DE602006000243D1 - Flussigskeitsgekühlter Thermosiphon für elektronische Bauelemente - Google Patents

Flussigskeitsgekühlter Thermosiphon für elektronische Bauelemente

Info

Publication number
DE602006000243D1
DE602006000243D1 DE602006000243T DE602006000243T DE602006000243D1 DE 602006000243 D1 DE602006000243 D1 DE 602006000243D1 DE 602006000243 T DE602006000243 T DE 602006000243T DE 602006000243 T DE602006000243 T DE 602006000243T DE 602006000243 D1 DE602006000243 D1 DE 602006000243D1
Authority
DE
Germany
Prior art keywords
thermosyphon
cooled
liquid
electronic components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006000243T
Other languages
English (en)
Other versions
DE602006000243T2 (de
Inventor
Mohinder S Bhatti
Debashis Ghosh
Ilya Reyzin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delphi Technologies Inc
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Publication of DE602006000243D1 publication Critical patent/DE602006000243D1/de
Application granted granted Critical
Publication of DE602006000243T2 publication Critical patent/DE602006000243T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE602006000243T 2005-01-21 2006-01-04 Flussigskeitsgekühlter Thermosiphon für elektronische Bauelemente Active DE602006000243T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/040,989 US7506682B2 (en) 2005-01-21 2005-01-21 Liquid cooled thermosiphon for electronic components
US40989 2005-01-21

Publications (2)

Publication Number Publication Date
DE602006000243D1 true DE602006000243D1 (de) 2008-01-03
DE602006000243T2 DE602006000243T2 (de) 2008-10-02

Family

ID=36123542

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006000243T Active DE602006000243T2 (de) 2005-01-21 2006-01-04 Flussigskeitsgekühlter Thermosiphon für elektronische Bauelemente

Country Status (3)

Country Link
US (1) US7506682B2 (de)
EP (1) EP1684564B1 (de)
DE (1) DE602006000243T2 (de)

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US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
US20070227701A1 (en) * 2006-03-31 2007-10-04 Bhatti Mohinder S Thermosiphon with flexible boiler plate
US8528628B2 (en) * 2007-02-08 2013-09-10 Olantra Fund X L.L.C. Carbon-based apparatus for cooling of electronic devices
US20090139698A1 (en) * 2007-12-03 2009-06-04 Watronx, Inc. (Aka Onscreen Technologies, Inc.) Carbon-based waterlock with attached heat-exchanger for cooling of electronic devices
US20100002392A1 (en) * 2008-07-07 2010-01-07 I-Ming Liu Assembled Heat Sink Structure
TWI359635B (en) * 2008-08-07 2012-03-01 Inventec Corp Wind-guiding cover
US7796389B2 (en) * 2008-11-26 2010-09-14 General Electric Company Method and apparatus for cooling electronics
CN102042777B (zh) * 2009-10-15 2013-06-05 富准精密工业(深圳)有限公司 平板式热管
CN102062553B (zh) * 2009-11-12 2013-12-04 富准精密工业(深圳)有限公司 平板式热管
JP6216964B2 (ja) * 2011-08-09 2017-10-25 三菱アルミニウム株式会社 冷却器用クラッド材および発熱素子用冷却器
EP2605345B1 (de) * 2011-12-13 2021-04-28 Alcatel Lucent Wärmesteuerung von Photonikanordnungen
EP2645040B1 (de) * 2012-03-28 2017-06-21 ABB Research Ltd. Wärmetauscher für Traktionsstromrichter
US8893513B2 (en) 2012-05-07 2014-11-25 Phononic Device, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
US20140054009A1 (en) * 2012-08-27 2014-02-27 Asustek Computer Inc. Cooling plate and water cooling device having the same
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
NL2014466B1 (en) * 2015-03-16 2017-01-13 Nerdalize B V Module for cooling a heat generating component.
EP3510849B1 (de) * 2017-02-03 2023-08-30 Hewlett-Packard Development Company, L.P. Thermische steuerung mit dampf- und isolierungskammern
DE102017215952B3 (de) 2017-09-11 2019-02-07 F & S Prozessautomation GmbH Kühlkörper mit zwei Hohlkörpern und Kühlanordnung
US11435144B2 (en) * 2019-08-05 2022-09-06 Asia Vital Components (China) Co., Ltd. Heat dissipation device
JP7305512B2 (ja) * 2019-10-17 2023-07-10 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
US11259447B2 (en) * 2019-12-27 2022-02-22 Baidu Usa Llc Composite liquid cooling device
CN111352490B (zh) * 2020-02-29 2021-04-27 苏州浪潮智能科技有限公司 一种中部喷射可调节回液槽服务器液体冷却装置
US20230363113A1 (en) * 2020-07-15 2023-11-09 Telefonaktiebolaget Lm Ericsson (Publ) Heat sink with bulk heat isolation
CN112888267B (zh) * 2021-02-05 2022-09-20 华南理工大学 一种超薄柔性均热板及制造方法
CN113242680A (zh) 2021-05-28 2021-08-10 惠州汉旭五金塑胶科技有限公司 一种提高散热效果的液冷散热器
TWI786674B (zh) * 2021-06-09 2022-12-11 英業達股份有限公司 電子裝置及散熱組件

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US3511310A (en) * 1968-04-15 1970-05-12 Varian Associates Integral vapor cooling system
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US4381032A (en) * 1981-04-23 1983-04-26 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
JPS60125203A (ja) * 1983-12-13 1985-07-04 Nitto Electric Ind Co Ltd サ−モパ−ペ−パレ−シヨン装置
KR900001393B1 (en) * 1985-04-30 1990-03-09 Fujitsu Ltd Evaporation cooling module for semiconductor device
US4884630A (en) * 1988-07-14 1989-12-05 Microelectronics And Computer Technology Corporation End fed liquid heat exchanger for an electronic component
DE4121534C2 (de) * 1990-06-30 1998-10-08 Toshiba Kawasaki Kk Kühlvorrichtung
JP2724033B2 (ja) * 1990-07-11 1998-03-09 株式会社日立製作所 半導体モジユール
DE69209042T2 (de) * 1991-12-16 1996-10-02 At & T Corp Wärmeabfuhr durch engkanälige Kühlrippen um elektronisches Hochleistungskomponenten zu kühlen
US5168921A (en) * 1991-12-23 1992-12-08 Thermacore, Inc. Cooling plate with internal expandable heat pipe
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
US6062302A (en) * 1997-09-30 2000-05-16 Lucent Technologies Inc. Composite heat sink
US6410982B1 (en) * 1999-11-12 2002-06-25 Intel Corporation Heatpipesink having integrated heat pipe and heat sink
US6808015B2 (en) * 2000-03-24 2004-10-26 Denso Corporation Boiling cooler for cooling heating element by heat transfer with boiling
US6422307B1 (en) * 2001-07-18 2002-07-23 Delphi Technologies, Inc. Ultra high fin density heat sink for electronics cooling
JP2003060371A (ja) * 2001-08-16 2003-02-28 Nec Corp 通信機器筐体の放熱構造
US6588498B1 (en) 2002-07-18 2003-07-08 Delphi Technologies, Inc. Thermosiphon for electronics cooling with high performance boiling and condensing surfaces
US6840311B2 (en) 2003-02-25 2005-01-11 Delphi Technologies, Inc. Compact thermosiphon for dissipating heat generated by electronic components

Also Published As

Publication number Publication date
EP1684564A1 (de) 2006-07-26
US20060162904A1 (en) 2006-07-27
US7506682B2 (en) 2009-03-24
EP1684564B1 (de) 2007-11-21
DE602006000243T2 (de) 2008-10-02

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