DE602005025726D1 - Bildsensorpixel mit einer Photodiode mit einer Indium-Bor-Pinning-Schicht und Methode zu seiner Herstellung - Google Patents

Bildsensorpixel mit einer Photodiode mit einer Indium-Bor-Pinning-Schicht und Methode zu seiner Herstellung

Info

Publication number
DE602005025726D1
DE602005025726D1 DE602005025726T DE602005025726T DE602005025726D1 DE 602005025726 D1 DE602005025726 D1 DE 602005025726D1 DE 602005025726 T DE602005025726 T DE 602005025726T DE 602005025726 T DE602005025726 T DE 602005025726T DE 602005025726 D1 DE602005025726 D1 DE 602005025726D1
Authority
DE
Germany
Prior art keywords
photodiode
pinning layer
production
image sensor
indium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005025726T
Other languages
English (en)
Inventor
Howard E Rhodes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omnivision Technologies Inc
Original Assignee
Omnivision Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omnivision Technologies Inc filed Critical Omnivision Technologies Inc
Publication of DE602005025726D1 publication Critical patent/DE602005025726D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14689—MOS based technologies
DE602005025726T 2004-12-03 2005-11-17 Bildsensorpixel mit einer Photodiode mit einer Indium-Bor-Pinning-Schicht und Methode zu seiner Herstellung Active DE602005025726D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/004,246 US7432543B2 (en) 2004-12-03 2004-12-03 Image sensor pixel having photodiode with indium pinning layer

Publications (1)

Publication Number Publication Date
DE602005025726D1 true DE602005025726D1 (de) 2011-02-17

Family

ID=35912025

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005025726T Active DE602005025726D1 (de) 2004-12-03 2005-11-17 Bildsensorpixel mit einer Photodiode mit einer Indium-Bor-Pinning-Schicht und Methode zu seiner Herstellung

Country Status (6)

Country Link
US (2) US7432543B2 (de)
EP (1) EP1667232B1 (de)
CN (1) CN1841791B (de)
AT (1) ATE494635T1 (de)
DE (1) DE602005025726D1 (de)
TW (1) TWI295108B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7755116B2 (en) * 2004-12-30 2010-07-13 Ess Technology, Inc. Method and apparatus for controlling charge transfer in CMOS sensors with an implant by the transfer gate
US7666703B2 (en) * 2005-01-14 2010-02-23 Omnivision Technologies, Inc. Image sensor pixel having a lateral doping profile formed with indium doping
US7115924B1 (en) * 2005-06-03 2006-10-03 Avago Technologies Sensor Ip Pte. Ltd. Pixel with asymmetric transfer gate channel doping
KR100672688B1 (ko) * 2005-06-07 2007-01-22 동부일렉트로닉스 주식회사 씨모스 이미지 센서의 제조방법
US7470945B2 (en) * 2006-12-01 2008-12-30 United Microelectronics Corp. CMOS image sensor and an additional N-well for connecting a floating node to a source follower transistor
US7741666B2 (en) * 2008-02-08 2010-06-22 Omnivision Technologies, Inc. Backside illuminated imaging sensor with backside P+ doped layer
FR2986906B1 (fr) 2012-02-15 2015-06-19 New Imaging Technologies Sas Structure de pixel actif a transfert de charge ameliore
US9859318B2 (en) 2014-10-22 2018-01-02 Omnivision Technologies, Inc. Color and infrared image sensor with depletion adjustment layer
CN110085705A (zh) * 2019-04-30 2019-08-02 德淮半导体有限公司 半导体器件的形成方法
WO2023190406A1 (ja) * 2022-03-29 2023-10-05 ラピスセミコンダクタ株式会社 半導体装置、固体撮像装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625210A (en) * 1995-04-13 1997-04-29 Eastman Kodak Company Active pixel sensor integrated with a pinned photodiode
US6306676B1 (en) * 1996-04-04 2001-10-23 Eastman Kodak Company Method of making self-aligned, high-enegry implanted photodiode for solid-state image sensors
US6127697A (en) * 1997-11-14 2000-10-03 Eastman Kodak Company CMOS image sensor
CN1219328C (zh) * 1998-02-19 2005-09-14 国际商业机器公司 具有改善了注入剂的场效应晶体管及其制造方法
US6218691B1 (en) * 1998-06-30 2001-04-17 Hyundai Electronics Industries Co., Ltd. Image sensor with improved dynamic range by applying negative voltage to unit pixel
US20030096490A1 (en) * 2001-11-16 2003-05-22 John Borland Method of forming ultra shallow junctions
FR2833408B1 (fr) * 2001-12-12 2004-03-12 St Microelectronics Sa Procede de controle du sur eclairement d'une photodiode et circuit integre correspondant
US6744084B2 (en) * 2002-08-29 2004-06-01 Micro Technology, Inc. Two-transistor pixel with buried reset channel and method of formation
US6730899B1 (en) * 2003-01-10 2004-05-04 Eastman Kodak Company Reduced dark current for CMOS image sensors
US7078745B2 (en) * 2003-03-05 2006-07-18 Micron Technology, Inc. CMOS imager with enhanced transfer of charge and low voltage operation
US6921934B2 (en) * 2003-03-28 2005-07-26 Micron Technology, Inc. Double pinned photodiode for CMOS APS and method of formation
JP2004335588A (ja) * 2003-05-01 2004-11-25 Renesas Technology Corp 固体撮像装置及びその製造方法
US7105793B2 (en) 2003-07-02 2006-09-12 Micron Technology, Inc. CMOS pixels for ALC and CDS and methods of forming the same
US6900484B2 (en) 2003-07-30 2005-05-31 Micron Technology, Inc. Angled pinned photodiode for high quantum efficiency
US7115923B2 (en) 2003-08-22 2006-10-03 Micron Technology, Inc. Imaging with gate controlled charge storage
US7105906B1 (en) * 2003-11-19 2006-09-12 National Semiconductor Corporation Photodiode that reduces the effects of surface recombination sites

Also Published As

Publication number Publication date
TWI295108B (en) 2008-03-21
EP1667232B1 (de) 2011-01-05
US7432543B2 (en) 2008-10-07
US20080318358A1 (en) 2008-12-25
CN1841791B (zh) 2011-08-31
TW200620646A (en) 2006-06-16
EP1667232A2 (de) 2006-06-07
EP1667232A3 (de) 2007-06-20
US20060118836A1 (en) 2006-06-08
CN1841791A (zh) 2006-10-04
ATE494635T1 (de) 2011-01-15

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