DE602006011228D1 - Farbbasierte Inspektion von gedruckten Leiterplatten - Google Patents

Farbbasierte Inspektion von gedruckten Leiterplatten

Info

Publication number
DE602006011228D1
DE602006011228D1 DE602006011228T DE602006011228T DE602006011228D1 DE 602006011228 D1 DE602006011228 D1 DE 602006011228D1 DE 602006011228 T DE602006011228 T DE 602006011228T DE 602006011228 T DE602006011228 T DE 602006011228T DE 602006011228 D1 DE602006011228 D1 DE 602006011228D1
Authority
DE
Germany
Prior art keywords
component
new component
color
printed circuit
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006011228T
Other languages
English (en)
Inventor
Akira Nakajima
Atsushi Shimizu
Toshihiro Moriya
Hirotaka Wada
Takatoshi Katahata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Publication of DE602006011228D1 publication Critical patent/DE602006011228D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder
DE602006011228T 2005-03-17 2006-03-17 Farbbasierte Inspektion von gedruckten Leiterplatten Active DE602006011228D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005077285 2005-03-17
JP2006044312A JP4935109B2 (ja) 2005-03-17 2006-02-21 基板検査装置並びにその検査ロジック設定方法および検査ロジック設定装置

Publications (1)

Publication Number Publication Date
DE602006011228D1 true DE602006011228D1 (de) 2010-02-04

Family

ID=36608532

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006011228T Active DE602006011228D1 (de) 2005-03-17 2006-03-17 Farbbasierte Inspektion von gedruckten Leiterplatten

Country Status (6)

Country Link
US (1) US7720274B2 (de)
EP (1) EP1703465B1 (de)
JP (1) JP4935109B2 (de)
AT (1) ATE453173T1 (de)
DE (1) DE602006011228D1 (de)
TW (1) TWI327292B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007010525A (ja) * 2005-06-30 2007-01-18 Dac Engineering Co Ltd 欠陥検出方法
JP4757083B2 (ja) * 2006-04-13 2011-08-24 日東電工株式会社 配線回路基板集合体シート
TWI353793B (en) * 2006-05-19 2011-12-01 Primax Electronics Ltd Pixel color conversion method and system applied t
TWI447382B (zh) * 2007-04-27 2014-08-01 Meinan Machinery Works Wood inspection methods and apparatus and program
JP4840327B2 (ja) * 2007-10-22 2011-12-21 株式会社デンソー 外観検査方法
JP5104291B2 (ja) * 2007-12-26 2012-12-19 富士通株式会社 画像解析プログラム、画像解析装置、および画像解析方法
JP5079678B2 (ja) * 2008-01-22 2012-11-21 明 北原 部品実装状態の外観検査装置及び検査方法
DE102010028894B4 (de) * 2009-05-13 2018-05-24 Koh Young Technology Inc. Verfahren zur Messung eines Messobjekts
KR101131350B1 (ko) 2009-10-20 2012-04-04 인하대학교 산학협력단 금속 패드의 상태 검사 방법
JP5469532B2 (ja) * 2010-05-21 2014-04-16 株式会社キーエンス 画像処理装置、画像処理方法及びコンピュータプログラム
KR101205970B1 (ko) * 2010-11-18 2012-11-28 주식회사 고영테크놀러지 브리지 연결불량 검출방법
JP5957378B2 (ja) * 2012-12-28 2016-07-27 株式会社日立ハイテクノロジーズ 欠陥観察方法および欠陥観察装置
JP6159211B2 (ja) * 2013-09-26 2017-07-05 株式会社Ｓｃｒｅｅｎホールディングス 目標画像生成支援装置、目標画像生成支援方法およびプログラム
TWI627588B (zh) 2015-04-23 2018-06-21 日商思可林集團股份有限公司 檢查裝置及基板處理裝置
JP6521735B2 (ja) * 2015-05-20 2019-05-29 Juki株式会社 検査装置、検査方法及び検査装置で用いられるプログラム
EP3582599B1 (de) * 2017-02-13 2022-03-30 Koh Young Technology Inc. Vorrichtung zur inspektion von auf einer leiterplatte montierten komponenten, betriebsverfahren dafür und computerlesbares aufzeichnungsmedium
JP6969439B2 (ja) * 2018-02-23 2021-11-24 オムロン株式会社 外観検査装置、及び外観検査装置の照明条件設定方法
DE102018109816B3 (de) 2018-04-24 2019-10-24 Yxlon International Gmbh Verfahren zur Gewinnung mindestens eines signifikanten Merkmals in einer Serie von Bauteilen gleichen Typs und Verfahren zur Klassifikation eines Bauteils eienr solchen Serie
JP6849150B2 (ja) * 2018-05-22 2021-03-24 東芝三菱電機産業システム株式会社 産業プラント監視制御システム
JP7153126B2 (ja) * 2019-03-14 2022-10-13 株式会社Fuji 良否判定装置および良否判定方法
JP7153127B2 (ja) * 2019-03-14 2022-10-13 株式会社Fuji 良否判定装置および良否判定方法
CN111024710B (zh) * 2019-12-17 2022-04-08 江苏恒宝智能系统技术有限公司 一种农作物异常检测系统及方法
CN113240618A (zh) * 2020-01-23 2021-08-10 株式会社理光 工件检测方法、装置及计算机可读存储介质
CN115283835B (zh) * 2022-07-05 2023-10-20 深圳明锐理想科技有限公司 一种pcb板的缺陷打标方法及设备
JP2024056561A (ja) * 2022-10-11 2024-04-23 株式会社日立製作所 検査条件決定システム

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0263473B1 (de) * 1986-10-03 1994-07-27 Omron Tateisi Electronics Co. Gerät zur Untersuchung einer elektronischen Vorrichtung in fester Baugruppe
JPH07107514B2 (ja) * 1988-09-14 1995-11-15 オムロン株式会社 基板検査装置における表示方法および表示装置
JP2570239B2 (ja) * 1991-07-30 1997-01-08 オムロン株式会社 実装部品検査用データ生成方法およびその方法の実施に用いられる実装部品検査装置
JP3173050B2 (ja) * 1991-07-30 2001-06-04 オムロン株式会社 教示データ作成方法およびその方法を用いた教示データ作成装置
JPH05218160A (ja) * 1992-01-31 1993-08-27 Sharp Corp 半導体チップの外観検査装置
JPH063120A (ja) * 1992-06-17 1994-01-11 Mitsubishi Electric Corp 半導体装置の外観検査方法
JP3289070B2 (ja) * 1993-03-02 2002-06-04 オムロン株式会社 実装部品検査装置
JP3092892B2 (ja) * 1993-12-27 2000-09-25 シャープ株式会社 半導体チップの外観検査方法および装置
JPH09145633A (ja) * 1995-11-24 1997-06-06 Omron Corp パラメータの設定支援方法、ならびにその方法を用いたパラメータ設定方法およびその装置、ならびにこのパラメータ設定装置を用いた実装部品検査装置
KR100200215B1 (ko) * 1996-04-08 1999-06-15 윤종용 상관 신경 회로망을 이용한 납땜 검사 장치 및방법
JP3869554B2 (ja) * 1998-04-28 2007-01-17 株式会社日立製作所 検査データ作成方法及び装置及びこれを用いた部品実装基板外観検査装置
JP3870872B2 (ja) 2002-08-06 2007-01-24 オムロン株式会社 検査データ作成方法およびこの方法を用いた基板検査装置
JP3906780B2 (ja) * 2002-11-01 2007-04-18 オムロン株式会社 部品コード変換テーブルに対するデータ登録方法、基板検査データの作成装置、登録処理用のプログラムおよびその記憶媒体
JP4492356B2 (ja) * 2005-01-11 2010-06-30 オムロン株式会社 基板検査装置並びにそのパラメータ設定方法およびパラメータ設定装置

Also Published As

Publication number Publication date
US7720274B2 (en) 2010-05-18
TW200643805A (en) 2006-12-16
US20060257015A1 (en) 2006-11-16
EP1703465A2 (de) 2006-09-20
JP2006292725A (ja) 2006-10-26
EP1703465A3 (de) 2007-08-08
JP4935109B2 (ja) 2012-05-23
EP1703465B1 (de) 2009-12-23
TWI327292B (en) 2010-07-11
ATE453173T1 (de) 2010-01-15

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