
KR101127522B1 (ko) 2012-03-23
CN101762990B (zh) 2012-10-10
EP1775636B1 (de) 2011-03-16
KR20070040321A (ko) 2007-04-16
US7755742B2 (en) 2010-07-13
TWI346256B (en) 2011-08-01

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