DE602006005786D1 - Positive strahlungsempfindliche Harzzusammensetzung - Google Patents
Positive strahlungsempfindliche HarzzusammensetzungInfo
- Publication number
- DE602006005786D1 DE602006005786D1 DE602006005786T DE602006005786T DE602006005786D1 DE 602006005786 D1 DE602006005786 D1 DE 602006005786D1 DE 602006005786 T DE602006005786 T DE 602006005786T DE 602006005786 T DE602006005786 T DE 602006005786T DE 602006005786 D1 DE602006005786 D1 DE 602006005786D1
- Authority
- DE
- Germany
- Prior art keywords
- photoacid generator
- excimer laser
- resin composition
- sensitive resin
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005855 radiation Effects 0.000 title abstract 4
- 239000011342 resin composition Substances 0.000 title abstract 3
- 239000002253 acid Substances 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005093385 | 2005-03-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602006005786D1 true DE602006005786D1 (de) | 2009-04-30 |
Family
ID=37070938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602006005786T Active DE602006005786D1 (de) | 2005-03-29 | 2006-03-28 | Positive strahlungsempfindliche Harzzusammensetzung |
Country Status (6)
Country | Link |
---|---|
US (1) | US7488566B2 (de) |
EP (1) | EP1840650B1 (de) |
JP (1) | JP4665810B2 (de) |
AT (1) | ATE426189T1 (de) |
DE (1) | DE602006005786D1 (de) |
IL (1) | IL174569A (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8592130B2 (en) * | 2008-05-30 | 2013-11-26 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed wiring board |
EP2348360B1 (de) * | 2010-01-25 | 2017-09-27 | Rohm and Haas Electronic Materials LLC | Photoresist, der eine stickstoffhaltige Verbindung umfasst |
JP7204343B2 (ja) | 2017-06-06 | 2023-01-16 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
JP7414407B2 (ja) * | 2018-06-13 | 2024-01-16 | 住友化学株式会社 | カルボン酸塩、カルボン酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
JP7285144B2 (ja) * | 2018-06-28 | 2023-06-01 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
JP7475111B2 (ja) * | 2018-11-14 | 2024-04-26 | 東京応化工業株式会社 | レジストパターン形成方法、レジスト組成物及びその製造方法 |
US20200356001A1 (en) * | 2019-05-10 | 2020-11-12 | Rohm And Haas Electronic Materials Llc | Photoresist compositions and methods of forming resist patterns with such compositions |
US11852972B2 (en) | 2020-10-30 | 2023-12-26 | Rohm And Haas Electronic Materials Llc | Photoresist compositions and pattern formation methods |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3215562B2 (ja) | 1993-10-21 | 2001-10-09 | 信越化学工業株式会社 | 溶解阻害剤、その合成方法並びにそれを含有するレジスト材料 |
JP3082892B2 (ja) | 1994-05-23 | 2000-08-28 | 日本電信電話株式会社 | ポジ型レジスト材料 |
JP3661721B2 (ja) * | 1996-10-15 | 2005-06-22 | 信越化学工業株式会社 | 化学増幅ポジ型レジスト材料 |
JP4007569B2 (ja) * | 1999-09-06 | 2007-11-14 | 富士フイルム株式会社 | ポジ型電子線又はx線レジスト組成物 |
JP4910238B2 (ja) * | 2001-03-06 | 2012-04-04 | Jsr株式会社 | 化学増幅型感放射線性樹脂組成物 |
JP3988517B2 (ja) * | 2001-04-27 | 2007-10-10 | Jsr株式会社 | 感放射線性樹脂組成物 |
US6824954B2 (en) * | 2001-08-23 | 2004-11-30 | Jsr Corporation | Sulfonyloxime compound, and radiation sensitive acid generator, positive type radiation sensitive resin composition and negative type radiation sensitive resin composition using same |
JP4192610B2 (ja) * | 2002-11-18 | 2008-12-10 | Jsr株式会社 | 感放射線性樹脂組成物 |
JP3991222B2 (ja) * | 2003-02-13 | 2007-10-17 | 信越化学工業株式会社 | 新規スルホニルジアゾメタン化合物、光酸発生剤、並びにそれを用いたレジスト材料及びパターン形成方法 |
JP4360264B2 (ja) * | 2004-04-30 | 2009-11-11 | Jsr株式会社 | ポジ型感放射線性樹脂組成物 |
JP4544085B2 (ja) * | 2004-09-28 | 2010-09-15 | Jsr株式会社 | ポジ型感放射線性樹脂組成物 |
EP1686424A3 (de) * | 2005-01-27 | 2009-11-04 | JSR Corporation | Strahlungsempfindliche Harzzusammensetzung |
-
2006
- 2006-03-24 JP JP2006082913A patent/JP4665810B2/ja active Active
- 2006-03-27 IL IL174569A patent/IL174569A/en not_active IP Right Cessation
- 2006-03-28 DE DE602006005786T patent/DE602006005786D1/de active Active
- 2006-03-28 EP EP06111812A patent/EP1840650B1/de not_active Not-in-force
- 2006-03-28 AT AT06111812T patent/ATE426189T1/de not_active IP Right Cessation
- 2006-03-29 US US11/391,257 patent/US7488566B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP4665810B2 (ja) | 2011-04-06 |
EP1840650B1 (de) | 2009-03-18 |
US7488566B2 (en) | 2009-02-10 |
IL174569A (en) | 2010-11-30 |
ATE426189T1 (de) | 2009-04-15 |
IL174569A0 (en) | 2006-08-20 |
EP1840650A1 (de) | 2007-10-03 |
US20060223010A1 (en) | 2006-10-05 |
JP2006309186A (ja) | 2006-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |