DE602006013303D1 - Erzeugen einer lokalen und globalen verdrahtung für ein halbleiterprodukt - Google Patents

Erzeugen einer lokalen und globalen verdrahtung für ein halbleiterprodukt

Info

Publication number
DE602006013303D1
DE602006013303D1 DE602006013303T DE602006013303T DE602006013303D1 DE 602006013303 D1 DE602006013303 D1 DE 602006013303D1 DE 602006013303 T DE602006013303 T DE 602006013303T DE 602006013303 T DE602006013303 T DE 602006013303T DE 602006013303 D1 DE602006013303 D1 DE 602006013303D1
Authority
DE
Germany
Prior art keywords
dielectric layer
circuit
semiconductor product
beol
damascene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006013303T
Other languages
English (en)
Inventor
Stephen E Greco
Theodorus E Standaert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE602006013303D1 publication Critical patent/DE602006013303D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76816—Aspects relating to the layout of the pattern or to the size of vias or trenches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5283—Cross-sectional geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
DE602006013303T 2005-05-19 2006-05-19 Erzeugen einer lokalen und globalen verdrahtung für ein halbleiterprodukt Active DE602006013303D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/908,623 US7071099B1 (en) 2005-05-19 2005-05-19 Forming of local and global wiring for semiconductor product
PCT/US2006/019371 WO2006125135A1 (en) 2005-05-19 2006-05-19 Forming of local and global wiring for semiconductor product

Publications (1)

Publication Number Publication Date
DE602006013303D1 true DE602006013303D1 (de) 2010-05-12

Family

ID=36613699

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006013303T Active DE602006013303D1 (de) 2005-05-19 2006-05-19 Erzeugen einer lokalen und globalen verdrahtung für ein halbleiterprodukt

Country Status (8)

Country Link
US (1) US7071099B1 (de)
EP (1) EP1883957B1 (de)
JP (1) JP2008541462A (de)
CN (1) CN100547747C (de)
AT (1) ATE463046T1 (de)
DE (1) DE602006013303D1 (de)
TW (1) TW200723446A (de)
WO (1) WO2006125135A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7790350B2 (en) * 2007-07-30 2010-09-07 International Business Machines Corporation Method and materials for patterning a neutral surface
US8026170B2 (en) * 2007-09-26 2011-09-27 Sandisk Technologies Inc. Method of forming a single-layer metal conductors with multiple thicknesses
JP5703105B2 (ja) * 2011-04-15 2015-04-15 株式会社東芝 半導体装置及びその製造方法
US20150303145A1 (en) * 2014-04-17 2015-10-22 Qualcomm Incorporated Back end of line (beol) local optimization to improve product performance
US9379057B2 (en) * 2014-09-02 2016-06-28 International Business Machines Corporation Method and structure to reduce the electric field in semiconductor wiring interconnects
US9659856B2 (en) * 2014-10-24 2017-05-23 Taiwan Semiconductor Manufacturing Company, Ltd. Two step metallization formation
CN107731739B (zh) * 2016-08-12 2020-03-10 中芯国际集成电路制造(上海)有限公司 半导体结构的形成方法
CN108959771B (zh) * 2018-07-03 2020-05-12 北京华大九天软件有限公司 一种使用两种金属的等电阻布线方法
US10777456B1 (en) 2019-03-18 2020-09-15 Tokyo Electron Limited Semiconductor back end of line (BEOL) interconnect using multiple materials in a fully self-aligned via (FSAV) process
KR20210018669A (ko) 2019-08-08 2021-02-18 삼성전자주식회사 비아 및 배선을 포함하는 반도체 소자

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5380546A (en) * 1993-06-09 1995-01-10 Microelectronics And Computer Technology Corporation Multilevel metallization process for electronic components
JP3515363B2 (ja) * 1998-03-24 2004-04-05 株式会社東芝 半導体装置の製造方法
US6306769B1 (en) 2000-01-31 2001-10-23 Advanced Micro Devices Use of dual patterning masks for printing holes of small dimensions
US6352917B1 (en) 2000-06-21 2002-03-05 Chartered Semiconductor Manufacturing Ltd. Reversed damascene process for multiple level metal interconnects
TW472352B (en) * 2001-01-17 2002-01-11 United Microelectronics Corp Metal dual damascene opening process
US20020098673A1 (en) * 2001-01-19 2002-07-25 Ming-Shi Yeh Method for fabricating metal interconnects
US6984892B2 (en) 2001-03-28 2006-01-10 Lam Research Corporation Semiconductor structure implementing low-K dielectric materials and supporting stubs
US20030008493A1 (en) * 2001-07-03 2003-01-09 Shyh-Dar Lee Interconnect structure manufacturing
US6555467B2 (en) * 2001-09-28 2003-04-29 Sharp Laboratories Of America, Inc. Method of making air gaps copper interconnect
US6888251B2 (en) * 2002-07-01 2005-05-03 International Business Machines Corporation Metal spacer in single and dual damascene processing
US20040025643A1 (en) * 2002-08-07 2004-02-12 Chih-Ching Hsien Ratchet wheel mounting structure for wrench
DE10257682A1 (de) * 2002-12-10 2004-07-08 Infineon Technologies Ag Halbleiterschaltungsanordnung
US6674168B1 (en) 2003-01-21 2004-01-06 International Business Machines Corporation Single and multilevel rework
US6784091B1 (en) 2003-06-05 2004-08-31 International Business Machines Corporation Maskless array protection process flow for forming interconnect vias in magnetic random access memory devices
TWI229411B (en) * 2004-04-20 2005-03-11 Powerchip Semiconductor Corp Method of manufacturing a semiconductor device

Also Published As

Publication number Publication date
EP1883957A4 (de) 2008-09-17
TW200723446A (en) 2007-06-16
EP1883957A1 (de) 2008-02-06
CN101176196A (zh) 2008-05-07
CN100547747C (zh) 2009-10-07
US7071099B1 (en) 2006-07-04
ATE463046T1 (de) 2010-04-15
JP2008541462A (ja) 2008-11-20
WO2006125135A1 (en) 2006-11-23
EP1883957B1 (de) 2010-03-31

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Legal Events

Date Code Title Description
8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition