DE602006011168D1 - Leuchtstoff und leuchtvorrichtung - Google Patents

Leuchtstoff und leuchtvorrichtung

Info

Publication number
DE602006011168D1
DE602006011168D1 DE602006011168T DE602006011168T DE602006011168D1 DE 602006011168 D1 DE602006011168 D1 DE 602006011168D1 DE 602006011168 T DE602006011168 T DE 602006011168T DE 602006011168 T DE602006011168 T DE 602006011168T DE 602006011168 D1 DE602006011168 D1 DE 602006011168D1
Authority
DE
Germany
Prior art keywords
fluorescent
lighting device
lighting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006011168T
Other languages
English (en)
Inventor
Yoshinori Murazaki
Yoshiki Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of DE602006011168D1 publication Critical patent/DE602006011168D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77344—Aluminosilicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/77922—Silicates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
DE602006011168T 2005-08-04 2006-08-03 Leuchtstoff und leuchtvorrichtung Active DE602006011168D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005226089 2005-08-04
PCT/JP2006/315391 WO2007015542A1 (ja) 2005-08-04 2006-08-03 蛍光体及び発光装置

Publications (1)

Publication Number Publication Date
DE602006011168D1 true DE602006011168D1 (de) 2010-01-28

Family

ID=37708822

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006011168T Active DE602006011168D1 (de) 2005-08-04 2006-08-03 Leuchtstoff und leuchtvorrichtung

Country Status (5)

Country Link
US (1) US7927512B2 (de)
EP (1) EP1911826B1 (de)
JP (1) JP4873183B2 (de)
DE (1) DE602006011168D1 (de)
WO (1) WO2007015542A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4770319B2 (ja) * 2005-08-04 2011-09-14 日亜化学工業株式会社 蛍光体及び発光装置
US8013517B2 (en) * 2006-12-29 2011-09-06 Lg Innotek Co., Ltd. Phosphor material, coating phosphor composition, and light emitting device
WO2009128468A1 (ja) 2008-04-17 2009-10-22 株式会社東芝 白色発光装置、バックライト、液晶表示装置および照明装置
KR101047775B1 (ko) 2008-09-23 2011-07-07 주식회사 포스포 형광체 및 발광소자
US20110012141A1 (en) * 2009-07-15 2011-01-20 Le Toquin Ronan P Single-color wavelength-converted light emitting devices
KR102259343B1 (ko) 2012-11-07 2021-06-09 더 리전츠 오브 더 유니버시티 오브 캘리포니아 형광체를 펌핑하는 iii-족 질화물계 레이저 다이오드를 채용한 백색 광원
EP2733190B1 (de) * 2012-11-16 2020-01-01 LG Innotek Co., Ltd. Phosphorzusammensetzung und lichtemittierende Vorrichtung damit
CN103254895B (zh) * 2013-05-12 2014-09-24 吉林大学 硅铝酸盐绿色荧光粉及其制备方法
US10283681B2 (en) 2013-09-12 2019-05-07 Cree, Inc. Phosphor-converted light emitting device
LT6215B (lt) * 2013-10-22 2015-08-25 Vilniaus Universitetas Fotobiologiškai draugiškas konversijos fosfore šviestukas
TWI700353B (zh) * 2015-09-24 2020-08-01 晶元光電股份有限公司 螢光材料及其製備方法
CN106811196A (zh) * 2017-01-18 2017-06-09 厦门科煜光电有限公司 一种新型硅磷酸盐化合物发光材料的制备方法
CN106811195A (zh) * 2017-01-18 2017-06-09 厦门科煜光电有限公司 一种新型硅磷酸盐化合物发光材料
CN107488449A (zh) * 2017-06-26 2017-12-19 浙江转喆科技有限公司 下转换转光剂及其制备方法和下转换蓝色转光膜及其制备方法
CN107474353A (zh) * 2017-06-26 2017-12-15 浙江转喆科技有限公司 一种转光膜及其制备方法
US20200251622A1 (en) * 2019-02-06 2020-08-06 Osram Opto Semiconductors Gmbh Conversion Element, Radiation-Emitting Semiconductor Device and Method for Producing a Conversion Element

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5839718A (en) * 1997-07-22 1998-11-24 Usr Optonix Inc. Long persistent phosphorescence phosphor
EP1104799A1 (de) 1999-11-30 2001-06-06 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Rotstrahlendes lumineszentes Material
AT410266B (de) * 2000-12-28 2003-03-25 Tridonic Optoelectronics Gmbh Lichtquelle mit einem lichtemittierenden element
TW595012B (en) * 2001-09-03 2004-06-21 Matsushita Electric Ind Co Ltd Semiconductor light-emitting device, light-emitting apparatus and manufacturing method of semiconductor light-emitting device
JP3756930B2 (ja) 2001-09-03 2006-03-22 松下電器産業株式会社 半導体発光デバイスの製造方法
JP2004115633A (ja) 2002-09-25 2004-04-15 Matsushita Electric Ind Co Ltd 珪酸塩蛍光体およびそれを用いた発光装置
FR2846663B1 (fr) 2002-11-05 2006-08-11 Rhodia Elect & Catalysis Materiau transformant la lumiere, notamment pour parois de serres, comprenant comme additif un silicate de baryum et de magnesium
DE10259949A1 (de) * 2002-12-20 2004-07-01 Robert Bosch Gmbh Piezoaktor
DE10259946A1 (de) 2002-12-20 2004-07-15 Tews, Walter, Dipl.-Chem. Dr.rer.nat.habil. Leuchtstoffe zur Konversion der ultravioletten oder blauen Emission eines lichtemittierenden Elementes in sichtbare weiße Strahlung mit sehr hoher Farbwiedergabe
CN100412156C (zh) 2003-03-28 2008-08-20 韩国化学研究所 硅酸锶基磷光体、其制造方法和使用该磷光体的led
US6982045B2 (en) * 2003-05-17 2006-01-03 Phosphortech Corporation Light emitting device having silicate fluorescent phosphor

Also Published As

Publication number Publication date
EP1911826A4 (de) 2008-08-13
US20100219746A1 (en) 2010-09-02
JPWO2007015542A1 (ja) 2009-02-19
JP4873183B2 (ja) 2012-02-08
US7927512B2 (en) 2011-04-19
WO2007015542A1 (ja) 2007-02-08
EP1911826A1 (de) 2008-04-16
EP1911826B1 (de) 2009-12-16

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