DE602004011691D1 - Elektrodenaufhängung zur kompensation der auslenkung aus der substratebene für einen beschleunigungsmesser - Google Patents

Elektrodenaufhängung zur kompensation der auslenkung aus der substratebene für einen beschleunigungsmesser

Info

Publication number
DE602004011691D1
DE602004011691D1 DE602004011691T DE602004011691T DE602004011691D1 DE 602004011691 D1 DE602004011691 D1 DE 602004011691D1 DE 602004011691 T DE602004011691 T DE 602004011691T DE 602004011691 T DE602004011691 T DE 602004011691T DE 602004011691 D1 DE602004011691 D1 DE 602004011691D1
Authority
DE
Germany
Prior art keywords
accelerating
compensating
knife
removal
electrode mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004011691T
Other languages
English (en)
Other versions
DE602004011691T2 (de
Inventor
Gary J Ballas
Mark H Eskridge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of DE602004011691D1 publication Critical patent/DE602004011691D1/de
Application granted granted Critical
Publication of DE602004011691T2 publication Critical patent/DE602004011691T2/de
Anticipated expiration legal-status Critical
Active legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0062—Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
DE602004011691T 2003-10-29 2004-10-29 Elektrodenaufhängung zur kompensation der auslenkung aus der substratebene für einen beschleunigungsmesser Active DE602004011691T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US696323 2003-10-29
US10/696,323 US6910379B2 (en) 2003-10-29 2003-10-29 Out-of-plane compensation suspension for an accelerometer
PCT/US2004/036244 WO2005043174A1 (en) 2003-10-29 2004-10-29 Out-of-plane compensation suspension for an accelerometer

Publications (2)

Publication Number Publication Date
DE602004011691D1 true DE602004011691D1 (de) 2008-03-20
DE602004011691T2 DE602004011691T2 (de) 2009-01-29

Family

ID=34550101

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004011691T Active DE602004011691T2 (de) 2003-10-29 2004-10-29 Elektrodenaufhängung zur kompensation der auslenkung aus der substratebene für einen beschleunigungsmesser

Country Status (4)

Country Link
US (1) US6910379B2 (de)
EP (1) EP1738181B1 (de)
DE (1) DE602004011691T2 (de)
WO (1) WO2005043174A1 (de)

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WO2005015137A1 (en) * 2003-08-12 2005-02-17 Heung Joon Park Load measuring transducer including elastic structure and gauge using induced voltage, and load measuring system using the same
US7691723B2 (en) * 2005-01-07 2010-04-06 Honeywell International Inc. Bonding system having stress control
US7140250B2 (en) * 2005-02-18 2006-11-28 Honeywell International Inc. MEMS teeter-totter accelerometer having reduced non-linearty
JP4427006B2 (ja) * 2005-05-31 2010-03-03 セイコーエプソン株式会社 アクチュエータおよびその製造方法
US7210352B2 (en) * 2005-06-14 2007-05-01 Innovative Micro Technology MEMS teeter-totter apparatus with curved beam and method of manufacture
US8129801B2 (en) * 2006-01-06 2012-03-06 Honeywell International Inc. Discrete stress isolator attachment structures for MEMS sensor packages
US7257512B1 (en) 2006-04-07 2007-08-14 Honeywell International Inc. Methods and systems for vibropendulous error compensation of acceleration sensors
US7350415B2 (en) 2006-05-25 2008-04-01 Honeywell International Inc. Closed-loop comb drive sensor
JP5631529B2 (ja) * 2007-03-09 2014-11-26 パナソニック株式会社 加速度センサ
JP5073363B2 (ja) * 2007-05-25 2012-11-14 ハネウェル・インターナショナル・インコーポレーテッド 閉鎖ループ櫛型駆動センサ
US7570066B2 (en) * 2007-11-01 2009-08-04 Seagate Technology Llc Simultaneous detection of in-plane and out-of-plane position displacement with capacitive sensors
US8136400B2 (en) * 2007-11-15 2012-03-20 Physical Logic Ag Accelerometer
JP5175308B2 (ja) * 2008-02-07 2013-04-03 アルプス電気株式会社 物理量センサ
WO2010001947A1 (ja) * 2008-07-04 2010-01-07 アルプス電気株式会社 静電容量検出型の可動センサ
US8215169B2 (en) 2009-03-26 2012-07-10 Honeywell International Inc. Using pole pieces to guide magnetic flux through a MEMS device and method of making
US8166818B2 (en) * 2009-03-26 2012-05-01 Honeywell International Inc. Using pole pieces to guide magnetic flux through a MEMS device and method of making
CN102449489B (zh) * 2009-06-03 2014-04-02 阿尔卑斯电气株式会社 物理量传感器
US8418555B2 (en) * 2009-06-26 2013-04-16 Honeywell International Inc. Bidirectional, out-of-plane, comb drive accelerometer
CN101871951B (zh) * 2010-06-07 2011-11-30 瑞声声学科技(深圳)有限公司 微加速度传感器
CN101871952B (zh) * 2010-06-11 2012-07-11 瑞声声学科技(深圳)有限公司 Mems加速度传感器
CN101865934B (zh) * 2010-06-11 2012-01-18 瑞声声学科技(深圳)有限公司 加速度传感器
CN101907637B (zh) * 2010-06-29 2011-11-30 瑞声声学科技(深圳)有限公司 三轴差分加速度计及其制作方法
DE102010042687A1 (de) 2010-10-20 2012-04-26 Robert Bosch Gmbh Mikromechanische Vorrichtung zur Messung einer Beschleunigung, eines Drucks oder dergleichen sowie entsprechendes Verfahren
SG11201403697YA (en) * 2012-01-12 2014-07-30 Murata Electronics Oy Accelerator sensor structure and use thereof
FI126199B (en) * 2013-06-28 2016-08-15 Murata Manufacturing Co CAPACITIVE MICROMECHANICAL SENSOR STRUCTURE AND MICROMECHANICAL ACCELEROMETER
US9261419B2 (en) 2014-01-23 2016-02-16 Honeywell International Inc. Modular load structure assembly having internal strain gaged sensing
JP2019045171A (ja) * 2017-08-30 2019-03-22 セイコーエプソン株式会社 物理量センサー、複合センサー、慣性計測ユニット、携帯型電子機器、電子機器及び移動体
JP2019074433A (ja) * 2017-10-17 2019-05-16 セイコーエプソン株式会社 物理量センサー、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器および移動体
US10421659B2 (en) * 2017-11-13 2019-09-24 Invensense, Inc. MEMS sensor compensation for off-axis movement
CN110308308B (zh) * 2019-06-27 2021-07-13 深迪半导体(绍兴)有限公司 一种带补偿电极的面内平动式加速度计
JP7258796B2 (ja) * 2020-02-21 2023-04-17 株式会社鷺宮製作所 Ｍｅｍｓ素子および振動発電デバイス

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4945765A (en) * 1988-08-31 1990-08-07 Kearfott Guidance & Navigation Corp. Silicon micromachined accelerometer
US5006487A (en) * 1989-07-27 1991-04-09 Honeywell Inc. Method of making an electrostatic silicon accelerometer
DE19637265A1 (de) * 1996-09-13 1998-03-26 Bosch Gmbh Robert Sensor zur kapazitiven Aufnahme einer Beschleunigung
JP3555388B2 (ja) * 1997-06-30 2004-08-18 株式会社デンソー 半導体ヨーレートセンサ
US6257059B1 (en) * 1999-09-24 2001-07-10 The Charles Stark Draper Laboratory, Inc. Microfabricated tuning fork gyroscope and associated three-axis inertial measurement system to sense out-of-plane rotation
JP2002082127A (ja) * 2000-09-07 2002-03-22 Mitsubishi Electric Corp 静電容量型加速度センサ、静電容量型角加速度センサおよび静電アクチュエータ

Also Published As

Publication number Publication date
EP1738181B1 (de) 2008-02-06
EP1738181A1 (de) 2007-01-03
US6910379B2 (en) 2005-06-28
WO2005043174A1 (en) 2005-05-12
US20050092107A1 (en) 2005-05-05
DE602004011691T2 (de) 2009-01-29

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