DE602006008850D1 - Abscheidungsmaske - Google Patents

Abscheidungsmaske

Info

Publication number
DE602006008850D1
DE602006008850D1 DE602006008850T DE602006008850T DE602006008850D1 DE 602006008850 D1 DE602006008850 D1 DE 602006008850D1 DE 602006008850 T DE602006008850 T DE 602006008850T DE 602006008850 T DE602006008850 T DE 602006008850T DE 602006008850 D1 DE602006008850 D1 DE 602006008850D1
Authority
DE
Germany
Prior art keywords
reinforcing section
holes
deposition mask
portions
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006008850T
Other languages
English (en)
Inventor
Masanori Tsuruko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brother Industries Ltd
Original Assignee
Brother Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brother Industries Ltd filed Critical Brother Industries Ltd
Publication of DE602006008850D1 publication Critical patent/DE602006008850D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C23F1/04—Chemical milling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Light Receiving Elements (AREA)
  • Optical Head (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE602006008850T 2005-03-30 2006-03-29 Abscheidungsmaske Active DE602006008850D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005099520 2005-03-30

Publications (1)

Publication Number Publication Date
DE602006008850D1 true DE602006008850D1 (de) 2009-10-15

Family

ID=36677219

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006008850T Active DE602006008850D1 (de) 2005-03-30 2006-03-29 Abscheidungsmaske

Country Status (4)

Country Link
US (1) US8088435B2 (de)
EP (1) EP1707648B1 (de)
AT (1) ATE441736T1 (de)
DE (1) DE602006008850D1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111411323A (zh) * 2020-03-31 2020-07-14 云谷（固安）科技有限公司 一种掩膜板

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5205066B2 (ja) * 2008-01-18 2013-06-05 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP6361162B2 (ja) * 2013-04-23 2018-07-25 Ａｇｃ株式会社 両面低反射膜付ガラス基板の製造方法
CN104611668B (zh) * 2015-01-29 2017-03-01 京东方科技集团股份有限公司 用于掩膜板的框架和掩膜板
CN106086782B (zh) * 2016-06-28 2018-10-23 京东方科技集团股份有限公司 一种掩膜版组件及其安装方法、蒸镀装置
US11066742B2 (en) * 2017-09-28 2021-07-20 Sharp Kabushiki Kaisha Vapor deposition mask
US20190317631A1 (en) * 2018-04-12 2019-10-17 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Metal mesh touch display structure and manufacturing method thereof
CN108611600B (zh) * 2018-08-17 2020-04-14 京东方科技集团股份有限公司 掩膜结构
JP2021175824A (ja) * 2020-03-13 2021-11-04 大日本印刷株式会社 有機デバイスの製造装置の蒸着室の評価方法、評価方法で用いられる標準マスク装置及び標準基板、標準マスク装置の製造方法、評価方法で評価された蒸着室を備える有機デバイスの製造装置、評価方法で評価された蒸着室において形成された蒸着層を備える有機デバイス、並びに有機デバイスの製造装置の蒸着室のメンテナンス方法
US11613802B2 (en) 2020-04-17 2023-03-28 Rockwell Collins, Inc. Additively manufactured shadow masks for material deposition control

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4049857A (en) * 1976-07-28 1977-09-20 International Business Machines Corporation Deposition mask and methods of making same
JPS54103552A (en) * 1978-02-01 1979-08-15 Hitachi Electronics Pattern formation method
US5154797A (en) * 1991-08-14 1992-10-13 The United States Of America As Represented By The Secretary Of The Army Silicon shadow mask
JPH10330910A (ja) * 1997-06-04 1998-12-15 Toray Ind Inc シャドーマスクおよびその製造方法
JPH10330911A (ja) * 1997-06-05 1998-12-15 Toray Ind Inc シャドーマスクおよびその製造方法
JP2001254169A (ja) 2000-03-13 2001-09-18 Optonix Seimitsu:Kk 蒸着用金属マスクおよび蒸着用金属マスク製造方法
JP4222035B2 (ja) * 2003-01-20 2009-02-12 セイコーエプソン株式会社 成膜用精密マスク及びその製造方法、エレクトロルミネッセンス表示装置及びその製造方法、電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111411323A (zh) * 2020-03-31 2020-07-14 云谷（固安）科技有限公司 一种掩膜板
CN111411323B (zh) * 2020-03-31 2023-01-20 云谷（固安）科技有限公司 一种掩膜板

Also Published As

Publication number Publication date
US8088435B2 (en) 2012-01-03
ATE441736T1 (de) 2009-09-15
EP1707648A3 (de) 2006-12-06
EP1707648A2 (de) 2006-10-04
EP1707648B1 (de) 2009-09-02
US20060222965A1 (en) 2006-10-05

Similar Documents

Publication Publication Date Title
DE602006008850D1 (de) Abscheidungsmaske
TW200711091A (en) Method for forming a double embossing structure
FR2865731B1 (fr) Procede de fabrication d'un hydrofluoroalcane
FR2890110B1 (fr) Procede d'assemblage d'une turbomachine
TW200604609A (en) Method for manufacturing a master, master, method for manufacturing optical elements and optical element
DE602007012957D1 (de) Schneidevorrichtung
FR2907966B1 (fr) Procede de fabrication d'un substrat.
WO2008091279A3 (en) Etching and hole arrays
FR2869609B1 (fr) Procede de fabrication d'une piece en materiau composite thermostructural
DE602004011691D1 (de) Elektrodenaufhängung zur kompensation der auslenkung aus der substratebene für einen beschleunigungsmesser
WO2007142788A3 (en) Laser ablation resist
ATE499631T1 (de) Plasmaätzverfahren für eine fotomaske unter verwendung einer geschützten maske
EA200600197A1 (ru) Получение производных соединения 1,3-дифенилпроп-2-ен-1-он
WO2009069683A1 (ja) 多層プリント配線板の製造方法
WO2007008992A3 (en) Apparatus and methods for continuously depositing a pattern of material onto a substrate
SE0701728L (sv) Lantbruksmaskin
FR2921002B1 (fr) Procede de depot simultane d'un ensemble de motifs sur un substrat par un macro timbre
ITTO20030730A1 (it) Procedimento per la fabbricazione di strutture tridimensionali complesse su scala sub-micrometrica mediante litografia combinata di due resist.
DE60336208D1 (de) Belichtungsmasken, und methoden zur herstellung von masken
TW200735175A (en) Integrated circuit fabrication
ATE484323T1 (de) Schutzelemente für körperteile
FR2882914B1 (fr) Thermometre electronique formant une tetine
DE602007007711D1 (de) Maschine mit einem Manipulator für Metallbleche
TW200632533A (en) Lithography mask and methods for producing a lithography mask
FR2874187B1 (fr) Procede de fabrication d'une aube de turbomachine par moulage a cire perdue

Legal Events

Date Code Title Description
8364 No opposition during term of opposition